公开(公告)号：US20200381136A1

公开(公告)日：2020-12-03

申请号：US16634002

申请日：2018-07-24

Applicant: SENJU METAL INDUSTRY CO., LTD. ,  OSAKA UNIVERSITY

Inventor： Jinting JIU ,  Minoru UESHIMA ,  Katsuaki SUGANUMA ,  Wanli LI

IPC: H01B1/02 ,  C22C9/00 ,  C22C5/08 ,  C22C1/00 ,  C23C18/08 ,  C23C18/14 ,  C09D11/52 ,  C09D11/037

Abstract: A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 μm or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 μm or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.

公开(公告)号：US20210366627A1

公开(公告)日：2021-11-25

申请号：US17397500

申请日：2021-08-09

Applicant: SENJU METAL INDUSTRY CO., LTD. ,  OSAKA UNIVERSITY

Inventor： Jinting JIU ,  Minoru UESHIMA ,  Katsuaki SUGANUMA ,  Wanli LI

IPC: H01B1/02 ,  C23C18/14 ,  C09D11/037 ,  C09D11/52 ,  C22C1/00 ,  C22C5/08 ,  C22C9/00 ,  C23C18/08

Abstract: A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 μm or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 μm or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.

公开(公告)号：US20140029224A1

公开(公告)日：2014-01-30

申请号：US13953682

申请日：2013-07-29

Applicant: SENJU METAL INDUSTRY CO., LTD. ,  OSAKA UNIVERSITY

Inventor： Kozo FUJIMOTO ,  Shinji FUKUMOTO ,  Michiya MATSUSHIMA ,  Satoshi WATANABE ,  Takeshi KAN ,  Minoru UESHIMA ,  Takeshi SAKAMOTO ,  Shu INOUE

IPC: H05K3/34 ,  H05K1/18

CPC classification number: H05K3/341 ,  H05K1/181 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2203/0405 ,  Y02P70/613 ,  Y10T29/49144

Abstract: An method of mounting electronic component includes: providing a connecting layer between a wiring and an electronic component, the connecting layer including a conductive layer formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent and one or two layers of a thermoplastic resin layer formed of thermoplastic resin; and electrically connecting the electronic component to the wiring through the connecting layer.

Abstract translation: 安装电子部件的方法包括：在布线和电子部件之间设置连接层，所述连接层包括由含有热固性树脂，焊料粉末和还原剂的含焊料粉末的树脂组合物形成的导电层，以及一个或多个 两层由热塑性树脂形成的热塑性树脂层; 并通过连接层将电子部件电连接到布线。

公开(公告)号：US20190393188A1

公开(公告)日：2019-12-26

申请号：US16327124

申请日：2017-08-17

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Tetsu TAKEMASA ,  Minoru UESHIMA

IPC: H01L23/00 ,  B22F7/06

Abstract: A metal sintered bonding body bonds a substrate and a die. In the metal sintered bonding body, at least a center part and corner part of a rectangular region where the metal sintered bonding body faces the die have a low-porosity region whose porosity is lower than an average porosity of the rectangular region. The low-porosity region is located within a strip-shaped region whose central lines are diagonal lines of the rectangular region.

公开(公告)号：US20200284282A1

公开(公告)日：2020-09-10

申请号：US16759625

申请日：2018-10-30

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Minoru UESHIMA ,  Yoshie TACHIBANA

IPC: F16B5/08 ,  B23K1/00

Abstract: A solder joint in which an electronic component with a back metal is bonded to a substrate by a solder alloy. The solder alloy includes: a solder alloy layer having an alloy composition consisting of, in mass %: Ag: 2 to 4%, Cu: 0.6 to 2%, Sb: 9.0 to 12%, Ni: 0.005 to 1%, optionally Co: 0.2% or less and Fe: 0.1% or less, with the balance being Sn; an Sn—Sb intermetallic compound phase; a back metal-side intermetallic compound layer formed at an interface between the back metal and the solder alloy; and a substrate-side intermetallic compound layer formed at an interface between the substrate and the solder alloy. The solder alloy layer exists at least one of between the Sn—Sb intermetallic compound phase and the back metal-side intermetallic compound layer, and between the Sn—Sb intermetallic compound phase and the substrate-side intermetallic compound layer.

公开(公告)号：US20170014955A1

公开(公告)日：2017-01-19

申请号：US15300929

申请日：2015-04-02

Applicant: SENJU METAL INDUSTRY Co., LTD.

Inventor： Minoru UESHIMA ,  Takeshi SAKAMOTO ,  Rei FUJIMAKI

IPC: B23K35/26 ,  H01L33/62 ,  H01L33/52 ,  C22C13/02

CPC classification number: B23K35/262 ,  B23K35/26 ,  C22C9/00 ,  C22C13/02 ,  C22C21/00 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/16225

Abstract: Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface, is comprised of a ceramic. The solder alloy has an alloy composition comprising, in terms of mass %, 3-10% of Sb, 0-40 of Ag and 0.3-1.2% of Cu, with the remainder consisting of Sn. Furthermore, the alloy composition may contain, in terms of mass %, a total of 0.15% or less of one or more elements selected from among Ni and Co and/or a total of 0.02% or less of one or more elements selected from among P and Ge.

Abstract translation: 提供了一种焊料合金，其具有适合于焊接通过将铝基板接合到其上的部件的组件的组合物，其中侧表面上的电极的面积不大于侧面的总面积的30％ 侧表面由陶瓷组成。 焊料合金具有以质量％计含有3-10％的Sb，0-40的Ag和0.3-1.2％的Cu，其余由Sn组成的合金组成。 此外，合金组成可以以质量％计含有选自Ni和Co中的一种或多种元素的总量为0.15％以下和/或总共0.02％以下的一种或多种选自以下的元素： P和Ge。

公开(公告)号：US20150262926A1

公开(公告)日：2015-09-17

申请号：US14724665

申请日：2015-05-28

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Minoru UESHIMA ,  Minoru TOYODA

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49582 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/08501 ,  H01L2224/29026 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29447 ,  H01L2224/32245 ,  H01L2224/32501 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K3/3421 ,  H05K3/3463 ,  H05K2203/047 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/32145 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: The melting of die-bonding solder material is prevented even when soldering a surface-mount component formed using the die-bonding solder material on a printed circuit board using a mounting solder material. The surface-mount component formed using (Sn—Sb)-based solder material having high melting point as the solder material for die pad, the (Sn—Sb)-based solder material containing Cu not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn—Ag—Cu—Bi)-based solder material as the mounting solder material with the solder material being applied on the terminal portion. The melting of die-bonding solder material is prevented even at the heating temperature (240 degrees C. or less) of a reflow furnace.

Abstract translation: 即使使用安装焊料将使用芯片焊接焊料形成的表面安装部件焊接在印刷电路板上也可防止芯片焊接焊料的熔化。 使用具有高熔点的（Sn-Sb）基焊料作为芯片焊盘用焊料形成的表面安装部件，（Sn-Sb）系焊料，含有不超过规定量Cu成分的Cu， 其主要成分为Sn，使用（Sn-Ag-Cu-Bi）基焊料作为安装焊料材料焊接在电路板的基板端子部分上，焊料材料被施加在端子部分上。 即使在回流炉的加热温度（240℃以下）下也能够防止芯片焊接材料的熔融。