公开(公告)号：US20170122530A1

公开(公告)日：2017-05-04

申请号：US15344206

申请日：2016-11-04

Applicant: SORAA, INC.

Inventor： FRANK TIN CHUNG SHUM ,  ARTEM MISHIN ,  ZINOVY DOLGONOSOV ,  CLIFFORD JUE ,  ABDUL ASSAAD ,  AURELIEN J.F. DAVID ,  WILFRED MARTIS

IPC: F21V17/10 ,  F21V29/77 ,  F21V7/00 ,  F21V23/00 ,  F21K9/238 ,  F21K9/237 ,  F21K9/232 ,  H05B37/02 ,  F21K9/233 ,  F21V23/06 ,  F21V5/04 ,  F21K9/235

CPC classification number: F21V17/105 ,  F21K9/23 ,  F21K9/232 ,  F21K9/233 ,  F21K9/235 ,  F21K9/237 ,  F21K9/238 ,  F21K9/60 ,  F21V5/04 ,  F21V7/00 ,  F21V7/0091 ,  F21V9/08 ,  F21V9/14 ,  F21V23/003 ,  F21V23/06 ,  F21V29/773 ,  F21V29/83 ,  F21Y2115/10 ,  H05B37/0272

Abstract: Accessories for LED lamp systems and methods of attaching accessories to illumination sources (e.g., LED lamps) are disclosed. A beam shaping accessories mechanically affixed to the LED lamp. The lens is designed to adapt to a first fixture that is mechanically attached to the lens. Accessories are designed to have a second fixture for mating to the first fixture such that the first fixture and the second fixture are configured to produce a retaining force between the first accessory and the lens. The retaining force is a mechanical force that is accomplished by mechanical mating of mechanical fixtures, or the retaining force is a magnetic force and is accomplished by magnetic fixtures configured to have attracting magnetic forces. In some embodiments, the accessory is treated to modulate an emanated light pattern (e.g., a rectangular, or square, or oval, or circular or diffused emanated light pattern). A USB connector is also provided.

公开(公告)号：US20190338929A1

公开(公告)日：2019-11-07

申请号：US16385045

申请日：2019-04-16

Applicant: Soraa, Inc.

Inventor： FRANK TIN CHUNG SHUM ,  ARTEM MISHIN ,  ZINOVY DOLGONOSOV ,  CLIFFORD JUE ,  ABDUL ASSAAD ,  AURELIEN J.F. DAVID ,  WILFRED MARTIS

IPC: F21V17/10 ,  F21K9/237 ,  F21V29/83 ,  F21V29/77 ,  F21K9/238 ,  F21K9/232 ,  F21V23/06 ,  F21K9/23 ,  F21K9/233 ,  F21K9/235 ,  H05B37/02 ,  F21V5/04 ,  F21V7/00 ,  F21V23/00 ,  F21K9/60

Abstract: Accessories for LED lamp systems and methods of attaching accessories to illumination sources (e.g., LED lamps) are disclosed. A beam shaping accessories mechanically affixed to the LED lamp. The lens is designed to adapt to a first fixture that is mechanically attached to the lens. Accessories are designed to have a second fixture for mating to the first fixture such that the first fixture and the second fixture are configured to produce a retaining force between the first accessory and the lens. The retaining force is a mechanical force that is accomplished by mechanical mating of mechanical fixtures, or the retaining force is a magnetic force and is accomplished by magnetic fixtures configured to have attracting magnetic forces. In some embodiments, the accessory is treated to modulate an emanated light pattern (e.g., a rectangular, or square, or oval, or circular or diffused emanated light pattern). A USB connector is also provided.

公开(公告)号：US20140145235A1

公开(公告)日：2014-05-29

申请号：US14171885

申请日：2014-02-04

Applicant: SORAA, INC.

Inventor： FRANK TIN CHUNG SHUM

IPC: H01L33/60 ,  H01L33/64

CPC classification number: H01L33/60 ,  H01L33/46 ,  H01L33/486 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00

Abstract: System and method for LED packaging. The present invention is directed to optical devices. More specifically, embodiments of the presentation provide LED packaging having one or more reflector surfaces. In certain embodiments, the present invention provides LED packages that include thermal pad structures for dissipating heat generated by LED devices. In particular, thermal pad structures with large surface areas are used to allow heat to transfer. In certain embodiments, thick thermally conductive material is used to improve overall thermal conductivity of an LED package, thereby allowing heat generated by LED devices to dissipate quickly. Depending on the application, thermal pad structure, thick thermal conductive layer, and reflective surface may be individually adapted in LED packages or used in combinations. There are other embodiments as well.

Abstract translation: LED封装的系统和方法。 本发明涉及光学器件。 更具体地，演示的实施例提供具有一个或多个反射器表面的LED封装。 在某些实施例中，本发明提供了包括散热由LED器件产生的热量的散热垫结构的LED封装。 特别地，使用具有大表面积的散热垫结构来允许热量传递。 在某些实施例中，使用厚导热材料来改善LED封装的整体导热性，从而允许由LED器件产生的热量快速消散。 根据应用，热垫结构，厚导热层和反射表面可以单独地适用于LED封装或组合使用。 还有其它实施例。