SUBSTRATE PROCESSING APPARATUS
    1.
    发明申请

    公开(公告)号:US20220080468A1

    公开(公告)日:2022-03-17

    申请号:US17469876

    申请日:2021-09-09

    摘要: A substrate processing apparatus according to an embodiment of the present disclosure includes a stage having a substantially disc-shaped form and including a hole in a center thereof; a roller that contacts a side surface of the stage and rotates the stage; a first liquid nozzle that supplies a first liquid to a first surface of the substrate; a first driver that moves a position of the first liquid nozzle; a second liquid nozzle that supplies a second liquid from the hole of the stage to a second surface of the substrate; a second driver that moves a position of the second liquid nozzle; a cooling nozzle that supplies a cooling gas from the hole of the stage to the second surface; a third driver that moves a position of the cooling nozzle; and a controller that controls the first driver, the second driver, and the third driver.

    SUBSTRATE TREATMENT DEVICE
    2.
    发明申请

    公开(公告)号:US20210299713A1

    公开(公告)日:2021-09-30

    申请号:US17195924

    申请日:2021-03-09

    IPC分类号: B08B7/00 B08B3/10

    摘要: According to one embodiment, q substrate treatment device includes a placement stand, a plurality of support portions, a cooling part, a liquid supplier, and at least one protrusion. The placement stand has a plate shape, and is configured to rotate. The support portions are provided on one surface of the placement stand and configured to support a substrate. The cooling part is configured to supply a cooling gas into a space between the placement stand and a back surface of the substrate supported by the support portions. The liquid supplier is configured to supply a liquid onto a surface of the substrate. At least one protrusion is provided on the one surface of the placement stand and extends along a boundary line of a region where the substrate is provided in a plan view.

    SUBSTRATE TREATMENT DEVICE
    3.
    发明申请

    公开(公告)号:US20210323036A1

    公开(公告)日:2021-10-21

    申请号:US17230152

    申请日:2021-04-14

    摘要: According to one embodiment, a substrate treatment device includes a placement stand configured to rotate the substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a first liquid supplier configured to supply a first liquid on a surface of the substrate, a second liquid supplier configured to supply a second liquid on the surface, and a controller controlling rotation of the substrate, supply of the cooling gas, the first and second liquids. The controller performs a preliminary process of supplying the second liquid on the surface, and supplying the cooling gas into the space, a liquid film forming process by supplying the first liquid toward the surface after the preliminary process, a supercooling process of the liquid film on the surface, and a freezing process of at least a part of the liquid film on the surface.

    SUBSTRATE TREATMENT DEVICE
    4.
    发明申请

    公开(公告)号:US20210265159A1

    公开(公告)日:2021-08-26

    申请号:US17181264

    申请日:2021-02-22

    IPC分类号: H01L21/02 B08B7/00

    摘要: According to one embodiment, a substrate treatment device includes a placement stand configured to rotate a substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a liquid supplier configured to supply a liquid on a surface of the substrate opposite to the placement stand, and a controller controlling a rotation speed of the substrate, a flow rate of the cooling gas, or a supply amount of the liquid. The controller sets the liquid on the surface of the substrate to be in a supercooled state, forms a frozen film by freezing the liquid in the super cooled state, and causes crack to generate in the frozen film by decreasing a temperature of the frozen film.

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

    公开(公告)号:US20220068671A1

    公开(公告)日:2022-03-03

    申请号:US17460566

    申请日:2021-08-30

    IPC分类号: H01L21/67 H01L21/687

    摘要: A substrate processing apparatus according to an embodiment of the present disclosure includes: a stage; a plurality of holders configured to hold a substrate; a liquid supply configured to supply a liquid to a surface of the substrate opposite to the stage; a cooler configured to supply a cooling gas to a space between the stage and the substrate; a mover configured to change a distance between the stage and the substrate; and a controller configured to control the cooler and the mover. The controller performs a cooling process that at least includes a supercooling process and a freezing process (solid-liquid phase), and a thawing process after the cooling process. In the cooling process, the controller controls the mover to set the distance to a first distance, and in the thawing process, the controller controls the mover to set the distance to a second distance longer than the first distance.

    SUBSTRATE TREATMENT DEVICE
    7.
    发明申请

    公开(公告)号:US20210276055A1

    公开(公告)日:2021-09-09

    申请号:US17181227

    申请日:2021-02-22

    摘要: According to one embodiment, a substrate treatment device includes a placement stand configured to rotate a substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a liquid supplier configured to supply a liquid on a surface of the substrate opposite to the placement stand side, a detector configured to detect a state of the liquid on the surface of the substrate, and a controller controlling at least one of a rotation speed of the substrate, a flow rate of the cooling gas, or a supply amount of the liquid. The controller sets the liquid on the surface of the substrate to be in a supercooled state, obtains a temperature of the liquid in the supercooled state at a start of freezing, and is configured to calculate a removal ratio of a contamination.