公开(公告)号：US20220068671A1

公开(公告)日：2022-03-03

申请号：US17460566

申请日：2021-08-30

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Kensuke DEMURA ,  Daisuke MATSUSHIMA ,  Masaya KAMIYA

IPC: H01L21/67 ,  H01L21/687

Abstract: A substrate processing apparatus according to an embodiment of the present disclosure includes: a stage; a plurality of holders configured to hold a substrate; a liquid supply configured to supply a liquid to a surface of the substrate opposite to the stage; a cooler configured to supply a cooling gas to a space between the stage and the substrate; a mover configured to change a distance between the stage and the substrate; and a controller configured to control the cooler and the mover. The controller performs a cooling process that at least includes a supercooling process and a freezing process (solid-liquid phase), and a thawing process after the cooling process. In the cooling process, the controller controls the mover to set the distance to a first distance, and in the thawing process, the controller controls the mover to set the distance to a second distance longer than the first distance.

公开(公告)号：US20250108411A1

公开(公告)日：2025-04-03

申请号：US18895864

申请日：2024-09-25

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Satoshi NAKAMURA ,  Kensuke DEMURA ,  Masaya KAMIYA

IPC: B08B3/12 ,  B08B7/00

Abstract: According to one embodiment a substrate treatment apparatus removes foreign matter from a surface of a substrate by forming a frozen film at the surface of the substrate, incorporating, into the frozen film, the foreign matter adhered to the surface of the substrate, and thawing the frozen film including the foreign matter. A liquid supply part that supplies a liquid to the frozen film including the foreign matter, a vibrating part that faces the frozen film, and a controller that controls the vibrating part are included. The controller controls the vibrating part to transmit a vibration to a liquid film, which includes the liquid supplied to the frozen film and a liquid generated by the thawing of the frozen film, and to reduce an energy of the vibration transmitted to the liquid film or stop the vibration according to a position of an upper surface of the frozen film under the liquid film.

公开(公告)号：US20220270914A1

公开(公告)日：2022-08-25

申请号：US17665657

申请日：2022-02-07

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Masaya KAMIYA ,  Kensuke DEMURA

IPC: H01L21/687 ,  H01L21/67

Abstract: A substrate treatment device according to an embodiment includes a placement part that includes a placement platform on which a substrate is placeable and that is configured to rotate the placed substrate, a cooling nozzle configured to supply a cooling gas to a space between the placement platform and the substrate, a liquid supplier configured to supply a liquid to a surface of the substrate opposite to the placement platform side, and a dispersion plate located at a discharge side of the cooling gas of the cooling nozzle. The dispersion plate includes a first hole extending through the dispersion plate in a thickness direction. The first hole is located at a position overlapping a central axis of the cooling nozzle when viewed along a direction along the central axis of the cooling nozzle.

公开(公告)号：US20210299713A1

公开(公告)日：2021-09-30

申请号：US17195924

申请日：2021-03-09

Applicant: Shibaura Mechatronics Corporation

Inventor： Kensuke DEMURA ,  Daisuke MATSUSHIMA ,  Masaya KAMIYA

IPC: B08B7/00 ,  B08B3/10

Abstract: According to one embodiment, q substrate treatment device includes a placement stand, a plurality of support portions, a cooling part, a liquid supplier, and at least one protrusion. The placement stand has a plate shape, and is configured to rotate. The support portions are provided on one surface of the placement stand and configured to support a substrate. The cooling part is configured to supply a cooling gas into a space between the placement stand and a back surface of the substrate supported by the support portions. The liquid supplier is configured to supply a liquid onto a surface of the substrate. At least one protrusion is provided on the one surface of the placement stand and extends along a boundary line of a region where the substrate is provided in a plan view.

公开(公告)号：US20240096653A1

公开(公告)日：2024-03-21

申请号：US18469619

申请日：2023-09-19

Applicant: SHIBAURA MECHATRONICS CORPORATION ,  KIOXIA CORPORATION

Inventor： Kensuke DEMURA ,  Satoshi NAKAMURA ,  Masaya KAMIYA ,  Minami NAKAMURA ,  Kosuke TAKAI ,  Mana TANABE ,  Kaori UMEZAWA

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/02052 ,  H01L21/67023 ,  H01L21/67109 ,  H01L21/68764

Abstract: According to one embodiment a substrate treatment apparatus incorporates, into a frozen film, a contaminant adhered to a substrate surface by freezing a liquid film on the surface. The apparatus includes a placement part configured to rotate the substrate, a liquid supply part configured to supply a liquid via a nozzle to the frozen film including the contaminant, a moving part configured to move the nozzle parallel to the substrate surface, and a controller configured to control a rotation of the substrate by the placement part, a supply of the liquid by the liquid supply part, and a movement of the nozzle by the moving part. The controller rotates the substrate by controlling the placement part, supplies the liquid to the frozen film by controlling the liquid supply part, and moves the nozzle from a perimeter edge vicinity to a rotation center vicinity of the substrate by controlling the moving part.

公开(公告)号：US20220080468A1

公开(公告)日：2022-03-17

申请号：US17469876

申请日：2021-09-09

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Kensuke DEMURA ,  Daisuke MATSUSHIMA ,  Masaya KAMIYA

IPC: B08B3/10 ,  H01L21/687 ,  B08B7/00 ,  B08B3/04 ,  B08B13/00

Abstract: A substrate processing apparatus according to an embodiment of the present disclosure includes a stage having a substantially disc-shaped form and including a hole in a center thereof; a roller that contacts a side surface of the stage and rotates the stage; a first liquid nozzle that supplies a first liquid to a first surface of the substrate; a first driver that moves a position of the first liquid nozzle; a second liquid nozzle that supplies a second liquid from the hole of the stage to a second surface of the substrate; a second driver that moves a position of the second liquid nozzle; a cooling nozzle that supplies a cooling gas from the hole of the stage to the second surface; a third driver that moves a position of the cooling nozzle; and a controller that controls the first driver, the second driver, and the third driver.

公开(公告)号：US20230271231A1

公开(公告)日：2023-08-31

申请号：US18114377

申请日：2023-02-27

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Kensuke DEMURA ,  Satoshi NAKAMURA ,  Masaya KAMIYA ,  Minami NAKAMURA

IPC: B08B7/00

CPC classification number: B08B7/0092 ,  B08B7/0014

Abstract: According to one embodiment, a substrate processing apparatus includes: a stage rotatable around a central axis; a plurality of holders provided on the stage to hold a substrate; a cooler capable of supplying a cooling gas to a space between the stage and the substrate; and a liquid supply capable of supplying a liquid to a surface of the substrate on an opposite side to the stage. When holding the substrate, each of the plurality of holders moves toward the central axis along a surface of the stage so as to surround a peripheral edge of the substrate and the space between the stage and the substrate.

公开(公告)号：US20210323036A1

公开(公告)日：2021-10-21

申请号：US17230152

申请日：2021-04-14

Applicant: Shibaura Mechatronics Corporation

Inventor： Daisuke MATSUSHIMA ,  Kensuke DEMURA ,  Satoshi NAKAMURA ,  Masaya KAMIYA ,  Minami NAKAMURA

IPC: B08B7/00 ,  B08B3/10 ,  B08B3/08 ,  B08B3/04 ,  F25C1/12

Abstract: According to one embodiment, a substrate treatment device includes a placement stand configured to rotate the substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a first liquid supplier configured to supply a first liquid on a surface of the substrate, a second liquid supplier configured to supply a second liquid on the surface, and a controller controlling rotation of the substrate, supply of the cooling gas, the first and second liquids. The controller performs a preliminary process of supplying the second liquid on the surface, and supplying the cooling gas into the space, a liquid film forming process by supplying the first liquid toward the surface after the preliminary process, a supercooling process of the liquid film on the surface, and a freezing process of at least a part of the liquid film on the surface.

公开(公告)号：US20210265159A1

公开(公告)日：2021-08-26

申请号：US17181264

申请日：2021-02-22

Applicant: Shibaura Mechatronics Corporation

Inventor： Kensuke DEMURA ,  Daisuke MATSUSHIMA ,  Masaya KAMIYA

IPC: H01L21/02 ,  B08B7/00

Abstract: According to one embodiment, a substrate treatment device includes a placement stand configured to rotate a substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a liquid supplier configured to supply a liquid on a surface of the substrate opposite to the placement stand, and a controller controlling a rotation speed of the substrate, a flow rate of the cooling gas, or a supply amount of the liquid. The controller sets the liquid on the surface of the substrate to be in a supercooled state, forms a frozen film by freezing the liquid in the super cooled state, and causes crack to generate in the frozen film by decreasing a temperature of the frozen film.