Abstract:
Disclosed herein are a thin-layer type common mode filter and a method for preparing the same. The thin-layer type common mode filter includes: a ferrite substrate; a primer layer formed on the ferrite substrate; and a photosensitive insulating layer formed on the primer layer, wherein the primer layer is formed by chemically coupling the ferrite substrate with the photosensitive insulating layer. Therefore, the thin-layer type common mode filter according to the exemplary embodiments of the present invention may simultaneously apply the mechanical surface treatment method and the primer layer chemically coupled with the ferrite substrate and the photosensitive insulating layer to increase the interlayer adhesion, thereby increasing the reliability of the common mode filter.
Abstract:
The present invention relates to an insulating composition for a multilayer printed circuit board including: nanoclay 0.5 to 10 wt %, a soluble liquid crystal oligomer 5 to 50 wt %, an epoxy resin 5 to 50 wt %, a solvent 5 to 40 wt %, and an inorganic filler 50 to 80 wt %, a prepreg and an insulating film using the composition, and a multilayer printed circuit board including the prepreg and the insulating film as an interlayer insulating layer. Accordingly, the composition prepared by mixing nanoclay with the soluble liquid crystal oligomer (LCO), the epoxy resin, and the inorganic filler having excellent thermal, electrical, and mechanical characteristics can be implemented as a substrate insulating material such as a prepreg or a film which can implement a low efficient of thermal expansion, high rigidity, and high thermal characteristics required for a package substrate with advanced specifications.
Abstract:
A chip component includes a magnetic substrate having ferrite layers, and an insulating layer disposed on the magnetic substrate and having an electrode disposed therein. An external electrode is connected to the electrode on the insulating layer. The magnetic substrate and the insulating layer have a chemical coupling structure formed on an interface therebetween. The chemical coupling structure includes Si—O—C or Si—O—N.
Abstract:
Disclosed herein is a multilayer inductor, manufactured by stacking laminates each including: a substrate having internal electrode coil patterns formed thereon; and a magnetic substance filling the substrate on which the internal electrode coil patterns are formed, wherein the substrate is formed by using a composition including a magnetic material, so that, when the substrate is placed in the middle of the electrode circuit patterns at the time of manufacturing a power inductor, the substrate can be utilized as a gap material, and thus the thickness of an inductor chip can be minimized, and, in addition, the magnetic material is included in the substrate forming composition, thereby improving magnetic characteristics, and the liquid crystal oligomer and the nanoclay are added to the composition, to thereby increase insulating property between magnetic metals, thereby raising inductance, and thus dimensional stability and physical hardness of the structure can be secured.