公开(公告)号：US20220127498A1

公开(公告)日：2022-04-28

申请号：US17428823

申请日：2020-03-16

Applicant: SHOWA DENKO K.K.

Inventor： Kazuhiko OOGA ,  Takeshi KAWAMOTO ,  Kai SUZUKI ,  Ryunosuke YAMAMOTO

IPC: C09J7/29 ,  B32B15/20 ,  B32B27/32 ,  H01M50/197 ,  B32B15/085 ,  B32B7/12 ,  C09J7/38

Abstract: Provided are an outer package material that is for electricity storage devices such as batteries and has such a sufficient anti-electrolytic solution property that the time-dependent reduction of the adhesive strength between a metal foil layer and a sealant layer by an electrolytic solution is suppressed over a long time and a composition for adhesives for giving the outer package material. In an outer package material that is for electricity storage devices and has a structure in which at least a base material layer, a first adhesive layer, a metal foil layer, a second adhesive layer, and a sealant layer are stacked in sequence, a composition containing an isocyanato group and a (meth) acryloyl group and further containing an acid-modified polyolefin (component 1), an active energy ray polymerization initiator (component 3), and a solvent (component 4) is used as a composition for adhesives to form the second adhesive layer.

公开(公告)号：US20180368253A1

公开(公告)日：2018-12-20

申请号：US16061036

申请日：2016-12-13

Applicant: SHOWA DENKO K.K.

Inventor： Kazuhiko OOGA ,  Naoki MURATA ,  Kai SUZUKI

IPC: H05K1/02 ,  B41M3/00 ,  B41M7/00 ,  H05K1/09 ,  H05K1/03 ,  H05K3/28 ,  C08G18/42 ,  C08G18/32 ,  C08G18/34 ,  C08G18/66 ,  C08G18/75 ,  C09D11/102 ,  C08K3/36 ,  C08K3/26 ,  C09D11/037

Abstract: Provided are a polyurethane and a curable composition capable of obtaining an overcoat film for a flexible wiring board that is excellent in low-warpage properties, flexibility, long-term insulation reliability, and wiring disconnection preventing properties. The polyurethane has: a structural unit of formula (1) (in formula (1), an n-number of R1 each independently represents a 1,2-phenylene group or a 1,2-phenylene group having a substituent, an (n+1)-number of R2 each independently represents a hydrocarbon group having 3-9 carbon atoms, and n represents an integer from 1 to 50); a structural unit of formula (2) (in formula (2). R3 represents a divalent organic group having 6-14 carbon atoms); and a structural unit of formula (3) (in formula (3), R3 represents a divalent organic group having 6-14 carbon atoms, and R4 represents a methyl or ethyl group).

公开(公告)号：US20180355195A1

公开(公告)日：2018-12-13

申请号：US16061042

申请日：2016-11-17

Applicant: SHOWA DENKO K.K.

Inventor： Kazuhiko OOGA ,  Naoki MURATA ,  Kai SUZUKI

IPC: C09D11/102 ,  C08G18/42 ,  C08G18/34 ,  C08G18/32 ,  C08G18/66 ,  C08G18/75 ,  C08G18/16 ,  C09D11/037 ,  C08K3/36 ,  C08K3/26 ,  H05K1/02 ,  H05K1/03 ,  H05K3/46

CPC classification number: C09D11/102 ,  C08G18/168 ,  C08G18/3215 ,  C08G18/348 ,  C08G18/42 ,  C08G18/4211 ,  C08G18/6659 ,  C08G18/758 ,  C08K3/26 ,  C08K3/34 ,  C08K3/36 ,  C08K2003/267 ,  C08L63/00 ,  C08L75/06 ,  C09D7/40 ,  C09D11/037 ,  C09D175/04 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0353 ,  H05K3/4644 ,  H05K2203/1105

Abstract: A curable composition for forming an overcoat film for flexible wiring boards, the curable composition being effective in improving adhesion to substrates, low warpage, flexibility, the property of inhibiting wire breakage, and long-term reliability. The curable composition according to the present invention comprises a polyurethane (component a) having carboxyl groups and an aromatic-ring concentration of 0.1-6.5 mmol/g and containing an organic residue derived from a polyisocyanate, a solvent (component b), and a compound (component c) having two or more epoxy groups in the molecule.