DIFFERENTIAL SIGNAL TRANSMISSION DEVICE
    1.
    发明申请
    DIFFERENTIAL SIGNAL TRANSMISSION DEVICE 失效
    差分信号传输装置

    公开(公告)号:US20110038427A1

    公开(公告)日:2011-02-17

    申请号:US12560445

    申请日:2009-09-16

    IPC分类号: H04L27/00

    CPC分类号: H04L25/0272

    摘要: A differential signal transmission device transmits N differential signal pairs from a differential signal generator to a number of receiving terminals. The N differential signal pairs include N positive signals and N negative signals. The N positive signals are clustered at a first positive clustering point. The first positive clustering point is connected to a second positive clustering point via a first matching resistor. The second positive clustering point is grounded via a first grounding resistor, and outputs a number of positive signals to the number of receiving terminals respectively. The N negative signals are clustered at a first negative clustering point. The first negative clustering point is connected to a second negative clustering point via a second matching resistor. The second negative signal clustering point is grounded via a second grounding resistor, and outputs a number of negative signals to the number of receiving terminals respectively.

    摘要翻译: 差分信号传输装置将差分信号发生器的N个差分信号对发送到多个接收终端。 N个差分信号对包括N个正信号和N个负信号。 N个正信号聚集在第一个正聚类点。 第一正聚集点通过第一匹配电阻连接到第二正聚集点。 第二个正聚集点通过第一接地电阻接地,并分别输出多个正信号到接收端的数量。 N个负信号聚集在第一个负聚类点。 第一负聚集点通过第二匹配电阻器连接到第二负聚集点。 第二负信号聚簇点通过第二接地电阻接地,并分别输出多个负信号至接收端数。

    PRINTED CIRCUIT BOARD WITH COMPOUND VIA
    2.
    发明申请
    PRINTED CIRCUIT BOARD WITH COMPOUND VIA 失效
    印刷电路板与化合物通过

    公开(公告)号:US20120145448A1

    公开(公告)日:2012-06-14

    申请号:US13031617

    申请日:2011-02-22

    IPC分类号: H05K1/11

    摘要: A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon.

    摘要翻译: 具有复合通孔的印刷电路板(PCB)包括基板和穿过基板的一对通孔。 衬底包括作为衬底的顶层的信号层,与信号层相邻的第一参考层和不与信号层相邻的第二参考层。 第一和第二对焊盘安装在信号层上。 每个通孔延伸穿过第一对垫,使得通孔和第一对垫共同形成复合通孔。 第一保留开口形成在第一参考层上,并且对应于第一和第二对焊盘和复合通孔。 第二保留开口形成在第二参考层上并围绕其上的通孔。

    PRINTED CIRCUIT BOARD
    3.
    发明申请
    PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板

    公开(公告)号:US20120138344A1

    公开(公告)日:2012-06-07

    申请号:US12965832

    申请日:2010-12-11

    IPC分类号: H05K1/03

    摘要: A printed circuit board is constructed from various woven fiberglass fabrics, strengthened and bound together with epoxy resin, and includes a signal layer. The signal layer includes a positive differential signal line and a negative differential signal line laid out in parallel following a zig-zag pattern. A first distance and a second distance is designed at a ratio of 1:7. The first distance is a perpendicular distance between a highest point of the negative differential signal line and a reference line formed by connecting all lowest points of the negative differential signal line. The second distance is a perpendicular distance between a lowest point and an adjacent highest point of the negative differential signal line along the direction of the reference line.

    摘要翻译: 印刷电路板由各种编织玻璃纤维织物构成,与环氧树脂一起加强并结合在一起,并包括信号层。 该信号层包括一个正的差分信号线和一个负的差分信号线并行地排列成Z字形图案。 以1:7的比例设计第一距离和第二距离。 第一距离是负差分信号线的最高点与通过连接负差分信号线的所有最低点形成的参考线之间的垂直距离。 第二距离是沿着参考线的方向的负差分信号线的最低点和相邻最高点之间的垂直距离。

    OVERDRIVE TOPOLOGY STRUCTURE FOR TRANSMISSION OF RGB SIGNAL
    4.
    发明申请
    OVERDRIVE TOPOLOGY STRUCTURE FOR TRANSMISSION OF RGB SIGNAL 失效
    用于传输RGB信号的扩展拓扑结构

    公开(公告)号:US20100289601A1

    公开(公告)日:2010-11-18

    申请号:US12483260

    申请日:2009-06-12

    IPC分类号: H01P3/00

    摘要: An overdrive topology structure for transmission of a RGB signal includes a signal sending terminal, a signal receiving terminal, and a transmission line to transmit the RGB signal from the signal sending terminal to the signal receiving terminal. The transmission line is divided into a number of section transmission lines. A node is formed between every two section transmission lines. An impedance of a first section transmission line approaching to the signal sending terminal is less than an impedance of a second section transmission line approaching to the first section transmission line to overdrive the RGB signal at a first node between the first and second section transmission lines. At least one node except the first node is grounded via a resistor. An equivalent resistance of the resistor is equal to a resistance of the first resistor.

    摘要翻译: 用于传输RGB信号的过驱动拓扑结构包括信号发送端,信号接收端和传输线,以将RGB信号从信号发送端发送到信号接收端。 传输线被分成多个部分传输线。 在每两段传输线之间形成节点。 接近信号发送端的第一部分传输线的阻抗小于接近第一部分传输线的第二部分传输线的阻抗,以在第一和第二部分传输线之间的第一节点处过驱动RGB信号。 除第一个节点之外的至少一个节点通过电阻器接地。 电阻器的等效电阻等于第一电阻器的电阻。

    ELECTRONIC DEVICE AND MULTI-FREQUENCY ANTENNA THEREOF
    5.
    发明申请
    ELECTRONIC DEVICE AND MULTI-FREQUENCY ANTENNA THEREOF 失效
    电子设备及其多频天线

    公开(公告)号:US20100283697A1

    公开(公告)日:2010-11-11

    申请号:US12475512

    申请日:2009-05-30

    IPC分类号: H01Q13/10

    摘要: An electronic device includes a multi-frequency antenna. The multi-frequency antenna includes a ground portion, a support body, a radiation portion, and a strap. The ground portion defines a gap, and two grooves communicating with the gap and located at opposite ends of the gap. The radiation portion resists against a sidewall bounding the gap, and is connected to the strap. The radiation portion is accommodated in the gap and substantially coplanar with the ground portion. The radiation portion defines a slot. The support body is located in the gap and on the radiation portion, to support the strap.

    摘要翻译: 电子设备包括多频天线。 多频天线包括接地部分,支撑体,辐射部分和带子。 接地部分限定了间隙,并且两个凹槽与间隙连通并且位于间隙的相对端。 辐射部分抵抗围绕间隙的侧壁,并且连接到带子。 辐射部分容纳在间隙中并且基本上与接地部分共面。 辐射部分限定狭缝。 支撑体位于间隙和辐射部分上,以支撑带子。