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公开(公告)号：US20190163945A1
公开(公告)日：2019-05-30
申请号：US15966621
申请日：2018-04-30
发明人： Ju Ho KIM , Eun Sil KIM , Sang Kyu LEE , Jong Man KIM , Seok Hwan KIM
摘要： A fan-out sensor package includes: a core member including a wiring layer including a plurality of layers and having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole; an encapsulant encapsulating at least portions of the core member and the IC for a sensor; and a connection member disposed on the core member and the IC for a sensor and including a plurality of circuit layers, wherein the circuit layer includes sensing patterns detecting a change in capacitance.
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公开(公告)号：US20220171154A1
公开(公告)日：2022-06-02
申请号：US17211336
申请日：2021-03-24
发明人： Se Yeon HWANG , Seok Hwan KIM , Tae Ho YUN , Kyung Ho LEE
IPC分类号： G02B7/02
摘要： A lens assembly includes: a lens barrel; a lens accommodated in the lens barrel; and a fixing member disposed on one side of the lens and configured fix the lens to the lens barrel. The fixing member has an open ring shape.
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公开(公告)号：US20200373271A1
公开(公告)日：2020-11-26
申请号：US16540715
申请日：2019-08-14
发明人： Hyung Joon KIM , Seok Hwan KIM , Sung Il JO , Jung Ho SHIM
IPC分类号： H01L23/00 , H01L23/495 , H01L23/498 , H01L23/31 , H01L23/48
摘要： An electronic component module includes a semiconductor package having a first surface provided as a mounting surface and a second surface opposing the first surface, and including a semiconductor chip, a component package having a first surface facing the second surface of the semiconductor package, and a second surface opposing the first surface of the component package, the component package including a passive component, and a connector disposed on the second surface of the component package and having a connection surface configured to be mechanically coupled to an external device, the connector including a plurality of connection lines arranged on the connection surface.
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公开(公告)号：US20240361559A1
公开(公告)日：2024-10-31
申请号：US18482222
申请日：2023-10-06
发明人： Ho-Jae LEE , Seok Hwan KIM , Yeook JEON
摘要： A lens driving apparatus is provided. The lens driving apparatus includes a first frame which accommodates a lens; a driver, connected to the first frame, and configured to generate a driving force to move the first frame in a first direction; and a group of rolling members that include at least one multi-layered rolling member including two or more different materials, wherein the group of rolling members at least partially contacts the first frame.
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公开(公告)号：US20230176314A1
公开(公告)日：2023-06-08
申请号：US17861749
申请日：2022-07-11
发明人： Se Yeon HWANG , Kyung Ho LEE , Seok Hwan KIM , Seung Jae SONG
IPC分类号： G02B7/02
摘要： A camera module includes: a housing defining an internal space; a first lens module disposed in the internal space to move along an optical axis direction, the first lens module including at least one first bearing member; a second lens module disposed in the internal space to move along the optical axis direction, the second lens module including at least one second bearing member; a shaft disposed in the housing and supporting a first side of the first lens module and contacting the at least one first bearing member and supporting a first side of the second lens module and contacting the at least one second bearing member; at least one first ball member supporting a second side of the first lens module; and at least one second ball member supporting a second side of the second lens module.
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公开(公告)号：US20220170805A1
公开(公告)日：2022-06-02
申请号：US17217325
申请日：2021-03-30
发明人： Jong Man KIM , Se Yeon HWANG , Kyung Ho LEE , Seok Hwan KIM , Chul Kyu KIM , Han KIM
摘要： A force sensing device includes a support member including: a sensor support portion to which a force sensor is coupled on one surface of the support member; and a frame coupling portion extending from the sensor support portion. The force sensing device further includes: a frame disposed to face another surface of the support member, and disposed to be spaced apart from the support member; and at least one spacing member disposed between the support member and the frame, and spacing the support member apart from the frame. The force sensor is not disposed in the frame coupling portion. The spacing member is disposed between the frame coupling portion and the frame.
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公开(公告)号：US20180331054A1
公开(公告)日：2018-11-15
申请号：US16042644
申请日：2018-07-23
发明人： Han KIM , Kyung Moon JUNG , Seok Hwan KIM , Kyung Ho LEE , Kang Heon HUR
IPC分类号： H01L23/00
摘要： A fan-out semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of the inactive surface, a first connection member disposed on the active surface and including a redistribution layer and a first via electrically connecting the connection pad to the redistribution layer, a passivation layer disposed on the first connection member, and an under-bump metal layer including an external connection pad disposed on the passivation layer and a second via connecting the external connection pad to the redistribution layer. In a vertical direction, the first and second vias are disposed within the external connection pad and do not overlap each other.
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公开(公告)号：US20180090458A1
公开(公告)日：2018-03-29
申请号：US15402383
申请日：2017-01-10
发明人： Han KIM , Kyung Moon JUNG , Seok Hwan KIM , Kyung Ho LEE , Kang Heon HUR
IPC分类号： H01L23/00
CPC分类号： H01L24/04 , H01L24/02 , H01L24/05 , H01L24/19 , H01L2224/02331 , H01L2224/0235 , H01L2224/02375 , H01L2224/02379 , H01L2224/02381 , H01L2224/0401 , H01L2224/05008 , H01L2224/05091 , H01L2224/05092 , H01L2224/13024 , H01L2224/16225 , H01L2224/18 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/18162 , H01L2924/3512 , H01L2924/35121 , H01L2924/00
摘要： A fan-out semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of the inactive surface, a first connection member disposed on the active surface and including a redistribution layer and a first via electrically connecting the connection pad to the redistribution layer, a passivation layer disposed on the first connection member, and an under-bump metal layer including an external connection pad disposed on the passivation layer and a second via connecting the external connection pad to the redistribution layer. In a vertical direction, the first and second vias are disposed within the external connection pad and do not overlap each other.
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公开(公告)号：US20240184078A1
公开(公告)日：2024-06-06
申请号：US18363975
申请日：2023-08-02
发明人： Yeo Ok JEON , Seok Hwan KIM , Ho Jae LEE
摘要： A lens assembly is provided. The lens assembly includes a lens barrel, at least two lenses arranged inside the lens barrel along an optical axis direction, and a spacer provided between the at least two lenses, wherein the spacer includes a first alignment portion and a second alignment portion seated in respective protrusions or recesses provided on a rib of the first lens and a rib of the second lens.
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公开(公告)号：US20220128832A1
公开(公告)日：2022-04-28
申请号：US17179655
申请日：2021-02-19
发明人： Se Yeon HWANG , Seok Hwan KIM
摘要： An aperture module includes: a base; a rotating plate rotatably disposed on the base; and blades configured to form an incident hole and move by rotation of the rotating plate to change a size of the incident hole. The blades are disposed in an opening disposed inside the rotating plate.
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