Online Adjustable Magnet Bar
    2.
    发明申请
    Online Adjustable Magnet Bar 审中-公开
    在线可调磁棒

    公开(公告)号:US20160013034A1

    公开(公告)日:2016-01-14

    申请号:US14378383

    申请日:2013-02-13

    Abstract: An end-block for rotatably carrying a sputtering target tube and for rotatably restraining a magnet bar inside the sputtering target tube includes a receptacle for receiving a magnet bar fitting. The receptacle comprises a first part of a signal connector arranged to receive a second part of a signal connector from the magnet bar fitting, and allow a signal connector between the end-block and the magnet bar to be formed. The end-block is adapted for providing protection means to the signal connector for protecting it from degradation, destruction or interference of a power and/or data signal transmitted between the end-block and the magnet bar, due to surrounding cooling fluid and/or surrounding high energy fields. The disclosure provides a corresponding magnet bar, and a method for adjusting a magnetic configuration of a magnet bar in a cylindrical sputtering apparatus.

    Abstract translation: 用于可旋转地承载溅射靶管并用于可旋转地限制溅射靶管内的磁棒的端块包括用于容纳磁棒配件的插座。 插座包括信号连接器的第一部分,其被布置成从磁条接头接收信号连接器的第二部分,并且允许形成端块和磁棒之间的信号连接器。 端块适于为信号连接器提供保护装置,用于防止由于周围的冷却流体和/或(例如)在端块和磁棒之间传输的功率和/或数据信号的劣化,破坏或干扰, 围绕高能场。 本公开内容提供了相应的磁棒,以及用于调整圆柱形溅射装置中磁棒的磁性构造的方法。

    Sputter System for Uniform Sputtering
    3.
    发明申请
    Sputter System for Uniform Sputtering 审中-公开
    用于均匀溅射的溅射系统

    公开(公告)号:US20170029940A1

    公开(公告)日:2017-02-02

    申请号:US15304132

    申请日:2015-04-14

    Abstract: A sputter system for applying a coating on a substrate is described. The sputter system comprises at least two cylindrical sputter units for the joint sputtering of a single coating. Each sputter unit comprising an elongated magnet configuration and at least one elongated magnet configuration comprising a plurality of magnet structures and magnet structure control systems along the length direction of the elongated magnet configuration. At least one magnet structure is adjustable in position and/or shape by a magnet structure control system, while a sputter target is mounted on the sputter unit.

    Abstract translation: 描述了一种用于在基底上涂覆涂层的溅射系统。 溅射系统包括用于单个涂层的联合溅射的至少两个圆柱形溅射单元。 每个溅射单元包括细长磁体构造和至少一个细长磁体构造,其包括沿细长磁体构造的长度方向的多个磁体结构和磁体结构控制系统。 至少一个磁体结构通过磁体结构控制系统在位置和/或形状上是可调节的,而溅射靶安装在溅射单元上。

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