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公开(公告)号：US20230121053A1
公开(公告)日：2023-04-20
申请号：US18045885
申请日：2022-10-12
摘要： Electronic acoustic devices and methods of operating the same include a microphone having a frequency response including a resonance frequency, a reference microphone having a frequency response including a resonance frequency, the microphone and the reference microphone configured to substantially simultaneously receive a common acoustic signal to produce a transduced signal of the microphone and a transduced signal of the reference microphone, the resonance frequency of the reference microphone being different than the resonance frequency of the microphone, and an equalization module configured to equalize the frequency response of the microphone based on the transduced signal of the microphone and the transduced signal of the reference microphone.
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公开(公告)号：US20220272459A1
公开(公告)日：2022-08-25
申请号：US17674203
申请日：2022-02-17
IPC分类号： H04R17/02 , H01L41/083 , H04R7/18 , H04R7/08
摘要： A piezoelectric microelectromechanical system microphone comprises a piezoelectric element configured to deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric element, a sensing electrode disposed on the piezoelectric element and configured to sense the electrical potential, and a dummy electrode electrically unconnected to the sensing electrode and disposed on a portion of the piezoelectric element that is free of the sensing electrode, the dummy electrode configured to reduce static deformation of the piezoelectric element caused by residual stresses in the piezoelectric element.
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3.发明申请公开(公告)号：US20220267141A1
公开(公告)日：2022-08-25
申请号：US17674213
申请日：2022-02-17
发明人： Guofeng Chen , Yu Hui
摘要： A piezoelectric microelectromechanical system microphone comprises a support substrate, a piezoelectric element configured to deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric element, the piezoelectric element attached to the support substrate about a portion of a perimeter of the piezoelectric element, a sensing electrode disposed on the piezoelectric element and configured to sense the electrical potential, and slits defined in the piezoelectric element about the perimeter of the piezoelectric element, the slits defining a plurality of partial anchors securing the piezoelectric element to the support substrate to improve sensitivity of the piezoelectric microelectromechanical system microphone.
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公开(公告)号：US11350219B2
公开(公告)日：2022-05-31
申请号：US16983366
申请日：2020-08-03
发明人： Yu Hui , Guofeng Chen
摘要： A piezoelectric microelectromechanical systems microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can include a single piezoelectric film layer disposed over the top end of the substrate and defining a diaphragm structure, the single piezoelectric film layer being substantially flat with substantially zero residual stress and formed from a piezoelectric wafer. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when subjected to sound pressure via the opening in the substrate.
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公开(公告)号：US11832057B2
公开(公告)日：2023-11-28
申请号：US18064896
申请日：2022-12-12
发明人： Yu Hui , Guofeng Chen
CPC分类号： H04R17/02 , B81B3/0021 , H10N30/2047 , B81B2201/0257 , H04R2201/003
摘要： A piezoelectric microelectromechanical systems microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can include a single piezoelectric film layer disposed over the top end of the substrate and defining a diaphragm structure, the single piezoelectric film layer having substantially zero residual stress and formed from a piezoelectric wafer. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when subjected to sound pressure via the opening in the substrate.
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公开(公告)号：US20230283963A1
公开(公告)日：2023-09-07
申请号：US18176598
申请日：2023-03-01
CPC分类号： H04R17/02 , H04R1/04 , H04R1/086 , H04R3/00 , H04R2201/003
摘要： A piezoelectric microelectromechanical system microphone assembly comprises a carrier substrate including one of a through-hole or a recess, and a package including a microelectromechanical system die having a piezoelectric microelectromechanical system microphone mounted on a microphone substrate and a lid, at least a portion of the package disposed within the one of the through-hole or recess.
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公开(公告)号：US11716576B2
公开(公告)日：2023-08-01
申请号：US17674203
申请日：2022-02-17
CPC分类号： H04R17/02 , H04R7/08 , H04R7/18 , H10N30/508 , H04R2201/003
摘要： A piezoelectric microelectromechanical system microphone comprises a piezoelectric element configured to deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric element, a sensing electrode disposed on the piezoelectric element and configured to sense the electrical potential, and a dummy electrode electrically unconnected to the sensing electrode and disposed on a portion of the piezoelectric element that is free of the sensing electrode, the dummy electrode configured to reduce static deformation of the piezoelectric element caused by residual stresses in the piezoelectric element.
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公开(公告)号：US20230239641A1
公开(公告)日：2023-07-27
申请号：US18156155
申请日：2023-01-18
发明人： Guofeng Chen , Yu Hui
CPC分类号： H04R31/006 , B81B3/0072 , B81C1/00666 , H04R7/04 , H04R7/18 , H04R17/02 , H04R19/04 , H04R31/003 , B81B2201/0257 , B81B2203/0127 , B81B2203/0307 , B81C2201/0105 , B81C2201/0132 , B81C2203/0118 , H04R2201/003
摘要： A method for manufacturing a microelectromechanical systems (MEMS) microphone comprises depositing a membrane on a first sacrificial layer, wherein the first sacrificial layer is deposited on a substrate, etching the substrate to define a cavity, releasing the membrane by removing at least the first sacrificial layer, and forming at least one anchor at the edge of the membrane.
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公开(公告)号：US20230136347A1
公开(公告)日：2023-05-04
申请号：US18050906
申请日：2022-10-28
发明人： You Qian , Rakesh Kumar , Guofeng Chen
摘要： A method for making a cantilever sensor includes forming a beam extending between a proximal portion and a distal end, and forming and attaching an electrode on the proximal portion. The beam is attached to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal end of the beam is unsupported. The method includes modifying the resonance frequency of the cantilever sensor by forming at least the tip of the beam of a material having one or both of a density and Young's modulus that provides the desired resonant frequency, or by forming at least the tip of the beam so that it has a greater height in a Z direction transverse to a length of the beam than the proximal portion of the beam to thereby tune a resonant frequency of the sensor.
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公开(公告)号：US20230125523A1
公开(公告)日：2023-04-27
申请号：US18047443
申请日：2022-10-18
IPC分类号： H04R17/02 , H01L41/113 , H04R7/10 , H04R3/00
摘要： A piezoelectric sensor (e.g., for use in a piezoelectric MEMS microphone) includes a substrate and a cantilever beam attached to the substrate. The cantilever beam has a proximal portion attached to the substrate and extending to an unsupported distal end. An electrode is disposed on or in the proximal portion of the beam and has an outer boundary with a shape substantially corresponding to a contour line of a strain distribution plot for the cantilever beam resulting from a force applied to the cantilever beam.
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