公开(公告)号：US10658293B2

公开(公告)日：2020-05-19

申请号：US16232370

申请日：2018-12-26

Applicant: SOCIONEXT INC.

Inventor： Tomoyuki Kirimura

IPC: H01L23/528 ,  H01L27/118 ,  G06F30/00 ,  G06F30/394 ,  H01L23/522 ,  H01L23/58 ,  H01L27/02 ,  H01L27/092 ,  H01L29/78 ,  H01L29/775 ,  H01L21/768 ,  H01L21/02 ,  H01L21/265 ,  H01L21/311 ,  H01L21/321 ,  H01L21/8238 ,  H01L23/532 ,  H01L29/167

Abstract: A semiconductor device having a plurality of first wirings (X-direction) which include a first power supply line and a second power supply line, a plurality of third wirings (X-direction) which include a third (fourth) power supply line that is located above the first (second) power supply line and is electrically connected to the first (second) power supply line. The semiconductor device also has a plurality of second wirings (Y-direction) that include a first (second) connection wiring located above the first (second) power supply line and below the third (fourth) power supply line that is electrically connected to the first (second) power supply line and to the third (fourth) power supply line.

公开(公告)号：US10204858B2

公开(公告)日：2019-02-12

申请号：US15785762

申请日：2017-10-17

Applicant: Socionext Inc.

Inventor： Tomoyuki Kirimura

IPC: H01L23/52 ,  H01L23/528 ,  H01L23/522 ,  H01L23/58 ,  H01L27/02 ,  G06F17/50 ,  H01L29/78 ,  H01L21/02 ,  H01L21/265 ,  H01L21/311 ,  H01L21/321 ,  H01L21/768 ,  H01L21/8238 ,  H01L23/532 ,  H01L27/092 ,  H01L29/167 ,  H01L27/118 ,  H01L29/775

Abstract: A semiconductor device having a plurality of first wirings (X-direction) which include a first power supply line and a second power supply line, a plurality of third wirings (X-direction) which include a third (fourth) power supply line that is located above the first (second) power supply line and is electrically connected to the first (second) power supply line. The semiconductor device also has a plurality of second wirings (Y-direction) that include a first (second) connection wiring located above the first (second) power supply line and below the third (fourth) power supply line that is electrically connected to the first (second) power supply line and to the third (fourth) power supply line.

公开(公告)号：US20180114755A1

公开(公告)日：2018-04-26

申请号：US15785762

申请日：2017-10-17

Applicant: Socionext Inc.

Inventor： Tomoyuki Kirimura

IPC: H01L23/528 ,  H01L23/522 ,  H01L23/58 ,  H01L27/02

CPC classification number: H01L23/5286 ,  G06F17/50 ,  G06F17/5077 ,  H01L21/02164 ,  H01L21/02167 ,  H01L21/0217 ,  H01L21/26513 ,  H01L21/31111 ,  H01L21/3212 ,  H01L21/76802 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76877 ,  H01L21/823814 ,  H01L21/823828 ,  H01L21/823871 ,  H01L21/823878 ,  H01L23/5226 ,  H01L23/53238 ,  H01L23/53266 ,  H01L23/53295 ,  H01L23/58 ,  H01L27/0207 ,  H01L27/092 ,  H01L27/11807 ,  H01L29/167 ,  H01L29/775 ,  H01L29/785 ,  H01L2027/11875 ,  H01L2027/11881 ,  H01L2027/11887

Abstract: In a semiconductor device, a plurality of first wirings (X-direction) include a first power supply line and a second power supply line, a plurality of third wirings (X-direction) include a third (fourth) power supply line that is located above the first (second) power supply line and electrically connected to the first (second) power supply line, and a plurality of second wirings (Y-direction) include a first (second) connection wiring that is located above the first (second) power supply line and below the third (fourth) power supply line and electrically connected to the first (second) power supply line and to the third (fourth) power supply line.

公开(公告)号：US20190131239A1

公开(公告)日：2019-05-02

申请号：US16232370

申请日：2018-12-26

Applicant: SOCIONEXT INC.

Inventor： Tomoyuki Kirimura

IPC: H01L23/528 ,  H01L27/092 ,  G06F17/50 ,  H01L27/02 ,  H01L23/58 ,  H01L23/522 ,  H01L29/78 ,  H01L27/118

Abstract: A semiconductor device having a plurality of first wirings (X-direction) which include a first power supply line and a second power supply line, a plurality of third wirings (X-direction) which include a third (fourth) power supply line that is located above the first (second) power supply line and is electrically connected to the first (second) power supply line. The semiconductor device also has a plurality of second wirings (Y-direction) that include a first (second) connection wiring located above the first (second) power supply line and below the third (fourth) power supply line that is electrically connected to the first (second) power supply line and to the third (fourth) power supply line.