公开(公告)号：US20160192471A1

公开(公告)日：2016-06-30

申请号：US14981378

申请日：2015-12-28

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae-Hong MIN ,  Myung-Sam KANG ,  Young-Gwan KO ,  Min-Jae SEONG

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/18 ,  H05K3/00 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K3/4602 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/2518 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/181 ,  H05K1/185

Abstract: A circuit board and a method of manufacturing the same are disclosed. The circuit board includes an insulating part, a thermally conductive structure comprising a first structure and a second structure, and an insulator configured to insulate the first structure from the second structure, wherein the first structure and the second structure are composed of thermally conductive material, and at least a part of the thermally conductive structure is inserted to the insulating part.

Abstract translation: 公开了一种电路板及其制造方法。 电路板包括绝缘部分，包括第一结构和第二结构的导热结构，以及被配置为使第一结构与第二结构绝缘的绝缘体，其中第一结构和第二结构由导热材料构成， 并且所述导热结构的至少一部分被插入所述绝缘部。

公开(公告)号：US20160249457A1

公开(公告)日：2016-08-25

申请号：US15045544

申请日：2016-02-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae-Hong MIN ,  Myung-Sam KANG ,  Young-Gwan KO ,  Min-Jae SEONG

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/00 ,  H05K1/113 ,  H05K3/4608 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/09672 ,  H05K2201/09872 ,  H05K2201/10674

Abstract: A circuit board and an assembly including the circuit board are provided. The circuit board includes a first insulation layer, a first conductive pattern disposed on the first insulation layer, an insulation film disposed on the first conductive pattern, and a second conductive pattern disposed on the insulation film. The insulation film includes an insulation thin film contacting the first conductive pattern, and a function film disposed on the insulation thin film and contacting the second conductive pattern.

Abstract translation: 提供电路板和包括电路板的组件。 电路板包括第一绝缘层，设置在第一绝缘层上的第一导电图案，设置在第一导电图案上的绝缘膜，以及布置在绝缘膜上的第二导电图案。 绝缘膜包括与第一导电图案接触的绝缘薄膜和设置在绝缘薄膜上并与第二导电图案接触的功能膜。