公开(公告)号：US20220285426A1

公开(公告)日：2022-09-08

申请号：US17452550

申请日：2021-10-27

Applicant: Samsung Display Co., Ltd.

Inventor： Hyun Wook LEE ,  Veidhes BASRUR ,  Myung Seok KWON ,  Ji Hyun MIN ,  Sung Won JO ,  Jung Eun HONG

IPC: H01L27/15 ,  H01L33/24 ,  H01L33/38 ,  H01L33/44 ,  H01L33/50 ,  H01L33/58

Abstract: A display device includes alignment electrodes spaced apart from each other, first and second light emitting elements between the alignment electrodes, a first pixel electrode electrically connected to first end portions of the first light emitting elements, a second pixel electrode electrically connected to second end portions of the first light emitting elements, a third pixel electrode electrically connected to the second pixel electrode and to first end portions of the second light emitting elements, a fourth pixel electrode electrically connected to second end portions of the second light emitting elements, and an insulating layer between the first pixel electrode and the second pixel electrode, wherein the insulating layer includes at least one opening exposing the second end portions of the first and second light emitting elements.

公开(公告)号：US20150194572A1

公开(公告)日：2015-07-09

申请号：US14271514

申请日：2014-05-07

Applicant: Samsung Display Co., Ltd.

Inventor： Myung Seok KWON ,  Young Keun LEE ,  Young Min PARK

IPC: H01L33/20 ,  H01L33/52 ,  H01L33/62 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/20 ,  H01L33/483 ,  H01L33/52 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: A light-emitting diode (“LED”) package includes a substrate, an LED chip on the substrate, and a light exit surface adjuster. The light exit surface adjuster includes a light-transmitting surface which transmits light and a light-blocking surface which is around the light-transmitting surface and blocks the light. The LED chip is between the light exit surface adjuster and the substrate, and an overlap area between the LED chip and the light-transmitting surface is smaller than an overall area of the LED chip.

Abstract translation: 发光二极管（“LED”）封装包括衬底，衬底上的LED芯片和光出射表面调节器。 光射出面调整器包括透光光和透光面周围的遮光面并阻挡光的透光面。 LED芯片在光出射面调整器和基板之间，LED芯片和透光面之间的重叠区域小于LED芯片的整个面积。