公开(公告)号：US09184150B2

公开(公告)日：2015-11-10

申请号：US14487559

申请日：2014-09-16

Applicant: STMicroelectronics S.r.l.

Inventor： Giuseppe Cristaldi

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00

CPC classification number: H01L24/48 ,  H01L24/03 ,  H01L24/45 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45032 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48491 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2224/7855 ,  H01L2224/83203 ,  H01L2224/83801 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00011 ,  H01L2924/0132 ,  H01L2924/15747 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/013 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/00 ,  H01L2224/83205

Abstract: An electronic device includes a chip with an integrated electronic component and a terminal made of a first metal material. The device further includes a lead made of a second metal material different from the first metal material. A bonding wire made of a selected one of the first and second metal materials has opposite ends coupled with the terminal and the lead. An interface element having a first layer made of a selected one of the first and second metal materials and a second layer made of an unselected one of the first and second metal materials has the first layer coupled with the bonding wire and the second layer coupled with a component, wherein the component is ether the terminal or the lead.

Abstract translation: 电子设备包括具有集成电子部件的芯片和由第一金属材料制成的端子。 该装置还包括由与第一金属材料不同的第二金属材料制成的引线。 由所选择的第一和第二金属材料之一制成的接合线具有与端子和引线相连的相对端。 具有由第一和第二金属材料中的所选择的第一层构成的第一层和由第一和第二金属材料中的未选择的第二层制成的第二层的界面元件具有与接合线耦合的第一层，第二层与 组分，其中组分是末端或铅的醚。

公开(公告)号：US20150076712A1

公开(公告)日：2015-03-19

申请号：US14487559

申请日：2014-09-16

Applicant: STMicroelectronics S.r.l.

Inventor： Giuseppe Cristaldi

IPC: H01L23/00

CPC classification number: H01L24/48 ,  H01L24/03 ,  H01L24/45 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45032 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48491 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2224/7855 ,  H01L2224/83203 ,  H01L2224/83801 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00011 ,  H01L2924/0132 ,  H01L2924/15747 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/013 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/00 ,  H01L2224/83205

Abstract: An electronic device includes a chip with an integrated electronic component and a terminal made of a first metal material. The device further includes a lead made of a second metal material different from the first metal material. A bonding wire made of a selected one of the first and second metal materials has opposite ends coupled with the terminal and the lead. An interface element having a first layer made of a selected one of the first and second metal materials and a second layer made of an unselected one of the first and second metal materials has the first layer coupled with the bonding wire and the second layer coupled with a component, wherein the component is ether the terminal or the lead.

Abstract translation: 电子设备包括具有集成电子部件的芯片和由第一金属材料制成的端子。 该装置还包括由与第一金属材料不同的第二金属材料制成的引线。 由所选择的第一和第二金属材料之一制成的接合线具有与端子和引线相连的相对端。 具有由第一和第二金属材料中的所选择的第一层构成的第一层和由第一和第二金属材料中的未选择的第二层制成的第二层的界面元件具有与接合线耦合的第一层，第二层与 组分，其中组分是末端或铅的醚。