公开(公告)号：US20210403659A1

公开(公告)日：2021-12-30

申请号：US17287911

申请日：2018-12-25

Applicant: Shengyi Technology Co., Ltd.

Inventor： Yundong MENG ,  Kehong FANG

IPC: C08J5/24 ,  C08L9/06 ,  C08L71/12 ,  C08L83/16 ,  C08L9/00 ,  H05K1/03 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20

Abstract: Provided is a resin composition, a prepreg for a printed circuit and a metal-coated laminate. The resin composition includes: a silicone aryne resin, a polyphenylene ether resin with unsaturated bonds, and a butadiene polymer. The resin composition is used such that the prepared metal-coated laminate can have at least one of the following characteristics: a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion.

公开(公告)号：US20240110027A1

公开(公告)日：2024-04-04

申请号：US18270290

申请日：2021-03-19

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Cheng LUO ,  Yundong MENG ,  Shanyin YAN

IPC: C08J5/24 ,  C08K5/00 ,  C08L33/04 ,  C08L47/00 ,  C08L53/02 ,  C08L71/12 ,  H05K1/03

CPC classification number: C08J5/244 ,  C08J5/249 ,  C08K5/0066 ,  C08L33/04 ,  C08L47/00 ,  C08L53/02 ,  C08L71/126 ,  H05K1/0366 ,  C08J2309/06 ,  C08J2315/00 ,  C08J2333/04 ,  C08J2353/02 ,  C08J2371/12 ,  C08K2201/005 ,  C08K2201/011 ,  C08L2203/30 ,  C08L2205/035 ,  C08L2312/02

Abstract: The present invention relates to a thermosetting resin composition and application thereof, said thermosetting resin composition comprising: A: a styrene-butadiene-styrene triblock copolymer having a star-shaped structure; B: a linear olefin resin containing 1,2-ethylene, and a modifier thereof, C: at least one resin or small molecule compound substituted with an acrylic group; taking the total mass of component A, component B, and component C as 100%, the added amount of said component A is 3%-85%, the added amount of said component B is 10%-95%, and the added amount of said component C is 1%-70%. The resin composition provided by the present invention does not undergo phase separation under initiator conditions, and has high heat resistance and a relatively low dielectric constant and dielectric loss tangent value, and is capable of providing the desired dielectric properties and thermal reliability of a copper-clad plate.

公开(公告)号：US20190300649A1

公开(公告)日：2019-10-03

申请号：US16468534

申请日：2017-05-15

Applicant: Shengyi Technology Co., Ltd.

Inventor： Yundong MENG ,  Kehong FANG ,  Ying XU

IPC: C08G65/48 ,  C08L25/06 ,  C08L63/00 ,  C08L69/00 ,  C08L71/12 ,  C08L79/04 ,  C08K3/013 ,  C08K3/22

Abstract: The present invention relates to a flame-retardant polyphenylene ether resin composition, comprising, by weight percent: (A) 10-45% of a phosphorus-containing polyphenylene ether resin with a number-average molecular weight of 1000-6000; (B) 10-50% of an epoxy resin composition; (C) 10-50% of a cyanate ester resin; and (D) 10-30% of a soluble halogen flame retardant. The present invention adopts a phosphorus-containing polyphenylene ether resin with a low molecular weight that, when used in combination with an epoxy resin, a cyanate ester, and the like, improves the compatibility of the system and reduces a phase separation area of the system, and increases the adhesive force of a plate and enhances the toughness of the plate. The present invention adopts a soluble halogen flame retardant to further enhance the homogeneity of the resin system, and provides better uniformity, increased adhesion, and a lower dielectric constant and dielectric loss of the plate.