摘要:
The invention relates to a membrane including a partition layer, wherein the partition layer contains at least 50 wt % of PVC, and a barrier layer. The barrier layer can be a barrier layer, wherein the barrier layer has a polyamide layer containing more than 50 wt % of copolymer, wherein said polyamide layer is connected to the partition layer by a polyurethane layer, wherein the polyurethane layer contains more than 10 wt % of polyurethane. Alternatively, the barrier layer can be a barrier layer, wherein the barrier layer is made of a composition containing 5-50 wt % of polyurethane and 50-95 wt % of copolymer. The membranes according to the invention have significantly lower plasticizer migration compared to the membranes of the prior art and are characterized by improved aging resistance, in particular with regard to the adhesion of the barrier layer to the partition layer, and impermeability to moisture.
摘要:
A hot-curing epoxy resin composition including: at least one liquid epoxy resin having an average of more than one epoxy group per molecule; at least one solid epoxy resin having an average of more than one epoxy group per molecule; at least one polymeric impact modifier comprising a functionalized, epoxy-terminated, acrylonitrile/butadiene copolymer; at least one homopolymer, solid at room temperature, of an olefinically unsaturated monomer; and at least one epoxy-resin hardener which is activated via an elevated temperature, with a proportion by weight of the polymeric impact modifier, based on the epoxy resin composition, being smaller than 20% by weight, and an amount by weight of the homopolymer, solid at room temperature, being greater than the amount by weight of the polymeric impact modifier.
摘要:
A one-component thermosetting epoxy resin adhesive, includes: a) at least one epoxy resin A of the formula (II):
wherein the substituents R′ and R″ independently of one another are either H or CH3 and the index s has a value of 0-12, at least one epoxy novolac EN of the formula:
where R2=
or CH2, R1=H or methyl and z=0-7, at least one trifunctional or higher functional glycidyl amine type epoxy resin GA, least one latent hardener B for epoxy resins and at least at least one toughness improver D. The epoxy resin adhesive is notable in particular for providing a one-component thermosetting epoxy resin adhesive which shows good adhesion on metal substrates at temperatures around 80° C., even when cured at relatively low temperatures.
摘要:
A method of bonding substrates having different coefficients of thermal expansion, especially in the shell construction of modes of transport or white goods, using a one-component thermosetting epoxy resin composition containing toughness improvers based on terminally blocked polyurethane prepolymers.
摘要:
A moisture curable hot-melt adhesive composition and the use thereof for bonding of substrates in production of white goods, automotive vehicles, and electronic devices; wherein the adhesive composition includes at least one isocyanate-functional polyurethane polymer P obtained by reacting: at least one isocyanate-functional polyurethane polymer P obtained by reacting: a) at least one at 25° C. solid polyester polyol PO1, b) at least one first polyether polyol PO2, c) optionally at least one second polyether polyol PO3 different from the at least one first polyether polyol PO2, and d) at least one polyisocyanate PI, and optionally at least one catalyst CA, wherein the at least one first polyether polyol PO2 is a grafted polyether polyol.
摘要:
Methods in which toughness improvers based on terminally blocked polyurethane prepolymers are used to increase the maximum linear expansion of single component heat-curing epoxy resin compositions, in particular for joining substrates having different thermal expansion coefficients, in particular in the framework of transport agents or white goods.