公开(公告)号：US20130200484A1

公开(公告)日：2013-08-08

申请号：US13684057

申请日：2012-11-21

Applicant: STMicroelectronics S.r.l.

Inventor： Flavio VILLA ,  Gabriele BARLOCCHI ,  Pietro CORONA

IPC: H01L21/762 ,  H01L29/06

CPC classification number: H01L21/76283 ,  H01L21/3003 ,  H01L21/3247 ,  H01L21/76289 ,  H01L21/764 ,  H01L29/0649 ,  Y10S438/967

Abstract: A process for manufacturing an SOI wafer, including the steps of: forming, in a wafer of semiconductor material, cavities delimiting structures of semiconductor material; thinning out the structures through a thermal process; and completely oxidizing the structures.

Abstract translation: 一种制造SOI晶片的方法，包括以下步骤：在半导体材料的晶片中形成限定半导体材料结构的空腔; 通过热过程稀释结构; 并完全氧化结构。

公开(公告)号：US20130273548A1

公开(公告)日：2013-10-17

申请号：US13858156

申请日：2013-04-08

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Ubaldo MASTROMATTEO ,  Flavio Francesco VILLA ,  Gabriele BARLOCCHI

IPC: G01N1/28

CPC classification number: G01N1/28 ,  B01L3/502 ,  B01L3/5027 ,  B01L2300/0681 ,  B01L2300/0829 ,  B01L2300/0864 ,  B01L2300/0867 ,  B01L2400/0478 ,  B01L2400/0616 ,  C12N15/1017 ,  C12Q1/6806 ,  G01N1/405

Abstract: The device has a fluid inlet; a filtering compartment, connected to the fluid inlet and accommodating a filtering matrix in presence of adsorption agents; a fluidic circuit connected downstream of the filtering compartment and including a discharge circuit and a loading circuit; a discharge chamber, connected downstream of the discharge circuit; a preparation outlet, connected downstream of the loading circuit; and suction pumps, connected to the fluidic circuit and configured so as to fluidically connect the filtering compartment alternatively to the discharge circuit or to the loading circuit.

Abstract translation: 该装置具有流体入口; 过滤室，连接到流体入口并在吸附剂存在下容纳过滤基质; 连接在过滤室下游的流体回路，包括一个放电回路和一个加载电路; 放电室，连接在放电电路的下游; 一个准备出口，连接在负载电路的下游; 和抽吸泵，其连接到流体回路并且构造成将过滤室与排放回路或加载回路交替地流体连接。