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公开(公告)号：US11805616B2
公开(公告)日：2023-10-31
申请号：US16941709
申请日：2020-07-29
发明人： Sunhwan Kim , Jung Hee Ki , Jin Woo Lee , Dawoo Jeong , Seung Yong Pyun , Yun Hee Seo
IPC分类号： H05K5/03 , H05K5/00 , C08K3/36 , C08K3/30 , C08K3/26 , C08J5/18 , B29C39/14 , B29K79/00 , B29L31/34 , H10K50/84
CPC分类号： H05K5/03 , C08J5/18 , C08K3/26 , C08K3/30 , C08K3/36 , H05K5/0017 , B29C39/14 , B29K2079/08 , B29L2031/3475 , C08J2379/08 , C08K2003/265 , C08K2003/3045 , C08K2201/003 , H10K50/84
摘要： Embodiments relate to a polyimide-based composite film, which comprises a base film comprising a polyimide-based resin; and a functional layer disposed on the base film, wherein when the side of the functional layer located opposite to the side in contact with the base film is referred to as a first side and when the side of the base film in contact with the functional layer is referred to as a second side, the leveling index represented by Equation 1 is less than 0.75.
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公开(公告)号：US12037473B2
公开(公告)日：2024-07-16
申请号：US17862476
申请日：2022-07-12
发明人： Dae Seong Oh , Dawoo Jeong , Sunhwan Kim , Jin Woo Lee , Dong Jin Lim , Kyungeun Oh
IPC分类号： C08G73/10 , B29C39/24 , B29C39/38 , B29C39/42 , B29C39/44 , C08G73/14 , C08J5/18 , C08L79/08 , B29C41/00 , B29K77/00 , B29K105/00
CPC分类号： C08J5/18 , B29C39/24 , B29C39/38 , B29C39/42 , B29C39/44 , C08G73/1039 , C08G73/14 , C08L79/08 , B29C41/003 , B29K2077/00 , B29K2105/0094 , C08J2379/08 , C08L2201/10 , C08L2203/16
摘要： An embodiment can provide a polyamide-imide film and a method for producing same, the film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, in an XRD graph with a section in which 2θ=8° to 32° as a baseline, the film shows a peak area of 50% or above around 2θ=23° with respect to a peak area seen around 2θ=15°.
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公开(公告)号：US11780965B2
公开(公告)日：2023-10-10
申请号：US17667225
申请日：2022-02-08
发明人： Dawoo Jeong , Sunhwan Kim , Dae Seong Oh , Jin Woo Lee , Dong Jin Lim
CPC分类号： C08G73/14 , B29C39/003 , B29C39/14 , B29C39/38 , C08G73/1032 , C08J5/18 , B29K2079/085 , B29L2007/008 , C08J2379/08
摘要： Embodiments relate to a polyamide-imide film that secures excellent tensile toughness and elastic restoring force, and a process for preparing the same. The polyamide-imide film comprises a polyamide-imide polymer formed by polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound, wherein the area value up to the yield point derived by the 0.2% off-set method on a stress-strain curve of the polyamide-imide film as measured using a universal testing machine (UTM) is 80 to 150 J/m2.
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公开(公告)号：US11702519B2
公开(公告)日：2023-07-18
申请号：US16477697
申请日：2018-02-05
发明人： Dawoo Jeong , Sunhwan Kim , Jin Woo Lee , Dae Seong Oh , Dong Jin Lim
IPC分类号： C08J5/18 , C08G73/14 , B29C39/24 , B29C39/38 , B29C39/42 , B29C39/44 , C08G73/10 , C08L79/08 , B29C41/00 , B29K77/00 , B29K105/00
CPC分类号： C08J5/18 , B29C39/24 , B29C39/38 , B29C39/42 , B29C39/44 , C08G73/1039 , C08G73/14 , C08L79/08 , B29C41/003 , B29K2077/00 , B29K2105/0094 , C08J2379/08 , C08L2201/10 , C08L2203/16
摘要： An embodiment can provide a polyamide-imide film, which has particular punching properties, is colorless and transparent and has excellent mechanical properties and optical properties, and a method for preparing same. The polyamide-imide film comprises a polyamide-imide polymer, which is formed by means of polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, and satisfies the condition of general formula (1) below. General formula (1) 4≤X/Y≤12 X: the maximum hole diameter (mm) comprising cracks when the film is punched at 10 mm/min using a 2.5 mm spherical tip by means of a UTM compression mode Y: the modulus (GPa) of the film.
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