COIL COMPONENT
    1.
    发明申请

    公开(公告)号:US20210057138A1

    公开(公告)日:2021-02-25

    申请号:US16773071

    申请日:2020-01-27

    Abstract: A coil component includes a body having one surface and the other surface, opposing each other, and one side surface and the other side surface, each connecting the one surface and the other surface to each other, opposing each other, a recess formed in each of the one side surface and the other side surface of the body to extend to the one surface of the body, a support substrate disposed inside the body, a coil portion, disposed on the support substrate, having one end portion and the other end portion exposed to the recess, an oxide insulating layer disposed on a surface of the body, and a first insulating layer disposed along a surface of the oxide insulating layer to cover the surface of the body.

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20250126703A1

    公开(公告)日:2025-04-17

    申请号:US18734089

    申请日:2024-06-05

    Inventor: Seung Min LEE

    Abstract: A printed circuit board includes an insulating layer, a wiring layer disposed on the insulating layer and including a plurality of metal pads and at least one metal pattern, and a solder resist layer disposed on an upper portion of the insulating layer, covering at least a portion of the wiring layer, and having a plurality of first openings respectively exposing at least a portion of each of the plurality of metal pads and one or more second openings respectively exposing at least a portion of the at least one metal pattern. The one or more second openings respectively have at least two concave portions concave in a plane toward an inside of each of the second openings. The plurality of first openings and the one or more second openings are disposed in a mounting area of a semiconductor chip of the solder resist layer.

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