公开(公告)号：US11225080B2

公开(公告)日：2022-01-18

申请号：US16333194

申请日：2016-10-19

Applicant: SICPA HOLDING SA

Inventor： Paolo Schina ,  Silvia Baldi ,  Irma Disegna ,  Miriam Perini

IPC: B41J2/16 ,  H01L21/311 ,  B41J2/14 ,  H01L27/092

Abstract: The present invention provides a method for forming a thermal inkjet printhead, comprising at least the following steps: providing a semiconductor wafer including an integrated electronic circuit and a section for forming a thermal actuator element, the integrated circuit comprising at least: a thermal insulating layer formed over a substrate; and a first metal layer formed over the thermal insulating layer; wherein the first metal layer extends into the section for forming the thermal actuator element; and etching a section for forming a thermal actuator element to the first metal layer such that the first metal layer is acting as an etch stop layer. Further there is provided a thermal inkjet printhead formed by a method of the present invention and a semiconductor wafer for forming the thermal inkjet printheads by a method of the present invention.

公开(公告)号：US10940690B2

公开(公告)日：2021-03-09

申请号：US15557354

申请日：2016-03-10

Applicant: SICPA HOLDING SA

Inventor： Lucia Giovanola ,  Silvia Baldi ,  Anna Merialdo ,  Paolo Schina

IPC: B41J2/16 ,  B41J2/14

Abstract: The present application relates to a method of manufacturing an ink-jet printhead comprising: providing a silicon substrate (10) including active ejecting elements (11); providing a hydraulic structure layer (20) for defining hydraulic circuits configured to enable a guided flow of ink; providing a silicon orifice plate (30) having a plurality of nozzles (31) for ejection of the ink; assembling the silicon substrate (10) with the hydraulic structure layer (20) and the silicon orifice plate (30); wherein providing the silicon orifice plate (30) comprises: providing a silicon wafer (40) having a planar extension delimited by a first surface (41) and a second surface (42) on opposite sides of the silicon wafer (40); performing a thinning step at the second surface (42) so as to remove from the second surface (42) a central portion (43) having a preset height (H), the silicon wafer (40) being formed, following the thinning step, by a base portion (44) having a planar extension and a peripheral portion (45) extending from the base portion (44), transversally with respect to the planar extension of the base portion (44); and forming in the silicon wafer (40) a plurality of through holes, each defining a respective nozzle (31) for ejection of the ink. The method according to the present invention is characterized in that the silicon wafer (40) is a silicon-on-insulator wafer, wherein the silicon-on-insulator wafer comprises a silicon device layer (38) adjacent to the first surface (41), a silicon handle layer (37) adjacent to the second surface (42) and an insulator layer (39) in-between.

公开(公告)号：US10800988B2

公开(公告)日：2020-10-13

申请号：US15516013

申请日：2015-09-25

Applicant: SICPA HOLDING SA

Inventor： Agnieszka Kapalka ,  Xavier Urbaneja ,  Lucia Giovanola ,  Paolo Schina ,  Silvia Baldi ,  Irma Disegna ,  Silvano Tori

IPC: B01J19/00 ,  C07D311/30 ,  C10L1/00 ,  C10L1/18 ,  G01N33/22 ,  C10L1/185 ,  C10L1/28 ,  G01N27/416 ,  C07D311/62 ,  B01L3/00 ,  C10L1/19

Abstract: A Liquid, comprising an hydrophobic flavonoid derivative electrochemically non-active, that is capable of restoring its electrochemical activity, the concentration of the flavonoid derivative being 10 ppm by weight or less, and an organic substance in an amount of 90% by weight or more.

公开(公告)号：US10308869B2

公开(公告)日：2019-06-04

申请号：US15509680

申请日：2015-09-25

Applicant: SICPA HOLDING SA

Inventor： Mia Milos-Schouwink ,  Agnieszka Kapalka ,  Jean-Luc Dorier ,  Lorenzo Sirigu ,  Lucia Giovanola ,  Paolo Schina ,  Silvia Baldi ,  Irma Disegna ,  Silvano Tori

IPC: C09K11/06 ,  G01N21/76 ,  G01N1/18 ,  G01N1/00 ,  C10L1/00 ,  C10L1/16 ,  G01N21/64 ,  B01L3/00 ,  G01N1/40 ,  G01N33/28 ,  G01N35/10 ,  G01N35/00

Abstract: The present invention relates to markers for liquids that can be used to authenticate the origin and genuineness of a liquid, preferably a bulk liquid such as fuel. For this purpose, the present invention teaches the use of a polymer capable of forming a semiconducting polymer particle (pdot) in the liquid in small amounts. The invention encompasses a liquid comprising a) a polymer that is capable of forming a semiconducting polymer particle (pdot), the concentration of the polymer being 10 ppm by weight or less, and b) an organic substance in an amount of 90% by weight or more. The invention furthermore envisages the use of such a polymer as an authenticating marker in a liquid, preferably a fuel, and a method for authenticating the genuineness and/or origin of a liquid comprising a polymer capable of forming a semiconducting polymer particle (pdot), comprising the steps i. concentrating, isolating and/or extracting the polymer capable of forming a semiconducting polymer particle (pdot); ii. aggregating the polymer or the polymer obtained in Step i. to form semiconducting polymer dots (pdots); iii. irradiating the formed pdots with electromagnetic radiation capable of exciting the pdots to emit electromagnetic radiation by fluorescence and/or phosphorescence, and iv. observing the electromagnetic radiation emitted in response to the exciting irradiation of step iii.

公开(公告)号：US10081187B2

公开(公告)日：2018-09-25

申请号：US14970849

申请日：2015-12-16

Applicant: SICPA HOLDING SA

Inventor： Silvia Baldi ,  Danilo Bich ,  Lucia Giovanola ,  Anna Merialdo ,  Paolo Schina

IPC: B41J2/16 ,  B41J2/14

CPC classification number: B41J2/162 ,  B41J2/1433 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1635 ,  B41J2002/14411 ,  B41J2002/14475

Abstract: A method of manufacturing an ink jet printhead includes: providing a silicon substrate including active ejecting elements; providing a hydraulic structure layer; providing a silicon orifice plate having a plurality of nozzles for ejection of the ink; and assembling the silicon substrate with the hydraulic structure layer and the silicon orifice plate. Providing the silicon orifice plate includes: providing a silicon wafer having a substantially planar extension delimited by a first and a second surfaces; performing a thinning at the second surface so as to remove a central portion having a preset height; and forming in the silicon wafer a plurality of through holes, each defining a respective nozzle for ejection of the ink.