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公开(公告)号：US20190019624A1
公开(公告)日：2019-01-17
申请号：US15975198
申请日：2018-05-09
发明人： Dong Joon OH , Tae Joon PARK , Sang Wook LEE , Sung Min CHO , Seung Mo LIM
摘要： A multilayer ceramic capacitor includes a body having a dielectric layer and internal electrodes disposed to be alternately exposed to the third and fourth surfaces with the dielectric layer interposed therebetween. External electrodes include connection parts respectively formed on opposing surfaces of the body, band parts formed to extend from the connection parts to portions of side surfaces of the body, and corner parts in which the connection parts and the band parts are contiguous. A thickness of each of the external electrodes may be 50 nm to 2 μm. The external electrodes may be formed using a barrel-type sputtering method. A ratio t2/t1 may satisfy 0.7 to 1.2, where t1 is a thickness of each connection part and t2 is a thickness of each band part. A ratio t3/t1 may satisfy 0.7 to 1.0, where t3 is a thickness of each corner part.
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公开(公告)号：US20140042586A1
公开(公告)日：2014-02-13
申请号：US13673115
申请日：2012-11-09
发明人： Hyun Kee LEE , Sung Min CHO
IPC分类号： H01L29/16 , H01L21/762
CPC分类号： H01L21/78 , H01L21/2007
摘要： There are provided a silicon substrate and a method of fabricating the same, the silicon substrate including: first and second silicon substrates having corresponding bonding surfaces; a silicon oxide film formed between the first and second silicon substrates and having at least one trench communicating with the outside; and a hermetic portion formed on an end portion of the trench according to oxidation of the silicon oxide film.
摘要翻译： 提供硅衬底及其制造方法，所述硅衬底包括：具有相应接合表面的第一和第二硅衬底; 形成在所述第一和第二硅衬底之间并且具有与外部连通的至少一个沟槽的氧化硅膜; 以及根据氧化硅膜的氧化形成在沟槽的端部上的密封部分。
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公开(公告)号：US20230207213A1
公开(公告)日：2023-06-29
申请号：US17969176
申请日：2022-10-19
发明人： Sung Min CHO , Jang Yeol LEE , Ho Phil JUNG
摘要： A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes; external electrodes disposed on the body, connected to the plurality of internal electrodes, and including electrode layers and plating layers respectively covering the electrode layers; and coating layers respectively covering the plating layer and including an island region exposing a portion of a surface of the plating layer.
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公开(公告)号：US20190385795A1
公开(公告)日：2019-12-19
申请号：US16291053
申请日：2019-03-04
发明人： Jeong Suong YANG , Woong Do JUNG , Bon Seok KOO , Jong Suk HAN , Sung Min CHO
摘要： A capacitor component includes a humidity resistant layer formed on a portion of the external surface of a body on which an external electrode is not formed, and further includes a humidity resistant layer disposed inside the external electrode, to improve humidity resistance reliability. The capacitor component includes an opening portion formed by removing a portion of the humidity resistant layer disposed inside the external electrode to improve electrical connection.
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公开(公告)号：US20180019723A1
公开(公告)日：2018-01-18
申请号：US15623703
申请日：2017-06-15
发明人： Chang Hyun LIM , Jae Chang LEE , Sung Min CHO , Tae Kyung LEE , Moon Chul LEE
IPC分类号： H03H9/02 , H03H9/56 , H01L41/047
CPC分类号： H03H9/02118 , H03H9/131 , H03H9/173 , H03H9/564
摘要： A bulk acoustic wave filter device includes a resonating part, an electrode connecting part, a first layer, and a second layer. The resonating part is disposed on a substrate, and the electrode connecting part connects electrodes of the resonating part. The first layer is disposed on the substrate, and the second layer is disposed on regions of the first layer, other than a lower portion of the electrode connecting part.
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公开(公告)号：US20140092524A1
公开(公告)日：2014-04-03
申请号：US13735614
申请日：2013-01-07
发明人： Tae Yoon KIM , Sung Min CHO , Young Sik KANG
CPC分类号： H01G4/01 , H01G4/008 , H01G4/06 , H01G4/1227 , H01G4/33 , H01G4/38 , H01L28/90 , Y10T156/10
摘要： There is provided a capacitor, including: a substrate part including a first substrate having a groove portion and a second substrate positioned above the first substrate and having a protrusion portion; a first capacitance part formed on one surface of the first substrate and having a shape corresponding to that of the groove portion; and a second capacitance part formed on one surface of the second substrate and having a shape corresponding to that of the protrusion portion.
摘要翻译： 提供了一种电容器，包括：基板部分，包括具有凹槽部分的第一基板和位于第一基板上方并具有突出部分的第二基板; 第一电容部，形成在所述第一基板的一个表面上，并且具有与所述槽部的形状对应的形状; 以及形成在所述第二基板的一个表面上并且具有与所述突出部的形状相对应的形状的第二电容部。
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公开(公告)号：US20210375546A1
公开(公告)日：2021-12-02
申请号：US17016799
申请日：2020-09-10
发明人： Jeong Suong YANG , Bon Seok KOO , Sang Wook LEE , Jung Min KIM , Sung Min CHO
摘要： An electronic component includes an electronic component main body including a body and an external electrode disposed on the body. The body includes a dielectric layer and an internal electrode. The electronic component further includes a coating portion including a coating layer, disposed on an external surface of the electronic component main body, and a plurality of projections disposed on the coating layer.
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公开(公告)号：US20190103224A1
公开(公告)日：2019-04-04
申请号：US16044898
申请日：2018-07-25
发明人： Seung Hun HAN , Sung Min CHO , Dong Joon OH
CPC分类号： H01G4/30 , H01G4/005 , H01G4/12 , H01G4/1209 , H01G4/224 , H01G4/232 , H01G4/2325
摘要： A multilayer electronic component for enhancing damp proof reliability includes: a capacitor body including a plurality of dielectric layers, and first and second internal electrodes, alternately disposed across the dielectric layers to expose one end of the first and second electrodes through third and fourth surfaces of the capacitor body; first and second conductive layers disposed on the third and fourth surfaces of the capacitor body and connected to the first and second internal electrodes, respectively; first and second plating layers covering surfaces of the first and second conductive layers; and a plurality of coating layers configured in a multilayer structure on a surface of the capacitor body to expose the first and second plating layers and having an entire thickness of 10 nm to 200 nm.
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公开(公告)号：US20180144866A1
公开(公告)日：2018-05-24
申请号：US15642025
申请日：2017-07-05
发明人： Seung Hun HAN , Sung Min CHO , Tae Joon PARK , Hyun Ho SHIN , Sang Kee YOON
CPC分类号： H01G4/232 , H01G4/012 , H01G4/12 , H01G4/1227 , H01G4/1236 , H01G4/30 , H01G4/306 , H01G4/33
摘要： A thin-film ceramic capacitor includes a body, a plurality of dielectric layers and first and second electrode layers alternately disposed on a substrate in the body, first and second electrode pads disposed on an external surface of the body, and a plurality of vias disposed in the body, the plurality of dielectric layers and first and second electrode layers having inclined etched surfaces exposed to the plurality of vias, a first via, of the plurality of vias, being connected to the inclined surface of the first electrode layer, and a second via, of the plurality of vias, being connected to the inclined surface of the second electrode layer.
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公开(公告)号：US20170317660A1
公开(公告)日：2017-11-02
申请号：US15385448
申请日：2016-12-20
发明人： Tae Yoon KIM , Tae Kyung LEE , Moon Chul LEE , Sung Min CHO , Sang Kee YOON
CPC分类号： H03H9/17 , H03H3/02 , H03H9/02133 , H03H9/173 , H03H9/54
摘要： A bulk acoustic wave resonator may include: an air cavity; an etching stop layer and an etching stop part, which define a lower boundary surface and a side boundary surface of the air cavity; and a resonating part formed on an approximately planar surface, which is formed by a upper boundary surface of the air cavity and a top surface of the etching stop part. A width of a top surface of the etching stop part may be greater than a width of a bottom surface of the etching stop part. A side surface of the etching stop part connecting the top surface of the etching stop part to the bottom surface of the etching stop part may be inclined.
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