公开(公告)号：US20130214425A1

公开(公告)日：2013-08-22

申请号：US13654850

申请日：2012-10-18

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Dominique Marais ,  Jacques Chavade ,  Rémi Brechignac ,  Eric Saugier ,  Romain Coffy ,  Luc Petit

IPC: H01L23/535

CPC classification number: H01L25/0652 ,  H01L23/3677 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0206 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/1053

Abstract: An electronic package includes a substrate wafer with an interconnect network. A first chip is fixed to a front of the substrate, connected to the interconnect network and encapsulated by a body. A second chip is placed on a back side of the substrate wafer and connected to the interconnect network by back-side connection elements interposed between the back side of the substrate and a front side of the second chip. Front-side connection elements are placed on the front side of the substrate and connected to the interconnect network. The connection elements extend beyond the frontal face of the body. The package may be mounted on a board with an interposed thermally conductive material.

Abstract translation: 电子封装包括具有互连网络的衬底晶片。 第一芯片固定到基板的前部，连接到互连网络并由主体封装。 第二芯片放置在基板晶片的背面，并通过设置在基板的背面和第二芯片的前侧之间的背面连接元件连接到互连网络。 前端连接元件放置在基板的正面并连接到互连网络。 连接元件延伸超出身体的正面。 封装可以安装在具有插入的导热材料的板上。

公开(公告)号：US09006904B2

公开(公告)日：2015-04-14

申请号：US13654850

申请日：2012-10-18

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Dominique Marais ,  Jacques Chavade ,  Rémi Brechignac ,  Eric Saugier ,  Romain Coffy ,  Luc Petit

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/367 ,  H01L25/065 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L25/0652 ,  H01L23/3677 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0206 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/1053

Abstract: An electronic package includes a substrate wafer with an interconnect network. A first chip is fixed to a front of the substrate, connected to the interconnect network and encapsulated by a body. A second chip is placed on a back side of the substrate wafer and connected to the interconnect network by back-side connection elements interposed between the back side of the substrate and a front side of the second chip. Front-side connection elements are placed on the front side of the substrate and connected to the interconnect network. The connection elements extend beyond the frontal face of the body. The package may be mounted on a board with an interposed thermally conductive material.

Abstract translation: 电子封装包括具有互连网络的衬底晶片。 第一芯片固定到基板的前部，连接到互连网络并由主体封装。 第二芯片放置在基板晶片的背面，并通过设置在基板的背面和第二芯片的前侧之间的背面连接元件连接到互连网络。 前端连接元件放置在基板的正面并连接到互连网络。 连接元件延伸超出身体的正面。 封装可以安装在具有插入的导热材料的板上。