Abstract:
An electronic semiconductor device has a sublithographic contact area between a first conductive region and a second conductive region. The first conductive region is cup-shaped and has vertical walls which extend, in top plan view, along a closed line of elongated shape. One of the walls of the first conductive region forms a first thin portion and has a first dimension in a first direction. The second conductive region has a second thin portion having a second sublithographic dimension in a second direction transverse to the first dimension. The first and the second conductive regions are in direct electrical contact at their thin portions and form the sublithographic contact area. The elongated shape is chosen between rectangular and oval elongated in the first direction. Thereby, the dimensions of the contact area remain approximately constant even in presence of a small misalignment between the masks defining the conductive regions.
Abstract:
Presented is a memory cell integrated in a semiconductor substrate that includes a MOS device connected in series to a capacitive element. The MOS device has first and second conduction terminals, and the capacitive element has a lower electrode covered with a layer of a dielectric material and capacitively coupled to an upper electrode. The MOS device is overlaid by at least one metallization layer that is covered with at least one top insulating layer. The capacitive element is formed on the top insulating layer. The cell is unique in that the metallization layer extends only between the MOS device and the capacitive element.
Abstract:
A semiconductor memory such as a flash memory, which comprises at least one two-dimensional array of memory cells with a plurality of rows and columns of memory cells grouped in a plurality of packets. The memory cells belonging to the columns of each packet are formed in a respective semiconductor region with a first type of conductivity, this region being distinct from the semiconductor regions with the first type of conductivity in which the memory cells belonging to the columns of the remaining packets are formed. The semiconductor regions with the first type of conductivity divide the set of memory cells belonging to each row into a plurality of subsets of memory cells that constitute elemental memory units which can be modified individually. Thus memory units of very small dimensions can be erased individually, without excessive overhead in terms of area.
Abstract:
A process for manufacturing an array of cells, including: implanting, in a body of semiconductor material of a first conductivity type, a common conduction region of the first conductivity type; forming, in the body, above the common conduction region, a plurality of active area regions of a second conductivity type and a first doping level; forming, on top of the body, an insulating layer having first and second openings; implanting first portions of the active area regions through the first openings with a doping agent of the first conductivity type, thereby forming, in the active area regions, second conduction regions of the first conductivity type; implanting second portions of the active area regions through the second openings with a doping agent of the second conductivity type, thereby forming control contact regions of the second conductivity type and a second doping level, higher than the first doping level; forming, on top of the body, a plurality of storage components, each storage component having a terminal connected to a respective second conduction region.
Abstract:
A cell array is formed by a plurality of cells each including a selection bipolar transistor and a storage component. The cell array is formed in a body including a common collector region of P type; a plurality of base regions of N type, overlying the common collector region; a plurality of emitter regions of P type formed in the base regions; and a plurality of base contact regions of N type and a higher doping level than the base regions, formed in the base regions, wherein each base region is shared by at least two adjacent bipolar transistors.