公开(公告)号：US20240234644A1

公开(公告)日：2024-07-11

申请号：US18615603

申请日：2024-03-25

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Yuriy BILENKO ,  Ki Yon PARK

IPC: H01L33/48 ,  H01L33/58

CPC classification number: H01L33/483 ,  H01L33/58 ,  H01L2933/0033

Abstract: A light emitting diode package includes a main frame including a base frame and a middle frame disposed on the base frame, a holding frame disposed on the middle frame, a light emitting diode chip disposed on the base frame, and a window secured by the main frame and the holding frame. The middle frame includes a middle frame open portion exposing the light emitting diode chip. The holding frame includes a holding frame open portion at least partially overlapping with the middle frame open portion on a plane. The holding frame open portion has an area decreasing in a direction away from the main frame.

公开(公告)号：US20210050483A1

公开(公告)日：2021-02-18

申请号：US17086734

申请日：2020-11-02

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Yuriy BILENKO ,  Ki Yon PARK

IPC: H01L33/44 ,  H01L33/62 ,  H01L33/60 ,  H01L33/48 ,  H01L33/54 ,  H01L33/56

Abstract: A light emitting element package includes a substrate provided with an interconnect portion, a light emitting element mounted on the substrate and connected to the interconnect portion, and a cover member contacting an upper surface of the light emitting element while covering the light emitting element. The cover member comprises Teflon-based organic polymers and has a light transmittance of 85% or more in an ultraviolet wavelength range.

公开(公告)号：US20210098654A1

公开(公告)日：2021-04-01

申请号：US17119136

申请日：2020-12-11

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Yuriy BILENKO ,  Ki Yon PARK

IPC: H01L33/48 ,  H01L25/13

Abstract: A light emitting diode package includes a main frame including a base frame and a middle frame disposed on the base frame, a holding frame disposed on the middle frame, a light emitting diode chip disposed on the base frame, and a window secured by the main frame and the holding frame. The middle frame includes a middle frame open portion exposing the light emitting diode chip. The holding frame includes a holding frame open portion at least partially overlapping with the middle frame open portion on a plane. The holding frame open portion has an area decreasing in a direction away from the main frame.

公开(公告)号：US20210091278A1

公开(公告)日：2021-03-25

申请号：US17113448

申请日：2020-12-07

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Yuriy BILENKO ,  Ki Yon PARK

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/58

Abstract: A light-emitting device package includes a substrate having a mounting region in which a light-emitting device chip is mounted. The light-emitting device package further includes a reflector and a cover enclosing the reflector. The reflector is disposed around the light-emitting device chip and having an opening through which the mounting region of the substrate is exposed. The reflector has elasticity to allow variation of a diameter thereof.

公开(公告)号：US20240234641A1

公开(公告)日：2024-07-11

申请号：US18615720

申请日：2024-03-25

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Yuriy BILENKO ,  Ki Yon PARK

IPC: H01L33/44 ,  H01L33/32 ,  H01L33/48 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/44 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/32

Abstract: A light emitting element package includes a substrate provided with an interconnect portion, a light emitting element mounted on the substrate and connected to the interconnect portion, and a cover member contacting an upper surface of the light emitting element while covering the light emitting element. The cover member comprises Teflon-based organic polymers and has a light transmittance of 85% or more in an ultraviolet wavelength range.

公开(公告)号：US20210206664A1

公开(公告)日：2021-07-08

申请号：US17208983

申请日：2021-03-22

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Yuriy BILENKO ,  Ki Yon PARK ,  Shi Hyun AHN

IPC: C02F1/32 ,  A61L2/10 ,  A61L2/08

Abstract: A sterilization apparatus includes a light source unit for emitting light to a sterilization region for sterilizing a target particle, a power supply unit for supplying power to the light source unit, and a photodiode unit for sensing the light from the light source unit. The photodiode unit is driven by the light from the light source unit.