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公开(公告)号：US20150355219A1
公开(公告)日：2015-12-10
申请号：US14589206
申请日：2015-01-05
发明人： Pil Joong KANG , Jung Won LEE , Hyun Kee LEE , Jong Hyeong SONG
IPC分类号： G01P15/12 , G01P15/093 , G01P15/125
CPC分类号： G01P15/123 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2201/0292 , B81B2207/012 , B81C2201/019 , G01C19/5783 , G01P15/0802 , G01P15/093 , G01P15/125 , G01P2015/0842
摘要： Embodiments of the invention provide a multi-axis sensor, including a first sensor embedded in an embedded substrate to sense a position, and a second sensor formed on a lower cap substrate bonded on the embedded substrate by a wafer level package scheme to sense an inertial force.
摘要翻译： 本发明的实施例提供一种多轴传感器，其包括嵌入在嵌入式基板中以感测位置的第一传感器，以及通过晶片级封装方案形成在嵌入式基板上的下盖基板上的第二传感器，以感测惯性 力。
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2.发明申请CAP MODULE FOR MICRO ELECTRO MECHANICAL SYSTEM AND MICRO ELECTRO MECHANICAL SYSTEM SENSOR HAVING THE SAME 审中-公开微电子机械系统和微电子机械系统传感器的CAP模块公开(公告)号：US20150274510A1
公开(公告)日：2015-10-01
申请号：US14265760
申请日：2014-04-30
发明人： Jae Chang LEE , Jong Hyeong SONG , Jong Woon KIM , Hyun Kee LEE
IPC分类号： B81B7/00
CPC分类号： B81B7/0077 , B81C2203/0109 , Y10T428/24802 , Y10T428/31511
摘要： Embodiments of the invention provide a cap module for MEMS including a substrate, a first negative photoresist, which is formed on one surface of the substrate, and a second negative photoresist, which is formed on one surface of the first negative photoresist.
摘要翻译： 本发明的实施例提供了一种用于MEMS的封装模块，其包括衬底，形成在衬底的一个表面上的第一负光致抗蚀剂和形成在第一负光致抗蚀剂的一个表面上的第二负光刻胶。
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3.发明申请INERTIAL SENSOR MODULE HAVING HERMETIC SEAL FORMED OF METAL AND MULTI-AXIS SENSOR EMPLOYING THE SAME 审中-公开具有使用其的金属和多轴传感器形成的密封的惯性传感器模块公开(公告)号：US20150355220A1
公开(公告)日：2015-12-10
申请号：US14690839
申请日：2015-04-20
发明人： Pil Joong KANG , Jung Won LEE , Hyun Kee LEE , Jong Hyeong SONG
IPC分类号： G01P15/12 , G01P15/093 , G01P15/125 , G01P15/02
CPC分类号： G01P15/123 , B81B2201/0235 , B81B2201/0242 , B81C1/00269 , B81C2203/0109 , B81C2203/035 , G01C19/56 , G01P15/09 , G01P15/093 , G01P15/125 , G01P15/18 , G01P2015/0842
摘要： There are provided an inertial sensor module having a hermetic seal formed of metal and a multi-axis sensor employing the same. The inertial sensor module includes: a sensor main body including a plurality of wirings connected to any one of a driving electrode of a sensor and a sensing electrode of the sensor and formed on a substrate for a lower cap by a wafer level package (WLP) scheme to detect an inertial force; a substrate for an upper cap bonded on the sensor main body to protect the sensor main body; and a hermetic seal formed of metal isolated from the wiring and interposed into the sensor main body and the substrate for the upper cap by performing the bonding by metal bonding.
摘要翻译： 提供了一种惯性传感器模块，其具有由金属形成的气密密封件和使用其的多轴传感器。 惯性传感器模块包括：传感器主体，包括连接到传感器的驱动电极和传感器的感测电极中的任何一个的多个布线，并且通过晶片级封装（WLP）形成在用于下盖的基板上， 检测惯性力的方案; 用于上盖的基板，其接合在所述传感器主体上以保护所述传感器主体; 以及通过金属接合进行接合而由与配线隔离并插入到传感器主体和上盖的基板中的金属形成的气密密封。
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公开(公告)号：US20170271573A1
公开(公告)日：2017-09-21
申请号：US15272618
申请日：2016-09-22
发明人： Pil Joong KANG , Kwang Su KIM , Jeong Il LEE , Jong Hyeong SONG , Hyun Kee LEE , Yun Sung KANG , Seung Joo SHIN , Jeong Suong YANG
IPC分类号： H01L41/053 , H03H9/54 , H03H9/17
摘要： The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.
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公开(公告)号：US20140042586A1
公开(公告)日：2014-02-13
申请号：US13673115
申请日：2012-11-09
发明人： Hyun Kee LEE , Sung Min CHO
IPC分类号： H01L29/16 , H01L21/762
CPC分类号： H01L21/78 , H01L21/2007
摘要： There are provided a silicon substrate and a method of fabricating the same, the silicon substrate including: first and second silicon substrates having corresponding bonding surfaces; a silicon oxide film formed between the first and second silicon substrates and having at least one trench communicating with the outside; and a hermetic portion formed on an end portion of the trench according to oxidation of the silicon oxide film.
摘要翻译： 提供硅衬底及其制造方法，所述硅衬底包括：具有相应接合表面的第一和第二硅衬底; 形成在所述第一和第二硅衬底之间并且具有与外部连通的至少一个沟槽的氧化硅膜; 以及根据氧化硅膜的氧化形成在沟槽的端部上的密封部分。
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