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公开(公告)号：US20230202126A1
公开(公告)日：2023-06-29
申请号：US17980053
申请日：2022-11-03
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Wei LIANG , Songgang CHAI , Qianfa LIU , Liangpeng HAO
Abstract: Provided are a low dielectric loss non-woven fabric, a preparation method thereof and use thereof. The low dielectric loss non-woven fabric is composed of an inorganic fiber and a binder, and the binder is any one or a combination of at least two of a fluorine-containing resin emulsion, a polyolefin emulsion, a polyphenylene ether resin or a cyanate ester resin. The non-woven fabric of the present application has good dielectric properties and obvious strengthening effect, and can meet various performance requirements for copper clad laminate materials in the field of high-frequency communication.
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公开(公告)号：US20230192972A1
公开(公告)日：2023-06-22
申请号：US17766440
申请日：2020-12-17
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Songgang CHAI , Qianfa LIU , Liangpeng HAO , Wei LIANG
CPC classification number: C08J5/18 , C08L27/18 , C08K7/18 , C08K9/06 , H05K1/0373 , C08L2201/52 , C08L2203/16 , C08L2203/20 , C08L2205/025 , C08L2205/03 , C08J2327/18 , C08J2471/02 , C08J2427/18 , C08K2201/005 , H05K2201/0209
Abstract: The present invention relates to a fluorine-containing resin composition, and a resin vanish, a fluorine-containing dielectric sheet, a laminate, a copper clad laminate and a printed circuit board containing the same. The fluorine-containing resin composition comprises 30 wt. %-70 wt. % of a fluorine-containing polymer, 30 wt. %-70 wt. % of an inorganic filler which includes the following particle size distribution: D10 is greater than 1.5 μm; and D50 is 10-15 μm. In the present invention, the selection of an inorganic filler with a specific particle size distribution can ensure that the boards prepared by the fluorine-containing resin composition have excellent dielectric properties and voltage resistance performance, even if the inorganic filler is added in a large amount.
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