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    FAN-OUT SEMICONDUCTOR PACKAGE
    3.
    发明申请
    FAN-OUT SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20190096824A1

    公开(公告)日：2019-03-28

    申请号：US15923708

    申请日：2018-03-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Kang Heon HUR ,  Jong Man KIM ,  Kyung Ho LEE ,  Han KIM

    IPC: H01L23/00 ,  H01L23/31 ,  H01L23/373

    Abstract: A semiconductor package includes a wiring portion including an insulating layer, conductive patterns disposed on the insulating layer, and conductive vias penetrating through the insulating layer and connected to the conductive patterns, a semiconductor chip disposed on the wiring portion, an encapsulant disposed on the wiring portion and encapsulating at least a portion of the semiconductor chip, and a metal layer disposed on the semiconductor chip and the encapsulant and having a thickness of 10 μm to 70 μm.

    SEMICONDUCTOR PACKAGE
    6.
    发明申请
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20190189579A1

    公开(公告)日：2019-06-20

    申请号：US15965590

    申请日：2018-04-27

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seok Hwan KIM ,  Han KIM ,  Kyung Ho LEE ,  Kyung Moon JUNG

    IPC: H01L23/00 ,  H01L23/28 ,  H01L23/538 ,  H01L23/498

    Abstract: A semiconductor package includes: a connection member having a first surface and a second surface opposing each other in a stacking direction of the semiconductor package and including an insulating member and a redistribution layer formed on the insulating member and having a redistribution via; a semiconductor chip disposed on the first surface of the connection member and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip; a passivation layer disposed on the second surface of the connection member; UBM pads disposed on the passivation layer and overlapping the redistribution vias in the stacking direction; and UBM vias connecting the UBM pads to the redistribution layer through the passivation layer, not overlapping the redistribution vias with respect to the stacking direction, and having a non-circular cross section.

    SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE
    7.
    发明申请
    SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE 审中-公开
    测量温度系统和测量温度的方法

    公开(公告)号：US20140184782A1

    公开(公告)日：2014-07-03

    申请号：US14142714

    申请日：2013-12-27

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Seung Wan WOO ,  Po Chul KIM ,  Young Nam HWANG ,  Kyung Ho LEE ,  Suk Jin HAM

    IPC: H01L21/66 ,  H05K1/02

    CPC classification number: H01L22/12 ,  G01B11/167 ,  G01B11/254 ,  G01B11/306 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Disclosed herein are a system for measuring a warpage and a method for measuring a warpage. The system for measuring a warpage includes: a heating plate portion heating the sample; and a reference gating portion disposed between the sample and the camera so as to be spaced apart from the sample by a predetermined distance, wherein the reference grating portion includes a plurality of wires that are each spaced apart from each other by a predetermined interval, thereby accurately measuring the warpage without being affected by the fume generated from the sample.

    Abstract translation: 本文公开了一种用于测量翘曲的系统和用于测量翘曲的方法。 用于测量翘曲的系统包括：加热试样的加热板部分; 以及设置在样本和照相机之间以便与样本间隔开预定距离的参考门控部分，其中参考光栅部分包括彼此间隔开预定间隔的多条电线，从而 准确地测量翘曲而不受样品产生的烟雾影响。

    LAMINATION LAYER TYPE SEMICONDUCTOR PACKAGE
    8.
    发明申请
    LAMINATION LAYER TYPE SEMICONDUCTOR PACKAGE 审中-公开
    层压层型半导体封装

    公开(公告)号：US20140145323A1

    公开(公告)日：2014-05-29

    申请号：US14089724

    申请日：2013-11-25

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Kyung Ho LEE ,  Hyun Bok KWON ,  Seung Wan WOO ,  Young Nam HWANG ,  Suk Jin HAM ,  Po Chul KIM ,  So Hyang EUN ,  Se Jun PARK

    IPC: H01L23/373

    CPC classification number: H01L23/49816 ,  H01L23/3128 ,  H01L23/3737 ,  H01L23/49833 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15331

    Abstract: Disclosed herein is a lamination layer type semiconductor package, and more particularly, a lamination layer type semiconductor package capable of maintaining a thickness of a package on package structure at a minimum and minimizing a warpage defect by mounting two chips so as to correspond to each other. The lamination layer type semiconductor package includes: an upper package having an upper flip chip mounted on an upper substrate; a lower package having a lower flip chip mounted on a lower substrate and disposed so as to closely adhere the upper flip chip and the lower flip chip to each other; a heat dissipation adhesive member adhesively fixing the upper flip chip and the lower flip chip and dissipating heat generated from the upper flip chip and the lower flip chip; and a molding member molding between the upper substrate and the lower substrate.

    Abstract translation: 本文公开了一种叠层型半导体封装，更具体地说，是一种能够将封装结构上的封装的厚度最小化并且通过安装两个芯片以使彼此对应来最小化翘曲缺陷的层压层型半导体封装 。 叠层型半导体封装包括：上封装，其具有安装在上基板上的上倒装芯片; 下封装，其具有安装在下基板上的下倒装芯片，并且被设置为将上倒装芯片和下倒装芯片彼此紧贴; 散热粘合构件，其粘合地固定所述上倒装芯片和所述下倒装芯片，并消散由所述上倒装芯片和所述下倒装芯片产生的热量; 以及在上基板和下基板之间成型的成型部件。

    SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE
    10.
    发明申请
    SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE 有权
    测量温度系统和测量温度的方法

    公开(公告)号：US20140104417A1

    公开(公告)日：2014-04-17

    申请号：US14048703

    申请日：2013-10-08

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Seung Wan WOO ,  Young Nam HWANG ,  Po Chul KIM ,  Kyung Ho LEE ,  Suk Jin HAM

    IPC: G01N21/88

    CPC classification number: G01N21/88 ,  G01B11/306 ,  G01N25/16

    Abstract: Disclosed herein are a system of measuring a warpage and a method of measuring a warpage. The system of measuring a warpage of a sample by analyzing an image photographed by the camera using light that is diffused from a light source and reflected on a surface of a sample and is arrived at the camera through a reference grating part, the system includes: an intake part that removes a fume generated from the sample. By this configuration, it is possible to measure the warpage while effectively removing the fume generated from the sample according to the increase in the temperature of the sample at the time of measuring the warpage, thereby improving the accuracy of the warpage measurement.

    Abstract translation: 这里公开了测量翘曲的系统和测量翘曲的方法。 通过使用从光源扩散并在样品表面上反射的光通过分析由相机拍摄的图像并通过参考光栅部件到达相机的方式来测量样品的翘曲的系统，该系统包括： 一个摄取部分去除样品产生的烟雾。 通过该结构，可以根据测定翘曲时的试样的温度的上升而有效地除去样品产生的烟雾，能够测量翘曲，提高翘曲测定精度。

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