THIN FILM TRANSISTOR AND METHOD OF FORMING THE SAME
    1.
    发明申请
    THIN FILM TRANSISTOR AND METHOD OF FORMING THE SAME 审中-公开
    薄膜晶体管及其形成方法

    公开(公告)号:US20150044817A1

    公开(公告)日:2015-02-12

    申请号:US14521043

    申请日:2014-10-22

    Abstract: A thin film transistor includes a substrate, an oxide semiconductor layer that is disposed on the substrate, a gate electrode that overlaps with the oxide semiconductor layer, a gate insulating layer that is disposed between the oxide semiconductor layer and the gate electrode, and a source electrode and a drain electrode that at least partially overlap with the oxide semiconductor layer and are spaced from each other. The gate insulating layer includes an oxide including a first material. The oxide semiconductor layer includes an oxide which includes a same material as the first material and a second material, and the source electrode and the drain electrode include an oxide that includes a same material as the second material and a third material, and a grain boundary is not formed on an interface between at least one of the gate insulating layer and the oxide semiconductor layer or between the oxide semiconductor layer, and the source electrode and the drain electrode.

    Abstract translation: 薄膜晶体管包括衬底,设置在衬底上的氧化物半导体层,与氧化物半导体层重叠的栅电极,设置在氧化物半导体层和栅电极之间的栅极绝缘层,以及源极 电极和与氧化物半导体层至少部分重叠并且彼此间隔开的漏电极。 栅极绝缘层包括包含第一材料的氧化物。 氧化物半导体层包括与第一材料相同的材料和第二材料的氧化物,源电极和漏极包括包含与第二材料相同的材料的氧化物和第三材料,以及晶界 不形成在栅极绝缘层和氧化物半导体层中的至少一个之间或氧化物半导体层以及源电极和漏电极之间的界面上。

    Transistor and display device having the same

    公开(公告)号:US10546959B2

    公开(公告)日:2020-01-28

    申请号:US15662502

    申请日:2017-07-28

    Abstract: A transistor includes a gate electrode, a semiconductor layer overlapping the gate electrode, the semiconductor layer including an oxide semiconductor, and a source electrode and a drain electrode spaced apart from the source electrode, wherein the source and drain electrodes are connected to the semiconductor layer. The semiconductor layer includes a plurality of layers, wherein a crystallinity of a layer of the plurality of layers of the semiconductor layer is a ratio of a crystalline oxide semiconductor, included in the layer of the plurality of layers of the semiconductor layer, to an amorphous oxide semiconductor, included in the layer of the plurality of layers of the semiconductor layer. A first layer of the plurality of layers of the semiconductor layer has a different crystallinity with respect to a second layer of the plurality of layers of the semiconductor layer.

    Precursor composition of oxide semiconductor and thin film transistor substrate including oxide semiconductor
    4.
    发明授权
    Precursor composition of oxide semiconductor and thin film transistor substrate including oxide semiconductor 有权
    包含氧化物半导体的氧化物半导体和薄膜晶体管衬底的前体组成

    公开(公告)号:US09082795B2

    公开(公告)日:2015-07-14

    申请号:US14477587

    申请日:2014-09-04

    Abstract: A thin film transistor substrate according to an exemplary embodiment of the present invention includes a semiconductor layer including metal disposed on an insulating substrate, a gate electrode overlapping the semiconductor layer, and a source electrode and a drain electrode overlapping the semiconductor layer, wherein the metal in the semiconductor layer comprises indium (In), zinc (Zn), and tin (Sn), and a molar ratio ( R , R ⁡ [ mol ⁢ ⁢ % ] = [ In ] [ In + Zn + Sn ] × 100 ) of indium (In) to the metals in the semiconductor layer is less than about 20%, and more specifically, the molar ratio ( R , R ⁡ [ mol ⁢ ⁢ % ] = [ In ] [ In + Zn + Sn ] × 100 ) of indium (In) of the metals in the semiconductor layer is about 5% to about 13%.

    Abstract translation: 根据本发明的示例性实施例的薄膜晶体管基板包括:半导体层,包括设置在绝缘基板上的金属,与半导体层重叠的栅极电极以及与半导体层重叠的源电极和漏电极,其中金属 在半导体层中包含铟(In),锌(Zn)和锡(Sn),摩尔比(R,R⁡[mol⁢%] = [In] [In + Zn + Sn]×100) 对于半导体层中的金属,铟(In)的含量小于约20%,更具体地说,摩尔比(R,R⁡[mol·⁢%] = [In] [In + Zn + Sn]×100 )的半导体层中的金属的In(In)为约5%至约13%。

    Display device
    5.
    发明授权

    公开(公告)号:US11621312B2

    公开(公告)日:2023-04-04

    申请号:US17089246

    申请日:2020-11-04

    Abstract: A display device includes a first conductive pattern on a substrate, a first insulating layer on the first conductive pattern, a semiconductor pattern on the first insulating layer, a second insulating layer on the first insulating layer and the semiconductor pattern, and a second conductive pattern on the second insulating layer. A first edge of the first conductive pattern faces a second edge of the second conductive pattern, the first conductive pattern does not overlap the second conductive pattern in an area where the first edge faces the second edge, the semiconductor pattern is in the area where the first edge faces the second edge, the second conductive pattern overlaps the second insulating layer, and the second insulating layer includes a third edge protruding from the second edge of the second conductive pattern.

    Thin film transistor and method of forming the same
    7.
    发明授权
    Thin film transistor and method of forming the same 有权
    薄膜晶体管及其形成方法

    公开(公告)号:US09406785B2

    公开(公告)日:2016-08-02

    申请号:US14521043

    申请日:2014-10-22

    Abstract: A thin film transistor includes a substrate, an oxide semiconductor layer that is disposed on the substrate, a gate electrode that overlaps with the oxide semiconductor layer, a gate insulating layer that is disposed between the oxide semiconductor layer and the gate electrode, and a source electrode and a drain electrode that at least partially overlap with the oxide semiconductor layer and are spaced from each other. The gate insulating layer includes an oxide including a first material. The oxide semiconductor layer includes an oxide which includes a same material as the first material and a second material, and the source electrode and the drain electrode include an oxide that includes a same material as the second material and a third material, and a grain boundary is not formed on an interface between at least one of the gate insulating layer and the oxide semiconductor layer or between the oxide semiconductor layer, and the source electrode and the drain electrode.

    Abstract translation: 薄膜晶体管包括衬底,设置在衬底上的氧化物半导体层,与氧化物半导体层重叠的栅电极,设置在氧化物半导体层和栅电极之间的栅极绝缘层,以及源极 电极和与氧化物半导体层至少部分重叠并且彼此间隔开的漏电极。 栅极绝缘层包括包含第一材料的氧化物。 氧化物半导体层包括与第一材料相同的材料和第二材料的氧化物,源电极和漏极包括包含与第二材料相同的材料的氧化物和第三材料,以及晶界 不形成在栅极绝缘层和氧化物半导体层中的至少一个之间或氧化物半导体层以及源电极和漏电极之间的界面上。

    Thin film transistor and method of forming the same
    8.
    发明授权
    Thin film transistor and method of forming the same 有权
    薄膜晶体管及其形成方法

    公开(公告)号:US08895977B2

    公开(公告)日:2014-11-25

    申请号:US13673195

    申请日:2012-11-09

    Abstract: A thin film transistor includes a substrate, an oxide semiconductor layer that is disposed on the substrate, a gate electrode that overlaps with the oxide semiconductor layer, a gate insulating layer that is disposed between the oxide semiconductor layer and the gate electrode, and a source electrode and a drain electrode that at least partially overlap with the oxide semiconductor layer and are spaced from each other. The gate insulating layer includes an oxide including a first material. The oxide semiconductor layer includes an oxide which includes a same material as the first material and a second material, and the source electrode and the drain electrode include an oxide that includes a same material as the second material and a third material, and a grain boundary is not formed on an interface between at least one of the gate insulating layer and the oxide semiconductor layer or between the oxide semiconductor layer, and the source electrode and the drain electrode.

    Abstract translation: 薄膜晶体管包括衬底,设置在衬底上的氧化物半导体层,与氧化物半导体层重叠的栅电极,设置在氧化物半导体层和栅电极之间的栅极绝缘层,以及源极 电极和与氧化物半导体层至少部分重叠并且彼此间隔开的漏电极。 栅极绝缘层包括包含第一材料的氧化物。 氧化物半导体层包括与第一材料相同的材料和第二材料的氧化物,源电极和漏极包括包含与第二材料相同的材料的氧化物和第三材料,以及晶界 不形成在栅极绝缘层和氧化物半导体层中的至少一个之间或氧化物半导体层以及源电极和漏电极之间的界面上。

    Precursor composition of oxide semiconductor and thin film transistor substrate including oxide semiconductor
    9.
    发明授权
    Precursor composition of oxide semiconductor and thin film transistor substrate including oxide semiconductor 有权
    包含氧化物半导体的氧化物半导体和薄膜晶体管衬底的前体组成

    公开(公告)号:US08853687B2

    公开(公告)日:2014-10-07

    申请号:US13679910

    申请日:2012-11-16

    Abstract: A thin film transistor substrate according to an exemplary embodiment of the present invention includes a semiconductor layer including metal disposed on an insulating substrate, a gate electrode overlapping the semiconductor layer, and a source electrode and a drain electrode overlapping the semiconductor layer, wherein the metal in the semiconductor layer comprises indium (In), zinc (Zn), and tin (Sn), and a molar ratio ( R , R ⁡ [ mol ⁢ ⁢ % ] = [ In ] [ In + Zn + Sn ] × 100 ) of indium (In) to the metals in the semiconductor layer is less than about 20%, and more specifically, the molar ratio (R, ( R , R ⁡ [ mol ⁢ ⁢ % ] = [ In ] [ In + Zn + Sn ] / 100 ) of indium (In) of the metals in the semiconductor layer is about 5% to about 13%.

    Abstract translation: 根据本发明的示例性实施例的薄膜晶体管基板包括:半导体层,包括设置在绝缘基板上的金属,与半导体层重叠的栅极电极以及与半导体层重叠的源电极和漏电极,其中金属 在半导体层中包含铟(In),锌(Zn)和锡(Sn),摩尔比(R,R⁡[mol⁢%] = [In] [In + Zn + Sn]×100) 对于半导体层中的金属,铟(In)的含量小于约20%,更具体地,摩尔比(R,(R,R⁡[mol⁢%] = [In] [In + Zn + Sn 半导体层中的金属的In(In)的比例为约5%〜13%。

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