公开(公告)号：US09865554B2

公开(公告)日：2018-01-09

申请号：US14955033

申请日：2015-11-30

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Il Kwon Shim ,  Kyung Moon Kim ,  HeeJo Chi ,  JunMo Koo ,  Bartholomew Liao Chung Foh ,  Zigmund Ramirez Camacho

IPC: H01L21/60 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L24/03 ,  H01L23/3192 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03001 ,  H01L2224/03318 ,  H01L2224/0332 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/039 ,  H01L2224/03901 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05555 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/0558 ,  H01L2224/05664 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/94 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2924/01074 ,  H01L2224/05164 ,  H01L2224/05644 ,  H01L2224/3318

Abstract: An integrated circuit packaging system and method of manufacture thereof including: providing a substrate; forming contact pads on top of the substrate; forming a protection layer on top of the contact pads and the substrate; exposing the contact pads from the protection layer; printing under bump metallization (UBM) layers over the exposed contact pads extended over the protection layer with conductive inks; and forming bumps on top of the under bump metallization layers. It also including: printing an adhesion layer using conductive ink, wherein the adhesion layer comprises interconnected adhesion layer pads; forming additional under bump metallization (UBM) layers and bumps on top of the adhesion layer pads utilizing an electro-deposition process; and removing connections among the interconnected adhesion layer pads.