公开(公告)号：US20200177155A1

公开(公告)日：2020-06-04

申请号：US16540480

申请日：2019-08-14

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seung Wook PARK ,  Tae Kyung LEE ,  Seong Hun NA ,  Jae Chang LEE ,  Jae Hyun JUNG

IPC: H03H9/10 ,  H03H9/05 ,  H01L41/09 ,  H01L41/053 ,  H03H3/02 ,  H03H9/60 ,  H03H9/58 ,  H01L41/047 ,  H03H9/17

Abstract: A bulk-acoustic resonator module includes: a module substrate; a bulk-acoustic resonator connected to the module substrate by a connection terminal and disposed spaced apart from the module substrate; and a sealing portion sealing the bulk-acoustic resonator. The bulk-acoustic resonator includes a resonating portion disposed opposite to an upper surface of the module substrate. A space is disposed between the resonating portion and the upper surface of the module substrate.

公开(公告)号：US20170174503A1

公开(公告)日：2017-06-22

申请号：US15091057

申请日：2016-04-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Chul LEE ,  Duck Hwan KIM ,  Yeong Gyu LEE ,  Jae Chang LEE ,  Tae Yoon KIM ,  Kyong Bok MIN

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B2201/0271 ,  B81B2203/0315 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L21/561 ,  H01L23/10 ,  H01L23/3114

Abstract: A wafer level package includes a wafer member having inner cavities in which circuit elements are disposed, element wall members disposed on an internal surface of the wafer member and enclosing element sections in which the circuit elements are disposed, and clearance wall members disposed on external surfaces of the element wall members and dividing a space between the element sections into clearance sections.

公开(公告)号：US20160066097A1

公开(公告)日：2016-03-03

申请号：US14626961

申请日：2015-02-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hwa Sun LEE ,  Jae Chang LEE ,  Byung Hun KIM

IPC: H04R7/16 ,  H04R1/28

CPC classification number: H04R19/04

Abstract: An acoustic transducer includes a substrate member including a first region having one or more first holes formed therein, and a second region, a vibration member including a third region facing the first region and a fourth region facing the second region and having one or more second holes formed therein, and a support member extended from a boundary region between the first region and the second region to a boundary region between the third region and the fourth region to allow the substrate member and the vibration member to be spaced apart from each other by a predetermined interval.

Abstract translation: 一种声换能器，包括一基片部件，该基片部件包括一第一区域，该第一区域具有形成在该第一区域中的一个或多个第一孔，以及第二区域，包括面向该第一区域的第三区域和与该第二区域相对的第四区域的振动构件， 形成在其中的孔，以及从第一区域和第二区域之间的边界区域延伸到第三区域和第四区域之间的边界区域的支撑构件，以允许基板构件和振动构件通过 预定间隔。

公开(公告)号：US20210035929A1

公开(公告)日：2021-02-04

申请号：US16655284

申请日：2019-10-17

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seung Wook PARK ,  Jae Chang LEE ,  Seong Hun NA ,  Jae Hyun JUNG

IPC: H01L23/66 ,  H03H9/02 ,  H03H9/64

Abstract: A semiconductor package includes a main substrate, a resonator device disposed above the main substrate, a wiring portion connected to the resonator device, an electrical connection structure connected to the wiring portion and the main substrate, an encapsulant encapsulating the resonator device and the electrical connection structure, and a heat dissipation member bonded to and mounted on the resonator device. A cavity is provided in the resonator device, and is formed between the resonance portion and a resonator device substrate provided in the resonator device.

公开(公告)号：US20190199319A1

公开(公告)日：2019-06-27

申请号：US16292715

申请日：2019-03-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Yoon KIM ,  Yeong Gyu LEE ,  Moon Chul LEE ,  Jae Chang LEE ,  Duck Hwan KIM

IPC: H03H9/13 ,  H03H3/02 ,  H03H9/10

CPC classification number: H03H9/131 ,  H03H3/02 ,  H03H9/1007

Abstract: A resonator package and a method of manufacturing the same are provided. The method of manufacturing a resonator package involves etching a lower electrode with a hardmask, in which only a portion of a thickness of the lower electrode is etched to shape the lower electrode.

公开(公告)号：US20180048281A1

公开(公告)日：2018-02-15

申请号：US15487620

申请日：2017-04-14

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Moon Chul LEE ,  Jae Chang LEE ,  Chang Hyun LIM ,  Tae Hun LEE ,  Tae Kyung LEE ,  Tae Yoon KIM

IPC: H03H9/02 ,  H01L41/047 ,  H03H9/54

CPC classification number: H03H9/02102 ,  H01L41/047 ,  H03H9/173 ,  H03H9/542 ,  H03H9/564

Abstract: A bulk acoustic filter device includes: a substrate; a cavity forming layer disposed on the substrate so as to form a cavity; a lower electrode disposed on the cavity; a piezoelectric layer disposed on the lower electrode; an upper electrode disposed on the piezoelectric layer; and a temperature compensation layer disposed below the lower electrode and in the cavity portion.

公开(公告)号：US20150274510A1

公开(公告)日：2015-10-01

申请号：US14265760

申请日：2014-04-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Chang LEE ,  Jong Hyeong SONG ,  Jong Woon KIM ,  Hyun Kee LEE

IPC: B81B7/00

CPC classification number: B81B7/0077 ,  B81C2203/0109 ,  Y10T428/24802 ,  Y10T428/31511

Abstract: Embodiments of the invention provide a cap module for MEMS including a substrate, a first negative photoresist, which is formed on one surface of the substrate, and a second negative photoresist, which is formed on one surface of the first negative photoresist.

Abstract translation: 本发明的实施例提供了一种用于MEMS的封装模块，其包括衬底，形成在衬底的一个表面上的第一负光致抗蚀剂和形成在第一负光致抗蚀剂的一个表面上的第二负光刻胶。

公开(公告)号：US20180019726A1

公开(公告)日：2018-01-18

申请号：US15638809

申请日：2017-06-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung HAN ,  Jae Chang LEE ,  Won HAN ,  Tae Yoon KIM ,  Jong Woon KIM ,  Tae Kyung LEE ,  Moon Chul LEE ,  Tae Hun LEE ,  Sung Min CHO ,  In Young KANG

IPC: H03H9/10 ,  H03H9/02 ,  H03H9/17 ,  H03H9/54

CPC classification number: H03H9/1014 ,  H03H9/02086 ,  H03H9/02102 ,  H03H9/02118 ,  H03H9/02157 ,  H03H9/172 ,  H03H9/173 ,  H03H9/54

Abstract: A bulk acoustic wave resonator device includes: a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed over a portion of the lower electrode; an upper electrode disposed on the piezoelectric layer; and a shape control layer covering an edge of a cavity disposed between the substrate and the lower electrode, wherein tensile stress is applied to the shape control layer during formation of the shape control layer.

公开(公告)号：US20140152747A1

公开(公告)日：2014-06-05

申请号：US13772612

申请日：2013-02-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Chang LEE ,  Hwa Sun Lee ,  Tae Kyung Lee ,  Byung Hun Kim ,  Sung Wook Kim

IPC: B41J2/175

CPC classification number: B41J2/14233 ,  B41J2002/14403

Abstract: There is provided an inkjet print head having a stable filter structure. The inkjet print head includes a vibration substrate including a first filter formed therein; and a channel forming substrate including a second filter and a pressure chamber formed therein, the second filter being connected to the first filter.

Abstract translation: 提供了具有稳定的过滤器结构的喷墨打印头。 喷墨打印头包括其中形成有第一过滤器的振动基板; 以及包括形成在其中的第二过滤器和压力室的通道形成衬底，所述第二过滤器连接到所述第一过滤器。

公开(公告)号：US20180294792A1

公开(公告)日：2018-10-11

申请号：US15876791

申请日：2018-01-22

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Moon Chul LEE ,  Tah Joon PARK ,  Jae Chang LEE ,  Tae Yoon KIM ,  Chang Hyun LIM ,  Hwa Sun LEE ,  Tae Hun LEE ,  Hyun Min HWANG ,  Tae Kyung LEE

IPC: H03H9/02 ,  H03H9/60

Abstract: A bulk acoustic wave (BAW) resonator includes: a substrate; a first BAW resonator including a first air cavity disposed in the substrate, and further including a first electrode, a first piezoelectric layer, and a second electrode stacked on the first air cavity; a second BAW resonator including a second air cavity disposed in the substrate, and further including a first electrode, a second piezoelectric layer, and a second electrode stacked on the second air cavity, wherein the second BAW resonator is connected in parallel to the first BAW resonator and has polarities that are opposite of polarities of the first BAW resonator; and a compensation capacitor circuit connected between the first BAW resonator and the second BAW resonator.