公开(公告)号：US07452743B2

公开(公告)日：2008-11-18

申请号：US11217877

申请日：2005-09-01

申请人： Steven D. Oliver ,  Lu Velicky ,  William Mark Hiatt ,  David R. Hembree ,  Mark E. Tuttle ,  Sidney B. Rigg ,  James M. Wark ,  Warren M. Farnworth ,  Kyle K. Kirby

发明人： Steven D. Oliver ,  Lu Velicky ,  William Mark Hiatt ,  David R. Hembree ,  Mark E. Tuttle ,  Sidney B. Rigg ,  James M. Wark ,  Warren M. Farnworth ,  Kyle K. Kirby

IPC分类号： H01L21/00

CPC分类号： H01L21/00 ,  H01L21/76898 ,  H01L23/552 ,  H01L27/14609 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

摘要： Microelectronic imaging units and methods for manufacturing a plurality of imaging units at the wafer level are disclosed herein. In one embodiment, a method for manufacturing a plurality of imaging units includes providing an imager workpiece having a plurality of imaging dies including integrated circuits, external contacts electrically coupled to the integrated circuits, and image sensors operably coupled to the integrated circuits. The individual image sensors include at least one dark current pixel at a perimeter portion of the image sensor. The method includes depositing a cover layer onto the workpiece and over the image sensors. The method further includes patterning and selectively developing the cover layer to form discrete volumes of cover layer material over corresponding image sensors. The discrete volumes of cover layer material have sidewalls aligned with an inboard edge of the individual dark current pixels such that the dark current pixels are not covered by the discrete volumes.

摘要翻译： 本文公开了用于在晶片级制造多个成像单元的微电子成像单元和方法。 在一个实施例中，制造多个成像单元的方法包括提供具有多个成像管芯的成像工件，所述成像管芯包括集成电路，电耦合到集成电路的外部触点以及可操作地耦合到集成电路的图像传感器。 各个图像传感器包括在图像传感器的周边部分处的至少一个暗电流像素。 该方法包括将覆盖层沉积在工件上并在图像传感器上方。 该方法还包括图案化和选择性地显影覆盖层以在对应的图像传感器上形成分离体积的覆盖层材料。 覆盖层材料的离散体积具有与各个暗电流像素的内侧边缘对准的侧壁，使得暗电流像素不被离散体积覆盖。

公开(公告)号：US07189954B2

公开(公告)日：2007-03-13

申请号：US10894262

申请日：2004-07-19

申请人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

发明人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

IPC分类号： H01L31/0232 ,  H01L27/00

CPC分类号： H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

公开(公告)号：US07709776B2

公开(公告)日：2010-05-04

申请号：US12390195

申请日：2009-02-20

申请人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

发明人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

IPC分类号： H01L27/00 ,  H01L31/0232

CPC分类号： H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

摘要翻译： 微电子成像器组件包括包括衬底的工件和在衬底上和/或衬底中的多个成像管芯。 基板包括前侧和后侧，并且成像管芯包括在基板的前侧的成像传感器和可操作地耦合到图像传感器的外部触点。 微电子成像器组件还包括相对于成像管芯叠加的光学支架。 光学支撑件可以直接在基板上或衬底上的盖上。 单个光学支撑件可以具有（a）与图像传感器中的一个对准的开口，以及（b）与图像传感器相距一定距离处的轴承元件。 微电子成像器组件还可以包括由光学器件支撑件安装或以其它方式承载的光学器件。

公开(公告)号：US20090155949A1

公开(公告)日：2009-06-18

申请号：US12390195

申请日：2009-02-20

申请人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

发明人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

IPC分类号： H01L31/0232

CPC分类号： H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

摘要翻译： 微电子成像器组件包括包括衬底的工件和在衬底上和/或衬底中的多个成像管芯。 基板包括前侧和后侧，并且成像管芯包括在基板的前侧的成像传感器和可操作地耦合到图像传感器的外部触点。 微电子成像器组件还包括相对于成像管芯叠加的光学支架。 光学支撑件可以直接在基板上或衬底上的盖上。 单个光学支撑件可以具有（a）与图像传感器中的一个对准的开口，以及（b）与图像传感器相距一定距离处的轴承元件。 微电子成像器组件还可以包括由光学器件支撑件安装或以其它方式承载的光学器件。

公开(公告)号：US07504615B2

公开(公告)日：2009-03-17

申请号：US11727545

申请日：2007-03-27

申请人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

发明人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

IPC分类号： H01L27/00 ,  H01L31/0232

CPC分类号： H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

摘要翻译： 微电子成像器组件包括包括衬底的工件和在衬底上和/或衬底中的多个成像管芯。 基板包括前侧和后侧，并且成像管芯包括在基板的前侧的成像传感器和可操作地耦合到图像传感器的外部触点。 微电子成像器组件还包括相对于成像管芯叠加的光学支架。 光学支撑件可以直接在基板上或衬底上的盖上。 单个光学支撑件可以具有（a）与图像传感器中的一个对准的开口，以及（b）与图像传感器相距一定距离处的轴承元件。 微电子成像器组件还可以包括由光学器件支撑件安装或以其它方式承载的光学器件。

公开(公告)号：US07265330B2

公开(公告)日：2007-09-04

申请号：US11476015

申请日：2006-06-28

申请人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

发明人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

IPC分类号： H01L27/00 ,  H01L31/0232

CPC分类号： H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

摘要翻译： 微电子成像器组件包括包括衬底的工件和在衬底上和/或衬底中的多个成像管芯。 基板包括前侧和后侧，并且成像管芯包括在基板的前侧的成像传感器和可操作地耦合到图像传感器的外部触点。 微电子成像器组件还包括相对于成像管芯叠加的光学支架。 光学支撑件可以直接在基板上或衬底上的盖上。 单个光学支撑件可以具有（a）与图像传感器中的一个对准的开口，以及（b）与图像传感器相距一定距离处的轴承元件。 微电子成像器组件还可以包括由光学器件支撑件安装或以其它方式承载的光学器件。

公开(公告)号：US20110136336A1

公开(公告)日：2011-06-09

申请号：US13029950

申请日：2011-02-17

申请人： Salman Akram ,  William Mark Hiatt ,  Steven Oliver ,  Alan G. Wood ,  Sidney B. Rigg ,  James M. Wark ,  Kyle K. Kirby

发明人： Salman Akram ,  William Mark Hiatt ,  Steven Oliver ,  Alan G. Wood ,  Sidney B. Rigg ,  James M. Wark ,  Kyle K. Kirby

IPC分类号： H01L21/768

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/17181 ,  H01L2924/09701

摘要： Methods of forming a conductive via may include forming a blind via hole partially through a substrate, forming an aluminum film on surfaces of the substrate, removing a first portion of the aluminum film from some surfaces, selectively depositing conductive material onto a second portion of the aluminum film, and exposing the blind via hole through a back side of the substrate. Methods of fabricating a conductive via may include forming at least one via hole through at least one unplated bond pad, forming a first adhesive over at least one surface of the at least one via hole, forming a dielectric over the first adhesive, forming a base layer over the dielectric and the at least one unplated bond pad, and plating nickel onto the base layer.

摘要翻译： 形成导电通孔的方法可以包括部分地穿过衬底形成盲孔，在衬底的表面上形成铝膜，从一些表面去除铝膜的第一部分，将导电材料选择性地沉积到第二部分上 铝膜，并且通过基板的背面露出盲孔。 制造导电通孔的方法可以包括通过至少一个未镀覆的焊盘形成至少一个通孔，在至少一个通孔的至少一个表面上形成第一粘合剂，在第一粘合剂上形成电介质，形成基底 层叠在电介质和至少一个未镀覆的焊盘上，并将镍镀在基底层上。

公开(公告)号：US08324100B2

公开(公告)日：2012-12-04

申请号：US13029950

申请日：2011-02-17

申请人： Salman Akram ,  William Mark Hiatt ,  Steven Oliver ,  Alan G. Wood ,  Sidney B. Rigg ,  James M. Wark ,  Kyle K. Kirby

发明人： Salman Akram ,  William Mark Hiatt ,  Steven Oliver ,  Alan G. Wood ,  Sidney B. Rigg ,  James M. Wark ,  Kyle K. Kirby

IPC分类号： H01L21/44

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/17181 ,  H01L2924/09701

摘要： Methods of forming a conductive via may include forming a blind via hole partially through a substrate, forming an aluminum film on surfaces of the substrate, removing a first portion of the aluminum film from some surfaces, selectively depositing conductive material onto a second portion of the aluminum film, and exposing the blind via hole through a back side of the substrate. Methods of fabricating a conductive via may include forming at least one via hole through at least one unplated bond pad, forming a first adhesive over at least one surface of the at least one via hole, forming a dielectric over the first adhesive, forming a base layer over the dielectric and the at least one unplated bond pad, and plating nickel onto the base layer.

摘要翻译： 形成导电通孔的方法可以包括部分地穿过衬底形成盲孔，在衬底的表面上形成铝膜，从一些表面去除铝膜的第一部分，将导电材料选择性地沉积到第二部分上 铝膜，并且通过基板的背面露出盲孔。 制造导电通孔的方法可以包括通过至少一个未镀覆的焊盘形成至少一个通孔，在至少一个通孔的至少一个表面上形成第一粘合剂，在第一粘合剂上形成电介质，形成基底 层叠在电介质和至少一个未镀覆的焊盘上，并将镍镀在基底层上。

公开(公告)号：US08294273B2

公开(公告)日：2012-10-23

申请号：US12985570

申请日：2011-01-06

申请人： Salman Akram ,  William Mark Hiatt ,  Steve Oliver ,  Alan G. Wood ,  Sidney B. Rigg ,  James M. Wark ,  Kyle K. Kirby

发明人： Salman Akram ,  William Mark Hiatt ,  Steve Oliver ,  Alan G. Wood ,  Sidney B. Rigg ,  James M. Wark ,  Kyle K. Kirby

IPC分类号： H01L23/48

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/17181 ,  H01L2924/09701

摘要： Methods for forming conductive vias include forming one or more via holes in a substrate. The via holes may be formed with a single mask, with protective layers, bond pads, or other features of the substrate acting as hard masks in the event that a photomask is removed during etching processes. The via holes may be configured to facilitate adhesion of a dielectric coating that includes a low-K dielectric material to the surfaces thereof. A barrier layer may be formed over surfaces of each via hole. A base layer, which may comprise a seed material, may be formed to facilitate the subsequent, selective deposition of conductive material over the surfaces of the via hole. The resulting semiconductor devices, intermediate structures, and assemblies and electronic devices that include the semiconductor devices that result from these methods are also disclosed.

摘要翻译： 用于形成导电通孔的方法包括在衬底中形成一个或多个通孔。 通孔可以形成有单个掩模，其中在蚀刻过程中去除光掩模的情况下，衬底的保护层，接合焊盘或其它特征用作硬掩模。 通孔可以被配置为便于将包括低K电介质材料的电介质涂层粘附到其表面上。 可以在每个通孔的表面上形成阻挡层。 可以形成可以包括种子材料的基层，以便于导电材料随后的选择性沉积在通孔的表面上。 还公开了包括由这些方法产生的半导体器件的所得半导体器件，中间结构和组件以及电子器件。

公开(公告)号：US20110095429A1

公开(公告)日：2011-04-28

申请号：US12985570

申请日：2011-01-06

申请人： Salman Akram ,  William Mark Hiatt ,  Steve Oliver ,  Alan G. Wood ,  Sidney B. Rigg ,  James M. Wark ,  Kyle K. Kirby

发明人： Salman Akram ,  William Mark Hiatt ,  Steve Oliver ,  Alan G. Wood ,  Sidney B. Rigg ,  James M. Wark ,  Kyle K. Kirby

IPC分类号： H01L23/48 ,  H01L23/532

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/17181 ,  H01L2924/09701

摘要： Methods for forming conductive vias include foiling one or more via holes in a substrate. The via holes may be formed with a single mask, with protective layers, bond pads, or other features of the substrate acting as hard masks in the event that a photomask is removed during etching processes. The via holes may be configured to facilitate adhesion of a dielectric coating that includes a low-K dielectric material to the surfaces thereof A barrier layer may be fowled over surfaces of each via hole. A base layer, which may comprise a seed material, may be formed to facilitate the subsequent, selective deposition of conductive material over the surfaces of the via hole. The resulting semiconductor devices, intermediate structures, and assemblies and electronic devices that include the semiconductor devices that result from these methods are also disclosed.

摘要翻译： 用于形成导电通孔的方法包括在基板中形成一个或多个通孔。 通孔可以形成有单个掩模，其中在蚀刻过程中去除光掩模的情况下，衬底的保护层，接合焊盘或其它特征用作硬掩模。 通孔可以被配置为便于将包括低K电介质材料的电介质涂层粘附到其表面上。阻挡层可以在每个通孔的表面上被覆盖。 可以形成可以包括种子材料的基层，以便于导电材料随后的选择性沉积在通孔的表面上。 还公开了包括由这些方法产生的半导体器件的所得半导体器件，中间结构和组件以及电子器件。