THIN FILM TRANSISTOR PANEL AND MANUFACTURING METHOD THEREOF
    5.
    发明申请
    THIN FILM TRANSISTOR PANEL AND MANUFACTURING METHOD THEREOF 审中-公开
    薄膜晶体管面板及其制造方法

    公开(公告)号:US20160197190A1

    公开(公告)日:2016-07-07

    申请号:US14754213

    申请日:2015-06-29

    CPC classification number: H01L29/7869 H01L27/124 H01L29/401 H01L29/78696

    Abstract: Provided is a thin film transistor panel including: a substrate; a gate electrode positioned on the substrate; a gate insulating layer positioned on the gate electrode; an oxide semiconductor positioned on the gate insulating layer and including an oxide layer; and a source electrode and a drain electrode positioned on the oxide semiconductor and facing each other based on a channel of the oxide semiconductor, in which the oxide layer overlaps the gate electrode and is positioned on the oxide semiconductor.

    Abstract translation: 提供一种薄膜晶体管面板,包括:基板; 位于所述基板上的栅电极; 位于所述栅电极上的栅极绝缘层; 位于所述栅极绝缘层上且包括氧化物层的氧化物半导体; 以及位于所述氧化物半导体上的源电极和漏极,并且基于所述氧化物半导体的沟道彼此相对,所述氧化物层与所述栅电极重叠并位于所述氧化物半导体上。

    SPUTTERING DEVICE AND METHOD OF FORMING LAYER USING THE SAME
    7.
    发明申请
    SPUTTERING DEVICE AND METHOD OF FORMING LAYER USING THE SAME 有权
    溅射装置及其使用形成层的方法

    公开(公告)号:US20160160340A1

    公开(公告)日:2016-06-09

    申请号:US14670403

    申请日:2015-03-26

    CPC classification number: C23C14/044 H01J37/34 H01J37/3447

    Abstract: The method of forming a layer using the sputtering device includes: placing a substrate within a chamber; depositing target particles emitted from a target, which faces the substrate, on the substrate using a sputtering process; and horizontally moving a plurality of shield rods, which are installed in a shield mask disposed between the substrate and the target and are separated from each other along a first direction, during the sputtering process.

    Abstract translation: 使用溅射装置形成层的方法包括:将基板放置在室内; 使用溅射工艺将从面向衬底的靶发射的靶颗粒沉积在衬底上; 并且水平移动多个屏蔽杆,其安装在设置在基板和靶之间的屏蔽掩模中,并且在溅射过程期间沿着第一方向彼此分离。

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