-
公开(公告)号：US10978400B2
公开(公告)日：2021-04-13
申请号：US16390889
申请日：2019-04-22
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： Eric Saugier
IPC: H01L23/538 , H01L21/768 , H01L23/498
Abstract: The disclosure concerns a semiconductor chip, which may be an interposer, having conductive through vias having a parallelepipedal shape.
-
2.发明授权公开(公告)号：US10483408B2
公开(公告)日：2019-11-19
申请号：US15689976
申请日：2017-08-29
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Karine Saxod , Alexandre Mas , Eric Saugier , Gaetan Lobascio , Benoit Besancon
IPC: H01L31/0203 , H01L31/18 , H01L31/0232 , H01L31/02 , H01L31/12 , B29C45/14 , H01L33/48 , B29L31/34
Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.
-
公开(公告)号：US20170345796A1
公开(公告)日：2017-11-30
申请号：US15391211
申请日：2016-12-27
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Eric Saugier
IPC: H01L25/065 , H01L23/538 , H01L21/822
Abstract: An electronic device includes a carrier substrate, a first electronic chip and a second chip. The first chip is mounted on the carrier substrate via interposed electrical connection elements electrically connecting a front electrical connection network of the first chip and an electrical connection network of the carrier substrate. The second chip is mounted on the first chip via interposed electrical connection elements electrically connecting a front electrical connection network of the second chip and a back electrical connection network of the first chip Electrical connection wires electrically connect the back electrical connection network of the first chip to the electrical connection network of the carrier substrate.
-
4.发明申请公开(公告)号：US20180190838A1
公开(公告)日：2018-07-05
申请号：US15689976
申请日：2017-08-29
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Karine Saxod , Alexandre Mas , Eric Saugier , Gaetan Lobascio , Benoit Besancon
IPC: H01L31/0203 , H01L31/18 , H01L31/0232 , H01L31/02 , H01L31/12 , B29C45/14
CPC classification number: H01L31/0203 , B29C45/14065 , B29C45/14639 , B29C45/14778 , B29K2995/0026 , B29L2031/3481 , H01L31/02002 , H01L31/02325 , H01L31/02327 , H01L31/12 , H01L31/18 , H01L33/483
Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.
-
公开(公告)号：US20170256514A1
公开(公告)日：2017-09-07
申请号：US15238921
申请日：2016-08-17
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Eric Saugier
CPC classification number: H01L24/17 , H01L21/82 , H01L23/481 , H01L24/81 , H01L27/14618 , H01L27/14636 , H01L27/14638 , H01L27/14683 , H01L31/02 , H01L2924/14
Abstract: Electronic devices are collectively fabricated from a main wafer which includes optical elements and a secondary wafer that are mounted one on top of the other to form a combined wafer. A mounting face of the secondary wafer is mated to a front face of the main wafer in such a manner that recesses within the mounting face of the secondary wafer are aligned over the optical elements. The thickness of the secondary wafer reduced until the recesses are opened to form ring structures with openings at the recesses. The combined wafer is diced to form electronic devices. A base wafer of the main wafer and the secondary wafer are made of a same semiconductor material (for example, silicon).
-
Patent Agency Ranking
公开(公告)号：US20130248887A1
公开(公告)日：2013-09-26
申请号：US13845445
申请日：2013-03-18
Inventor： Romain Coffy , Eric Saugier , Hk Looi , Norbert Chevrier
IPC: H01L31/0203 , H01L31/18
CPC classification number: H01L31/0203 , G01S7/481 , G01S17/026 , H01L25/167 , H01L31/18 , H01L2224/48091 , H01L2224/49175 , H01L2924/181 , H03K17/941 , H03K2017/9455 , H03K2217/94026 , H03K2217/94112 , H01L2924/00014 , H01L2924/00012
Abstract: An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.
Abstract translation: 光学电子封装包括固定到晶片的透射芯片和接收芯片。 透明封装结构由形成在发射机芯片和接收芯片的至少一部分上的透明板和透明封装块形成，透明封装块嵌入发射器芯片。 不透明的封装块在透明板上延伸并且包括露出透明板的前部区域的开口。 前部区域位于发射芯片的光发射机之上，相对于接收芯片的光学传感器横向偏移。
-
7.发明授权公开(公告)号：US11688815B2
公开(公告)日：2023-06-27
申请号：US17081299
申请日：2020-10-27
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor： Karine Saxod , Alexandre Mas , Eric Saugier , Gaetan Lobascio , Benoit Besancon
IPC: H01L31/02 , H01L31/0203 , H01L31/18 , H01L31/0232 , H01L31/12 , B29C45/14 , H01L33/48 , B29L31/34
CPC classification number: H01L31/0203 , B29C45/14065 , B29C45/14639 , H01L31/02002 , H01L31/02325 , H01L31/02327 , H01L31/12 , H01L31/18 , H01L33/483 , B29C45/14778 , B29K2995/0026 , B29L2031/3481
Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.
-
公开(公告)号：US10811349B2
公开(公告)日：2020-10-20
申请号：US16110121
申请日：2018-08-23
Inventor： David Auchere , Laurent Schwarz , Deborah Cogoni , Eric Saugier
IPC: H01L23/498 , H01L23/538 , H01L23/00 , H05K1/18 , H01L23/31 , H01L23/13 , H01L21/56 , H01L21/78
Abstract: An electronic device includes a support wafer, an electronic chip and an encapsulating block for the electronic chip above the support wafer. The support wafer is provided with a first network of electrical connections and a second network of electrical connections formed solely by tracks. First electrical connection elements are interposed between first front electrical contacts of the electronic chip and rear electrical contacts of the first network. Second electrical connection elements are interposed between second front electrical contacts of the electronic chip and internal electrical contact zones of the tracks of the second network. The first network includes front external electrical contacts and the tracks exhibiting external electrical contact zones.
-
公开(公告)号：US20130214425A1
公开(公告)日：2013-08-22
申请号：US13654850
申请日：2012-10-18
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor： Dominique Marais , Jacques Chavade , Rémi Brechignac , Eric Saugier , Romain Coffy , Luc Petit
IPC: H01L23/535
CPC classification number: H01L25/0652 , H01L23/3677 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06572 , H01L2225/06586 , H01L2225/06589 , H01L2924/00 , H01L2924/00012 , H01L2924/15311 , H01L2924/3011 , H05K1/0206 , H05K3/3436 , H05K2201/10515 , H05K2201/1053
Abstract: An electronic package includes a substrate wafer with an interconnect network. A first chip is fixed to a front of the substrate, connected to the interconnect network and encapsulated by a body. A second chip is placed on a back side of the substrate wafer and connected to the interconnect network by back-side connection elements interposed between the back side of the substrate and a front side of the second chip. Front-side connection elements are placed on the front side of the substrate and connected to the interconnect network. The connection elements extend beyond the frontal face of the body. The package may be mounted on a board with an interposed thermally conductive material.
Abstract translation: 电子封装包括具有互连网络的衬底晶片。 第一芯片固定到基板的前部，连接到互连网络并由主体封装。 第二芯片放置在基板晶片的背面，并通过设置在基板的背面和第二芯片的前侧之间的背面连接元件连接到互连网络。 前端连接元件放置在基板的正面并连接到互连网络。 连接元件延伸超出身体的正面。 封装可以安装在具有插入的导热材料的板上。
-
公开(公告)号：US09105766B2
公开(公告)日：2015-08-11
申请号：US13845445
申请日：2013-03-18
Inventor： Romain Coffy , Eric Saugier , Hk Looi , Norbert Chevrier
IPC: H01L33/48 , H01L31/0203 , H01L31/18 , G01S17/02 , H01L25/16 , H03K17/94 , G01S7/481 , H03K17/945
CPC classification number: H01L31/0203 , G01S7/481 , G01S17/026 , H01L25/167 , H01L31/18 , H01L2224/48091 , H01L2224/49175 , H01L2924/181 , H03K17/941 , H03K2017/9455 , H03K2217/94026 , H03K2217/94112 , H01L2924/00014 , H01L2924/00012
Abstract: An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.
Abstract translation: 光学电子封装包括固定到晶片的透射芯片和接收芯片。 透明封装结构由形成在发射机芯片和接收芯片的至少一部分上的透明板和透明封装块形成，透明封装块嵌入发射器芯片。 不透明的封装块在透明板上延伸并且包括露出透明板的前部区域的开口。 前部区域位于发射芯片的光发射机之上，相对于接收芯片的光学传感器横向偏移。
-
-
-
-
-
-
-
-
-
Search Results
14
records
(took 0.016 seconds)
