公开(公告)号：US20220210914A1

公开(公告)日：2022-06-30

申请号：US17605820

申请日：2020-01-14

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbing CHEN ,  Xianping ZENG ,  Yongjing XU ,  Yongming ZHU

IPC: H05K1/03 ,  H05K1/09 ,  B32B5/02 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  C08L9/00 ,  C08L9/06 ,  C08L51/08

Abstract: A copper clad laminate and a printed-circuit board. The copper clad laminate comprises a dielectric substrate layer and a copper foil layer. The copper foil layer is located on at least one surface of the dielectric substrate layer, wherein the copper foil layer comprises an iron element in a weight content of less than 10 ppm, a nickel element in a weight content of less than 10 ppm, a cobalt element in a weight content of less than 10 ppm, and a molybdenum element in a weight content of 10 ppm. The copper clad laminate has a passive intermodulation PIM of less than −158 dBc (700 MHz/2600 MHz).

公开(公告)号：US20170238417A1

公开(公告)日：2017-08-17

申请号：US15316380

申请日：2015-12-07

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Shanyin YAN ,  Yongjing XU ,  Zhongqiang YANG ,  Yongming ZHU

IPC: H05K1/03 ,  C09D171/12 ,  D06M15/53 ,  H05K3/38 ,  D06M23/10 ,  D06M11/46 ,  D06M11/45 ,  D06M11/44 ,  C09D109/00 ,  D06M15/233

CPC classification number: H05K1/0306 ,  C03C25/1095 ,  C03C25/47 ,  C08K3/22 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/2241 ,  C09D109/00 ,  C09D171/12 ,  D06M11/44 ,  D06M11/45 ,  D06M11/46 ,  D06M15/233 ,  D06M15/53 ,  D06M23/10 ,  D06M2101/00 ,  H05K1/024 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/381

Abstract: The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.