公开(公告)号：US09911810B2

公开(公告)日：2018-03-06

申请号：US15421100

申请日：2017-01-31

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Simona Lorenti ,  Cateno Marco Camalleri ,  Mario Giuseppe Saggio ,  Ferruccio Frisina

IPC: H01L29/78 ,  H01L29/10 ,  H01L21/324 ,  H01L21/02 ,  H01L21/3065 ,  H01L27/088 ,  H01L29/06 ,  H01L29/66 ,  H01L29/739 ,  H01L29/861 ,  H01L29/872 ,  H01L29/04

CPC classification number: H01L21/3247 ,  H01L21/02057 ,  H01L21/02381 ,  H01L21/02532 ,  H01L21/02579 ,  H01L21/0262 ,  H01L21/02639 ,  H01L21/3065 ,  H01L21/324 ,  H01L27/088 ,  H01L29/045 ,  H01L29/0634 ,  H01L29/1095 ,  H01L29/66333 ,  H01L29/66712 ,  H01L29/73 ,  H01L29/7395 ,  H01L29/7802 ,  H01L29/8611 ,  H01L29/872

Abstract: Process for manufacturing a semiconductor power device, wherein a trench is formed in a semiconductor body having a first conductivity type; the trench is annealed for shaping purpose; and the trench is filled with semiconductor material via epitaxial growth so as to obtain a first column having a second conductivity type. The epitaxial growth is performed by supplying a gas containing silicon and a gas containing dopant ions of the second conductivity type in presence of a halogenide gas and occurs with uniform distribution of the dopant ions. The flow of the gas containing dopant ions is varied according to a linear ramp during the epitaxial growth; in particular, in the case of selective growth of the semiconductor material in the presence of a hard mask, the flow decreases; in the case of non-selective growth, in the absence of hard mask, the flow increases.

公开(公告)号：US09607859B2

公开(公告)日：2017-03-28

申请号：US14788685

申请日：2015-06-30

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Simona Lorenti ,  Cateno Marco Camalleri ,  Mario Giuseppe Saggio ,  Ferruccio Frisina

IPC: H01L29/76 ,  H01L29/94 ,  H01L21/324 ,  H01L27/088 ,  H01L21/02 ,  H01L29/06 ,  H01L29/10 ,  H01L29/66 ,  H01L29/739 ,  H01L29/78 ,  H01L21/3065 ,  H01L29/73 ,  H01L29/861 ,  H01L29/872

CPC classification number: H01L21/3247 ,  H01L21/02057 ,  H01L21/02381 ,  H01L21/02532 ,  H01L21/02579 ,  H01L21/0262 ,  H01L21/02639 ,  H01L21/3065 ,  H01L21/324 ,  H01L27/088 ,  H01L29/045 ,  H01L29/0634 ,  H01L29/1095 ,  H01L29/66333 ,  H01L29/66712 ,  H01L29/73 ,  H01L29/7395 ,  H01L29/7802 ,  H01L29/8611 ,  H01L29/872

Abstract: Process for manufacturing a semiconductor power device, wherein a trench is formed in a semiconductor body having a first conductivity type; the trench is annealed for shaping purpose; and the trench is filled with semiconductor material via epitaxial growth so as to obtain a first column having a second conductivity type. The epitaxial growth is performed by supplying a gas containing silicon and a gas containing dopant ions of the second conductivity type in presence of a halogenide gas and occurs with uniform distribution of the dopant ions. The flow of the gas containing dopant ions is varied according to a linear ramp during the epitaxial growth; in particular, in the case of selective growth of the semiconductor material in the presence of a hard mask, the flow decreases; in the case of non-selective growth, in the absence of hard mask, the flow increases.

公开(公告)号：US20170141191A1

公开(公告)日：2017-05-18

申请号：US15421100

申请日：2017-01-31

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Simona Lorenti ,  Cateno Marco Camalleri ,  Mario Giuseppe Saggio ,  Ferruccio Frisina

IPC: H01L29/10 ,  H01L21/02 ,  H01L21/3065 ,  H01L27/088 ,  H01L29/04 ,  H01L29/66 ,  H01L29/739 ,  H01L29/78 ,  H01L29/861 ,  H01L29/872 ,  H01L21/324 ,  H01L29/06

CPC classification number: H01L21/3247 ,  H01L21/02057 ,  H01L21/02381 ,  H01L21/02532 ,  H01L21/02579 ,  H01L21/0262 ,  H01L21/02639 ,  H01L21/3065 ,  H01L21/324 ,  H01L27/088 ,  H01L29/045 ,  H01L29/0634 ,  H01L29/1095 ,  H01L29/66333 ,  H01L29/66712 ,  H01L29/73 ,  H01L29/7395 ,  H01L29/7802 ,  H01L29/8611 ,  H01L29/872

Abstract: Process for manufacturing a semiconductor power device, wherein a trench is formed in a semiconductor body having a first conductivity type; the trench is annealed for shaping purpose; and the trench is filled with semiconductor material via epitaxial growth so as to obtain a first column having a second conductivity type. The epitaxial growth is performed by supplying a gas containing silicon and a gas containing dopant ions of the second conductivity type in presence of a halogenide gas and occurs with uniform distribution of the dopant ions. The flow of the gas containing dopant ions is varied according to a linear ramp during the epitaxial growth; in particular, in the case of selective growth of the semiconductor material in the presence of a hard mask, the flow decreases; in the case of non-selective growth, in the absence of hard mask, the flow increases.