公开(公告)号：US09281229B2

公开(公告)日：2016-03-08

申请号：US14556298

申请日：2014-12-01

申请人： SUSS MicroTec Lithography GmbH

发明人： Gregory George ,  Hale Johnson ,  Patrick Gorun ,  Emmett Hughlett ,  James Hermanowski ,  Matthew Stiles

IPC分类号： B32B38/10 ,  H01L21/683 ,  B32B43/00 ,  H01L21/67 ,  H01L21/673 ,  B32B38/18

CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

摘要： A method for debonding two temporary bonded wafers, includes providing a debonder comprising a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly and an X-axis drive control configured to drive horizontally the X-axis carriage drive and the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. Next, loading a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly. Next, driving the X-axis carriage drive and the bottom chuck assembly to the process zone under the top chuck assembly. Next, placing the unbonded surface of the carrier wafer in contact with the top chuck assembly and holding the carrier wafer by the top chuck assembly. Next, initiating horizontal motion of the X-axis carriage drive while heat is applied to the carrier wafer and while the carrier wafer is held by the top chuck assembly.

摘要翻译： 一种用于剥离两个临时粘合晶片的方法，包括提供一个脱粘器，其包括顶部卡盘组件，底部卡盘组件，支撑顶部卡盘组件的静态机架，支撑底部卡盘组件的X轴托架驱动器和X轴驱动 控制器被配置为将X轴托架驱动器和底部卡盘组件从加载区域水平驱动到顶部卡盘组件下方的处理区域以及从处理区域到加载区域。 接下来，将负载区域上的通过粘合剂层将包含结合到器件晶片的载体晶片的晶片对装载在负载区域上的底部卡盘组件上，使得器件晶片的未结合表面与底部组件接触。 接下来，将X轴托架驱动器和底卡盘组件驱动到顶卡盘组件下的处理区域。 接下来，将载体晶片的未结合表面与顶部卡盘组件接触并且通过顶部卡盘组件保持载体晶片。 接下来，当向载体晶片施加热量并且当载体晶片被顶部卡盘组件保持时，启动X轴托架驱动器的水平运动。