STRUCTURE REPAIRING METHOD
    1.
    发明申请

    公开(公告)号:US20210283655A1

    公开(公告)日:2021-09-16

    申请号:US17275715

    申请日:2019-08-20

    Abstract: A structure repairing method applied to concrete structures ensures a short construction period and high reliability in a wide temperature range. The method includes a first repairing layer forming step of applying a radical-polymerizable resin composition (A) to a structure to form a first repairing layer, a second repairing layer forming step of applying a repairing material (X) containing a radical-polymerizable resin composition (Ax) and a filler (B) to the first repairing layer before the first repairing layer is cured, thereby forming a second repairing layer, and a repairing layer curing step of curing the radical-polymerizable resin composition (A) and the radical-polymerizable resin composition (Ax), wherein (A) and (Ax) each contain a radical-polymerizable resin (a1), a radical-polymerizable unsaturated monomer (a2), a hydroxy group-containing aromatic tertiary amine (a3), and an organic peroxide (a4), and (a1) and (a2) in each of (A) and (Ax) total 75% by mass or more.

    CURING ACCELERATOR AND RADICAL POLYMERIZABLE RESIN COMPOSITION

    公开(公告)号:US20200181365A1

    公开(公告)日:2020-06-11

    申请号:US16341151

    申请日:2017-09-04

    Abstract: A curing accelerator can exhibit good curing acceleration performance and is excellent in storage stability, while maintaining sufficient pot life in a curing reaction of radical-polymerizable resins, and a radical-polymerizable resin composition uses the curing accelerator. The curing accelerator for radical-polymerizable resins includes a metal-containing compound (A), a thiol compound (B) and an aprotic solvent (C) having a dielectric constant of 10 or less, wherein the metal-containing compound (A) is one or more compounds selected from a metal soap (A1) and a β-diketone skeleton-having metal complex (A2), the thiol compound (B) is one or more compounds selected from a mono-functional primary thiol compound (B1), a secondary thiol compound (B2) and a tertiary thiol compound (B3), and the content of the aprotic solvent (C) is 10 to 1,000 parts by mass relative to 100 parts by mass of the total of the metal-containing compound (A) and the thiol compound (B).

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