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公开(公告)号：US20230121053A1
公开(公告)日：2023-04-20
申请号：US18045885
申请日：2022-10-12
摘要： Electronic acoustic devices and methods of operating the same include a microphone having a frequency response including a resonance frequency, a reference microphone having a frequency response including a resonance frequency, the microphone and the reference microphone configured to substantially simultaneously receive a common acoustic signal to produce a transduced signal of the microphone and a transduced signal of the reference microphone, the resonance frequency of the reference microphone being different than the resonance frequency of the microphone, and an equalization module configured to equalize the frequency response of the microphone based on the transduced signal of the microphone and the transduced signal of the reference microphone.
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公开(公告)号：US20220272459A1
公开(公告)日：2022-08-25
申请号：US17674203
申请日：2022-02-17
IPC分类号： H04R17/02 , H01L41/083 , H04R7/18 , H04R7/08
摘要： A piezoelectric microelectromechanical system microphone comprises a piezoelectric element configured to deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric element, a sensing electrode disposed on the piezoelectric element and configured to sense the electrical potential, and a dummy electrode electrically unconnected to the sensing electrode and disposed on a portion of the piezoelectric element that is free of the sensing electrode, the dummy electrode configured to reduce static deformation of the piezoelectric element caused by residual stresses in the piezoelectric element.
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公开(公告)号：US12101601B2
公开(公告)日：2024-09-24
申请号：US17929071
申请日：2022-09-01
IPC分类号： H04R17/02
CPC分类号： H04R17/02 , H04R2201/003
摘要： A microelectromechanical system microphone includes a piezoelectric diaphragm, upper inner electrodes and upper outer electrodes disposed on an upper surface of the diaphragm, and lower inner electrodes and lower outer electrodes disposed on a lower surface of the diaphragm. The diaphragm is divided into a plurality of sectors, a first of the sectors including an inner and an outer upper electrode physically disconnected from an inner and an outer upper electrode on a second sector adjacent to the first sector, and an inner and an outer lower electrode physically disconnected from an inner and an outer lower electrode on the second sector. A first via extends between and electrically couples the upper and lower inner electrodes of the first sector and a first bond pad. A second via extends between and electrically couples the upper and lower outer electrodes of the second sector and a second bond pad.
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公开(公告)号：US11979712B2
公开(公告)日：2024-05-07
申请号：US17810359
申请日：2022-07-01
发明人： You Qian , Rakesh Kumar , Guofeng Chen
IPC分类号： H04R17/02
CPC分类号： H04R17/02 , H04R2201/003
摘要： A piezoelectric microelectromechanical system microphone comprises a frame, a film of piezoelectric material including slits defining a plurality of independently displaceable piezoelectric elements within an area defined by a perimeter of the frame, bases of the plurality of piezoelectric elements mechanically secured to the frame, tips of the plurality of piezoelectric elements being free to be displaced in a direction perpendicular to a plane defined by the frame responsive to impingement of sound waves on the plurality of piezoelectric elements, and edge extensions extending from edges of the plurality of piezoelectric elements in the direction perpendicular to the plane defined by the frame to reduce a 3 dB roll-off frequency of the piezoelectric microelectromechanical system microphone.
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5.发明公开公开(公告)号：US20230328426A1
公开(公告)日：2023-10-12
申请号：US18045888
申请日：2022-10-12
CPC分类号： H04R1/245 , G01H3/12 , H04R1/04 , H04R19/04 , H04R31/006 , H04R2201/003
摘要： An electronic device package comprises a primary microphone having a frequency response having a first resonance frequency, and a reference microphone having a frequency response including a second resonance frequency, the primary microphone and the reference microphone configured to substantially simultaneously receive a same acoustic signal to produce a transduced signal of the primary microphone and a transduced signal of the reference microphone, the second resonance frequency of the reference microphone being different than the first resonance frequency of the primary microphone, the package having dimensions that cause the primary microphone and reference microphone to be acoustically isolated from one another at the resonance frequency of the primary microphone, there being less than 3 dB of acoustic coupling between the primary microphone and reference microphone at the first resonance frequency.
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公开(公告)号：US20230269525A1
公开(公告)日：2023-08-24
申请号：US18170598
申请日：2023-02-17
CPC分类号： H04R1/2807 , H04R1/04 , H04R1/222 , H04R3/00 , H04R17/02 , H04R2201/003 , H04R2499/11
摘要： A side-port piezoelectric microelectromechanical system microphone package includes a microelectromechanical system die disposed on the microphone substrate and including a microphone membrane and a membrane support substrate, the microphone membrane being disposed on a wall of a membrane support substrate, and an acoustic port defined by an aperture passing through a portion of the wall of the membrane support substrate.
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7.发明申请公开(公告)号：US20230130082A1
公开(公告)日：2023-04-27
申请号：US18047430
申请日：2022-10-18
摘要： A method of making a piezoelectric sensor includes forming piezoelectric layer(s) to define a beam extending between a proximal portion and a distal end. The method also includes modeling a strain distribution on the beam based on a force applied to the beam, and defining an outer boundary with a shape substantially corresponding to a contour line of the strain distribution on the beam. The method also includes forming an electrode having said outer boundary shape, and attaching the electrode to the beam. The method also includes attaching the beam to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal end of the beam is unsupported.
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公开(公告)号：US20230072672A1
公开(公告)日：2023-03-09
申请号：US17929071
申请日：2022-09-01
IPC分类号： H04R17/02
摘要： A microelectromechanical system microphone includes a piezoelectric diaphragm, upper inner electrodes and upper outer electrodes disposed on an upper surface of the diaphragm, and lower inner electrodes and lower outer electrodes disposed on a lower surface of the diaphragm. The diaphragm is divided into a plurality of sectors, a first of the sectors including an inner and an outer upper electrode physically disconnected from an inner and an outer upper electrode on a second sector adjacent to the first sector, and an inner and an outer lower electrode physically disconnected from an inner and an outer lower electrode on the second sector. A first via extends between and electrically couples the upper and lower inner electrodes of the first sector and a first bond pad. A second via extends between and electrically couples the upper and lower outer electrodes of the second sector and a second bond pad.
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公开(公告)号：US20240364298A1
公开(公告)日：2024-10-31
申请号：US18636056
申请日：2024-04-15
CPC分类号： H03H9/02102 , H03H9/02015 , H03H9/02157 , H03H9/568
摘要： A bulk acoustic wave device that is configured to excite an overtone mode as a main mode is disclosed. The bulk acoustic wave device can include a first electrode, a piezoelectric layer, a second electrode, and at least one temperature compensation layer. The piezoelectric layer is positioned over the first electrode. The second electrode is positioned such that the piezoelectric layer is located between the first and second electrodes. The at least one temperature compensation layer is configured to provide temperature compensation for the bulk acoustic wave device. The at least one temperature compensation layer has a thickness that is a multiple of one thirty-second of a wavelength of an acoustic wave propagating through the at least one temperature compensation layer. The bulk acoustic wave device is configured to excite the overtone mode as the main mode.
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公开(公告)号：US20230135200A1
公开(公告)日：2023-05-04
申请号：US18050920
申请日：2022-10-28
发明人： You Qian , Rakesh Kumar , Guofeng Chen
IPC分类号： H04R17/02
摘要： A cantilever sensor (e.g., piezoelectric sensor) includes a beam with a sensor or electrode at a proximal end and a tip that extends from the sensor to the distal (unsupported) end of the beam. The tip is modified to modify (e.g., tune) the resonant frequency of the cantilever sensor. The resonant frequency of the cantilever sensor is tuned by using a material for the tip with a stiffness (e.g., a Young's Modulus) and/or a mass or density that results in the desired resonant frequency. The resonant frequency of the cantilever sensor can also be tuned by modifying the shape of the tip to have a higher vertical structure in a Z direction transverse to a length of the beam of the sensor.
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