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公开(公告)号：US20130134610A1
公开(公告)日：2013-05-30
申请号：US13667318
申请日：2012-11-02
IPC分类号： H01L23/29
CPC分类号： H01L23/295 , C08C19/06 , C08K3/013 , C08L13/00 , C08L15/00 , C08L61/06 , C08L63/00 , C09D163/00 , C09D163/08 , H01L21/56 , H01L23/293 , H01L2924/0002 , H01L2924/12044 , C08L2666/04 , C08L2666/02 , C08L2666/22 , H01L2924/00
摘要： An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.
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公开(公告)号：US08519067B2
公开(公告)日：2013-08-27
申请号：US13667367
申请日：2012-11-02
CPC分类号： H01L23/295 , C08C19/06 , C08K3/013 , C08L13/00 , C08L15/00 , C08L61/06 , C08L63/00 , C09D163/00 , C09D163/08 , H01L21/56 , H01L23/293 , H01L2924/0002 , H01L2924/12044 , C08L2666/04 , C08L2666/02 , C08L2666/22 , H01L2924/00
摘要： An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.
摘要翻译： 根据本发明的用于封装半导体芯片的环氧树脂组合物包含（A）结晶环氧树脂，（B）由通式（1）表示的酚醛树脂：其中R 1和R 2独立地为氢或具有1至4个碳的烷基 原子和两个或更多个R 1或两个或更多个R 2相同或不同; a为0〜4的整数; b为0〜4的整数; c为0〜3的整数; n为平均值，为0〜10的数，（C）含有丁二烯衍生的结构单元或其衍生物的（共）聚合物，（D）80重量％〜95重量％的无机填料， 在总环氧树脂组合物中。
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公开(公告)号：US11015017B2
公开(公告)日：2021-05-25
申请号：US16964026
申请日：2019-01-30
发明人： Takahiro Kotani , Hiroshi Shibata
摘要： The resin composition for encapsulating semiconductor of the present invention is a resin composition for encapsulating semiconductor including an epoxy resin, a curing agent, an inorganic filler, and carbon black fine particles, in which when the resin composition for encapsulating semiconductor is injection-molded to have a length of 80 mm, a width of 10 mm and a thickness of 4 mm under conditions of a mold temperature of 175° C., an injection pressure of 10 MPa, and a curing time of 120 seconds, and then heated at 175° C. for 4 hours to obtain a cured product, and then a surface of the obtained cured product is observed with a fluorescence microscope, a maximum particle diameter of aggregates of the carbon black fine particles is 50 μm or less.
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公开(公告)号：US08921461B2
公开(公告)日：2014-12-30
申请号：US13667318
申请日：2012-11-02
IPC分类号： C08K7/20 , C08K7/28 , C08L61/08 , C08L63/00 , H01L23/29 , C08L61/06 , C09D163/08 , C09D163/00 , C08K3/00 , C08L13/00 , C08C19/06 , C08L15/00
CPC分类号： H01L23/295 , C08C19/06 , C08K3/013 , C08L13/00 , C08L15/00 , C08L61/06 , C08L63/00 , C09D163/00 , C09D163/08 , H01L21/56 , H01L23/293 , H01L2924/0002 , H01L2924/12044 , C08L2666/04 , C08L2666/02 , C08L2666/22 , H01L2924/00
摘要： An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.
摘要翻译： 根据本发明的用于封装半导体芯片的环氧树脂组合物包含（A）结晶环氧树脂，（B）由通式（1）表示的酚醛树脂：其中R 1和R 2独立地为氢或具有1至4个碳的烷基 原子和两个或更多个R 1或两个或更多个R 2相同或不同; a为0〜4的整数; b为0〜4的整数; c为0〜3的整数; n为平均值，为0〜10的数，（C）含有丁二烯衍生的结构单元或其衍生物的（共）聚合物，（D）80重量％〜95重量％的无机填料， 在总环氧树脂组合物中。
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公开(公告)号：US08697803B2
公开(公告)日：2014-04-15
申请号：US13667344
申请日：2012-11-02
CPC分类号： H01L23/295 , C08C19/06 , C08K3/013 , C08L13/00 , C08L15/00 , C08L61/06 , C08L63/00 , C09D163/00 , C09D163/08 , H01L21/56 , H01L23/293 , H01L2924/0002 , H01L2924/12044 , C08L2666/04 , C08L2666/02 , C08L2666/22 , H01L2924/00
摘要： An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.
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