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    COIL ELECTRONIC COMPONENT
    1.
    发明申请
    COIL ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20190115145A1

    公开(公告)日：2019-04-18

    申请号：US15988497

    申请日：2018-05-24

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Chi Seong KIM ,  Jun Il KANG ,  Sa Yong LEE ,  Gun Hwi HYUNG

    IPC: H01F27/29 ,  H01F27/28 ,  H01F41/04 ,  H01F27/32

    Abstract: A coil electronic component includes a body including a plurality of insulating layers and coil patterns disposed on the insulating layers, and external electrodes formed on external surfaces of the body and connected to the coil patterns, wherein the external electrodes include first layers being electroless plating layers and second layers formed on the first layers and having a form in which metal particles are dispersed in a polymer base, respectively.

    INSULATING COMPOSITION FOR MULTILAYER PRINTED CIRCUIT BOARD, METHOD FOR PREPARING THE SAME, AND MULTILAYER PRINTED CIRCUIT BOARD COMPRISING THE SAME AS INSULATING LAYER
    3.
    发明申请
    INSULATING COMPOSITION FOR MULTILAYER PRINTED CIRCUIT BOARD, METHOD FOR PREPARING THE SAME, AND MULTILAYER PRINTED CIRCUIT BOARD COMPRISING THE SAME AS INSULATING LAYER 审中-公开
    用于多层印刷电路板的绝缘组合物，其制备方法以及包含该绝缘层的多层印刷电路板

    公开(公告)号：US20140080941A1

    公开(公告)日：2014-03-20

    申请号：US14026134

    申请日：2013-09-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sa Yong LEE ,  Jin Young KIM ,  Jin Ho HONG ,  Keun Yong LEE

    IPC: H01B3/40

    CPC classification number: H01B3/40 ,  C08J5/18 ,  C08J5/24 ,  C08K2201/011 ,  C09K19/3809 ,  C09K19/404 ,  H05K1/0373 ,  H05K3/4676 ,  H05K2201/0209 ,  C08K3/346 ,  C08L63/00 ,  C08K9/02

    Abstract: The present invention relates to an insulating composition for a multilayer printed circuit board including: nanoclay 0.5 to 10 wt %, a soluble liquid crystal oligomer 5 to 50 wt %, an epoxy resin 5 to 50 wt %, a solvent 5 to 40 wt %, and an inorganic filler 50 to 80 wt %, a prepreg and an insulating film using the composition, and a multilayer printed circuit board including the prepreg and the insulating film as an interlayer insulating layer. Accordingly, the composition prepared by mixing nanoclay with the soluble liquid crystal oligomer (LCO), the epoxy resin, and the inorganic filler having excellent thermal, electrical, and mechanical characteristics can be implemented as a substrate insulating material such as a prepreg or a film which can implement a low efficient of thermal expansion, high rigidity, and high thermal characteristics required for a package substrate with advanced specifications.

    Abstract translation: 本发明涉及一种多层印刷电路板用绝缘组合物，其包含：0.5〜10重量％的纳米粘土，5〜50重量％的可溶性液晶低聚物，5〜50重量％的环氧树脂，5〜40重量％ ，无机填料50〜80重量％，使用该组合物的预浸料和绝缘膜，以及包含预浸料和绝缘膜作为层间绝缘层的多层印刷电路板。 因此，通过将纳米粘土与可溶性液晶低聚物（LCO），环氧树脂和具有优异的热，电和机械特性的无机填料混合制备的组合物可以实现为基材绝缘材料如预浸料或薄膜 这可以实现具有先进规格的封装衬底所需的低热膨胀，高刚性和高热特性。

    COIL ELECTRONIC COMPONENT
    4.
    发明申请
    COIL ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20190122808A1

    公开(公告)日：2019-04-25

    申请号：US16029346

    申请日：2018-07-06

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dae Hui JO ,  Hye Won JUNG ,  Sa Yong LEE

    IPC: H01F27/28 ,  H01F27/29

    Abstract: A coil electronic component includes a body having a multilayer structure formed by stacking a plurality of sheets and external electrodes disposed on outer surfaces of the body. A coil pattern is printed on each of the plurality of sheets. The coil pattern includes a coil body and a corner pattern spaced apart from the coil pattern and coupled to the external electrodes. An inner edge of the second coil pattern facing the coil body is formed as a curved line or a linear line.

    INDUCTOR AND MANUFACTURING METHOD THEREOF
    7.
    发明申请
    INDUCTOR AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20190318867A1

    公开(公告)日：2019-10-17

    申请号：US16206582

    申请日：2018-11-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sa Yong LEE ,  Mi Sun HWANG

    IPC: H01F27/32 ,  H01F27/29 ,  H01F41/12 ,  H01F5/06

    Abstract: An inductor includes a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked, and first and second external electrodes disposed inside the body, wherein the plurality of coil patterns are connected by coil connecting portions and form a coil in which opposing ends thereof are connected to the first and second external electrodes, and the first and second external electrodes are directly connected to the opposing ends of the plurality of coil patterns inside the body.

    COIL COMPONENT
    8.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号：US20190267182A1

    公开(公告)日：2019-08-29

    申请号：US16408746

    申请日：2019-05-10

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Sa Yong LEE ,  Myung Sam KANG

    IPC: H01F27/29 ,  H01F17/00 ,  H01F17/04

    Abstract: A coil component includes: a body including a magnetic material, coil pattern layers disposed in the magnetic material, a core portion surrounded by the coil pattern layers, and an insulating layer disposed in the core portion and between adjacent coil pattern layers among the coil pattern layers, wherein each of the coil pattern layers comprises a spiral-shaped pattern; and an external electrode disposed on the body.

    COIL COMPONENT
    9.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号：US20170148562A1

    公开(公告)日：2017-05-25

    申请号：US15337603

    申请日：2016-10-28

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Sa Yong LEE ,  Myung Sam KANG

    IPC: H01F27/28 ,  H01F27/29 ,  H01F27/24

    CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F17/04

    Abstract: A coil component includes: a body including a magnetic material, coil pattern layers disposed in the magnetic material, a core portion surrounded by the coil pattern layers, and an insulating layer disposed in the core portion and between adjacent coil pattern layers among the coil pattern layers, wherein each of the coil pattern layers comprises a spiral-shaped pattern; and an external electrode disposed on the body.

    MULTILAYER INDUCTOR AND METHOD FOR MANUFACTURING THE SAME
    10.
    发明申请
    MULTILAYER INDUCTOR AND METHOD FOR MANUFACTURING THE SAME 有权
    多层电感器及其制造方法

    公开(公告)号：US20140145812A1

    公开(公告)日：2014-05-29

    申请号：US13842187

    申请日：2013-03-15

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sa Yong LEE ,  Jin Young KIM ,  Keun Yong LEE ,  Geum Hee YUN ,  Moon Soo PARK

    IPC: H01F17/00 ,  H01F41/04

    CPC classification number: H01F17/0013 ,  H01F41/041 ,  H01F41/046 ,  H01F2017/048 ,  Y10T29/4902

    Abstract: Disclosed herein is a multilayer inductor, manufactured by stacking laminates each including: a substrate having internal electrode coil patterns formed thereon; and a magnetic substance filling the substrate on which the internal electrode coil patterns are formed, wherein the substrate is formed by using a composition including a magnetic material, so that, when the substrate is placed in the middle of the electrode circuit patterns at the time of manufacturing a power inductor, the substrate can be utilized as a gap material, and thus the thickness of an inductor chip can be minimized, and, in addition, the magnetic material is included in the substrate forming composition, thereby improving magnetic characteristics, and the liquid crystal oligomer and the nanoclay are added to the composition, to thereby increase insulating property between magnetic metals, thereby raising inductance, and thus dimensional stability and physical hardness of the structure can be secured.

    Abstract translation: 本文公开了一种层叠电感器，其通过层叠层叠体制造，每个层叠体包括：其上形成有内部电极线圈图案的基板; 以及填充形成有内部电极线圈图案的基板的磁性物质，其中通过使用包括磁性材料的组合物形成基板，使得当基板被放置在电极电路图案的中间时 制造功率电感器时，可以将衬底用作间隙材料，从而可以使电感器芯片的厚度最小化，并且另外，磁性材料被包括在基板形成组合物中，从而改善磁特性，以及 将液晶低聚物和纳米粘土添加到组合物中，从而提高磁性金属之间的绝缘性，从而提高电感，从而可以确保结构的尺寸稳定性和物理硬度。

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