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    Apparatus and method for attaching an integrated circuit sensor to a substrate
    1.
    发明申请
    Apparatus and method for attaching an integrated circuit sensor to a substrate 有权

    公开(公告)号：US20040241905A1

    公开(公告)日：2004-12-02

    申请号：US10889725

    申请日：2004-07-13

    Applicant: STMicroelectronics, Inc.

    Inventor： Michael J. Hundt ,  Tiao Zhou

    IPC: H01L021/44

    CPC classification number: H01L21/565 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method of fabricating an integrated circuit sensor package. The method comprises the steps of: 1) mounting a substrate on a first mold block, the substrate comprising a substantially planar material having a first substrate surface and a second substrate surface that contacts a mounting surface of the first mold block; 2) placing an adhesive on the first substrate surface; 3) placing an integrated circuit sensor on the adhesive; and 4) pressing a second mold block against the first substrate surface. The second mold block comprising a cavity portion for receiving the integrated circuit sensor, a contact surface surrounding the cavity portion, and a compliant layer mounted with the cavity portion. Pressing the second mold block against the first substrate surface causes the contact surface to form with the first substrate surface a seal surrounding the integrated circuit sensor. Pressing also causes the compliant layer to press against a sensor array surface of the integrated circuit sensor, thereby pressing the integrated circuit sensor into the adhesive and the first substrate surface.

    Mold with compensating base
    3.
    发明申请
    Mold with compensating base 有权
    带补偿底座的模具

    公开(公告)号：US20030214074A1

    公开(公告)日：2003-11-20

    申请号：US10151323

    申请日：2002-05-20

    Applicant: STMicroelectronics, INC.

    Inventor： Michael J. Hundt ,  Tiao Zhou

    IPC: B29C031/00

    CPC classification number: H01L21/565 ,  H01L23/3121 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/14 ,  Y10S425/044 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom mold portion accommodates thickness variations in the packaging substrate, as well as non-planarity of the adhesive layer between the integrated circuit die and packaging substrate in exposed active area integrated circuits.

    Abstract translation: 用于传递模制系统的底部模具部分被可变形材料覆盖。 在模具夹紧期间，可变形材料接触其上安装有集成电路管芯的封装衬底的底表面。 在底部模具部分上的这种相对软的覆盖物的变形适应于封装衬底中的厚度变化，以及暴露的有源区域集成电路中集成电路管芯和封装衬底之间的粘合剂层的非平面性。

    Method and system for exposed die molding for integrated circuit packaging
    4.
    发明申请
    Method and system for exposed die molding for integrated circuit packaging 有权
    用于集成电路封装的裸露模具成型的方法和系统

    公开(公告)号：US20030148556A1

    公开(公告)日：2003-08-07

    申请号：US10062218

    申请日：2002-02-01

    Applicant: STMicroelectronics, Inc.

    Inventor： Tiao Zhou ,  Michael J. Hundt

    IPC: H01L021/48

    CPC classification number: H01L23/3107 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/00014

    Abstract: A method for exposed die molding for integrated circuit packaging is provided that includes providing a mold comprising an upper mold with a flexible material, a lower mold, and a floating plunger. A substrate of an integrated circuit structure is clamped between the upper mold and the lower mold. An integrated circuit die of the integrated circuit structure is clamped between the floating plunger and the upper mold through the flexible material.

    Abstract translation: 提供了一种用于集成电路封装的裸露模制成型的方法，其包括提供包括具有柔性材料的上模具，下模具和浮动柱塞的模具。 集成电路结构的基板夹在上模和下模之间。 集成电路结构的集成电路芯片通过柔性材料夹在浮动柱塞和上模之间。

    Apparatus and method for attaching an integrated circuit sensor to a substrate
    5.
    发明申请
    Apparatus and method for attaching an integrated circuit sensor to a substrate 有权
    用于将集成电路传感器附接到基板的装置和方法

    公开(公告)号：US20040012084A1

    公开(公告)日：2004-01-22

    申请号：US10201087

    申请日：2002-07-22

    Applicant: STMicroelectronics, Inc.

    Inventor： Michael J. Hundt ,  Tiao Zhou

    IPC: H01L023/34

    CPC classification number: H01L21/565 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method of fabricating an integrated circuit sensor package. The method comprises the steps of: 1) mounting a substrate on a first mold block, the substrate comprising a substantially planar material having a first substrate surface and a second substrate surface that contacts a mounting surface of the first mold block; 2) placing an adhesive on the first substrate surface; 3) placing an integrated circuit sensor on the adhesive; and 4) pressing a second mold block against the first substrate surface. The second mold block comprising a cavity portion for receiving the integrated circuit sensor, a contact surface surrounding the cavity portion, and a compliant layer mounted with the cavity portion. Pressing the second mold block against the first substrate surface causes the contact surface to form with the first substrate surface a seal surrounding the integrated circuit sensor. Pressing also causes the compliant layer to press against a sensor array surface of the integrated circuit sensor, thereby pressing the integrated circuit sensor into the adhesive and the first substrate surface.

    Abstract translation: 一种制造集成电路传感器封装的方法。 该方法包括以下步骤：1）将基板安装在第一模块上，该基板包括具有第一基板表面的基本上平面的材料和与第一模块的安装表面接触的第二基板表面; 2）将粘合剂放置在第一基板表面上; 3）将集成电路传感器放置在粘合剂上; 以及4）将第二模具块压靠在所述第一基板表面上。 第二模块包括用于接收集成电路传感器的空腔部分，围绕空腔部分的接触表面以及安装有空腔部分的顺应层。 将第二模具块压靠第一基板表面使得接触表面与第一基板表面形成围绕集成电路传感器的密封件。 按压也使得柔性层压在集成电路传感器的传感器阵列表面上，从而将集成电路传感器压入粘合剂和第一基板表面。

    Molded integrated circuit package with exposed active area
    6.
    发明申请
    Molded integrated circuit package with exposed active area 有权
    模制集成电路封装，具有暴露的有源区

    公开(公告)号：US20030214021A1

    公开(公告)日：2003-11-20

    申请号：US10151656

    申请日：2002-05-20

    Applicant: STMICROELECTRONICS, INC.

    Inventor： Tiao Zhou ,  Michael J. Hundt

    IPC: H01L023/02

    CPC classification number: H01L21/565 ,  H01L23/3121 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00

    Abstract: An integrated circuit die having an active area that must remain exposed after packaging is secured by a compliant die attachment by which the integrated circuit die is held in position within a transfer mold during encapsulation. The compliant die attachment may comprise a flexible, compressible tape having pressure-sensitive adhesive, alone or with a rigid substrate support, or a compliant adhesive preferably applied only around a periphery of the die attach area. Deformation of the compliant die attachment under mold clamping pressure allows complete contact of the mold with the active area, preventing bleeding of the encapsulating material under the edge of a mold portion onto the active area.

    Abstract translation: 具有必须在包装后必须保持暴露的有源区域的集成电路管芯通过柔性管芯附件来固定，通过该柔性管芯附件，集成电路管芯在封装期间保持在转移模具内就位。 柔性芯片附件可以包括具有压敏粘合剂的柔性可压缩带，其单独地或具有刚性基板支撑件，或者柔性粘合剂优选仅在芯片附着区域的周围施加。 在模具夹紧压力下，柔性模具附件的变形允许模具与活动区域完全接触，防止模具部件边缘下方的封装材料渗透到活动区域上。

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