公开(公告)号：US20020113247A1

公开(公告)日：2002-08-22

申请号：US10072817

申请日：2002-02-08

Applicant: STMicroelectronics S.r.I.

Inventor： Angelo Magri ,  Leonardo Fragapane

IPC: H01L029/76

CPC classification number: H01L24/06 ,  H01L23/49562 ,  H01L24/48 ,  H01L24/49 ,  H01L25/071 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01093 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A method of manufacturing an electronic structure, which structure comprises a first power device and a second unidirectional device, both integrated in the same protective package. The first device having at least first and second electrodes of the first device, with said first electrode of the first device being attached to the package. The second device having first and second electrodes of the second device, wherein the first electrode of the second device is superposed on the second electrode of the first device and connected electrically to the second electrode of the first device.

Abstract translation: 一种制造电子结构的方法，该结构包括集成在同一保护封装中的第一电力装置和第二单向装置。 所述第一装置具有所述第一装置的至少第一和第二电极，所述第一装置的所述第一电极附接到所述包装。 第二装置具有第二装置的第一和第二电极，其中第二装置的第一电极重叠在第一装置的第二电极上并与第一装置的第二电极电连接。