公开(公告)号：US09412690B2

公开(公告)日：2016-08-09

申请号：US14325081

申请日：2014-07-07

Applicant: SK HYNIX INC.

Inventor： Tae Ho Lee ,  Il Hwan Cho ,  In Chul Hwang ,  Ga Hyun No

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/49827 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A package substrate includes a substrate body and a plurality of patterns disposed on the substrate body. The substrate body has a first region including a chip attachment region and a second region adjacent to the first region. The plurality of patterns are disposed on the substrate body in the second region. Each of the plurality of patterns extends in a first direction to have a stripe shape, and the plurality of patterns are spaced apart from each other in a second direction which is substantially perpendicular to the first direction. Related fabrication methods, electronic systems and memory cards are also provided.

Abstract translation: 封装基板包括基板主体和布置在基板主体上的多个图案。 基板主体具有包括芯片附接区域和与第一区域相邻的第二区域的第一区域。 多个图案设置在第二区域中的基板主体上。 多个图案中的每一个在第一方向上延伸以具有条形形状，并且多个图案在基本上垂直于第一方向的第二方向上彼此间隔开。 还提供了相关的制造方法，电子系统和存储卡。

公开(公告)号：US09437580B1

公开(公告)日：2016-09-06

申请号：US14835589

申请日：2015-08-25

Applicant: SK hynix Inc.

Inventor： Ga Hyun No ,  Chan Woo Jeong

IPC: H01L25/065 ,  H01L23/28 ,  H01L23/498 ,  H01L23/31 ,  H01L23/29 ,  H01L23/14

CPC classification number: H01L25/0657 ,  H01L23/145 ,  H01L23/293 ,  H01L23/296 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/4985 ,  H01L2224/32145 ,  H01L2224/73203 ,  H01L2225/06513 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2924/15311 ,  H01L2924/3511

Abstract: A semiconductor package includes a flexible package substrate including a first surface and a second surface, a metal post penetrating the flexible package substrate from the first surface toward the second surface and including a first protrusion that protrudes from the first surface and a second protrusion that protrudes from the second surface, a first semiconductor chip connected to the first protrusion, a second semiconductor chip connected to the second protrusion, a first flexible molding member covering the first semiconductor chip and the first surface of the flexible package substrate, a second flexible molding member covering the second semiconductor chip disposed on the second surface of the flexible package substrate, and an external connection terminal disposed on the second surface of the flexible package substrate.

Abstract translation: 半导体封装包括包括第一表面和第二表面的柔性封装衬底，从第一表面朝向第二表面穿透柔性封装衬底的金属柱，并且包括从第一表面突出的第一突起和突出 从第二表面连接到第一突起的第一半导体芯片，连接到第二突起的第二半导体芯片，覆盖第一半导体芯片和柔性封装基板的第一表面的第一柔性模制构件，第二柔性模制构件 覆盖设置在柔性封装基板的第二表面上的第二半导体芯片，以及设置在柔性封装基板的第二表面上的外部连接端子。