公开(公告)号：US20240142597A1

公开(公告)日：2024-05-02

申请号：US18103089

申请日：2023-01-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Won Wook SO ,  Gilha LEE ,  Taegyu RYU ,  YunJong LEE

IPC: G01S13/46 ,  G01S13/86 ,  G01S13/931

CPC classification number: G01S13/46 ,  G01S13/867 ,  G01S13/931 ,  G01S2013/462 ,  G01S2013/93271 ,  G01S2013/93275

Abstract: Disclosed is a method of detecting a moving target by a target detecting apparatus. The method includes: acquiring radar data from a radar installed in a vehicle, extracting location coordinates of a moving target from the radar data, obtaining a line of a reflective surface on which a signal of the radar is reflected using location coordinates of a fixed object, determining whether the moving target is in a Line of Sight (LOS) area of the radar or in a Non Line of Sight (NLOS) area of the radar based on the location coordinates of the moving target and the line segment of the reflective surface, and based on determining that the moving target is in an area corresponding to the NLOS area of the radar, converting the location coordinates of the moving target into actual coordinates corresponding to an actual location of the moving target.

公开(公告)号：US20200321293A1

公开(公告)日：2020-10-08

申请号：US16430959

申请日：2019-06-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Doo IL KIM ,  Won Wook SO ,  Young Sik HUR ,  Jung Chul GONG

IPC: H01L23/66 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01Q1/52 ,  H01Q1/38

Abstract: An antenna module includes an antenna substrate, a first semiconductor package, disposed on the antenna substrate, including a first connection member including one or more first redistribution layers, electrically connected to the antenna substrate, and a first semiconductor chip disposed on the first connection member, and a second semiconductor package, disposed on the antenna substrate to be spaced apart from the first semiconductor package, including a second connection member including one or more second redistribution layers, electrically connected to the antenna substrate, and a second semiconductor chip disposed on the second connection member. The first semiconductor chip and the second semiconductor chip are different types of semiconductor chips.

公开(公告)号：US20190115310A1

公开(公告)日：2019-04-18

申请号：US16218203

申请日：2018-12-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Ho BAEK ,  Doo Il KIM ,  Young Sik HUR ,  Jung Hyun CHO ,  Won Wook SO

IPC: H01L23/66 ,  H01L25/065 ,  H01L23/31 ,  H01L23/00

Abstract: A composite antenna substrate and semiconductor package module includes: a fan-out semiconductor package including a semiconductor chip, an encapsulant encapsulating at least portions of the semiconductor chip, and a connection member including a redistribution layer electrically connected to connection pads; and an antenna substrate including an antenna member including antenna patterns, ground patterns, and feed lines, and a wiring member disposed below the antenna member and including wiring layers including feeding patterns electrically connected to the feed lines.

公开(公告)号：US20160322999A1

公开(公告)日：2016-11-03

申请号：US15090946

申请日：2016-04-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Doo Il KIM ,  Won Wook SO

IPC: H04B1/3827 ,  H01Q1/27

CPC classification number: H04B1/385 ,  H01Q1/273 ,  H01Q1/36 ,  H01Q9/42 ,  H04B2001/3861

Abstract: An electronic device includes a housing accommodating a communications circuit, a strap having one end connected to the housing and bent to couple another end of the strap and the housing, and an antenna included in at least one of the housing and the strap and connected to the communications circuit.

Abstract translation: 一种电子设备，包括容纳通信电路的壳体，具有连接到壳体并弯曲以耦合带子和壳体的另一端的带子，以及包括在壳体和带中的至少一个中的天线，并连接到 通信电路。

公开(公告)号：US20220077584A1

公开(公告)日：2022-03-10

申请号：US17116228

申请日：2020-12-09

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Eunhyuk KWAK ,  Won Wook SO ,  Juhyoung PARK ,  Daeki LIM ,  Jeongki RYOO ,  Nam Ki KIM ,  Woncheol LEE ,  Hyungjin LEE ,  Dongok KO ,  Jaemin KEUM

IPC: H01Q9/04 ,  H01Q1/38 ,  H01Q1/22

Abstract: An antenna apparatus includes a ground layer and an antenna patch overlapping via a dielectric layer therebetween, a first feed via and a second feed via penetrating at least a portion of the dielectric layer, a power supply line connected to the first feed via, and a coupling pattern disposed adjacent to the power supply line and coupled with the power supply line.

公开(公告)号：US20200344869A1

公开(公告)日：2020-10-29

申请号：US16566217

申请日：2019-09-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Won Wook SO ,  Doo Il KIM ,  Young Sik HUR

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/14 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01Q1/38

Abstract: A printed circuit board assembly includes a first printed circuit board, a second printed circuit board disposed on the first printed circuit board and including an antenna pattern, a third printed circuit board disposed on the first printed circuit board, one or more first electronic components disposed between the first and the second printed circuit board and electrically connected to at least one of the first and the second printed circuit board, one or more second electronic components disposed between the first and the third printed circuit board, and electrically connected to at least one of the first and the third printed circuit board, a first interposer substrate electrically connecting the first printed circuit board and the second printed circuit board to each other, and a second interposer substrate electrically connecting the first printed circuit board and the third printed circuit board to each other.

公开(公告)号：US20230121641A1

公开(公告)日：2023-04-20

申请号：US17957648

申请日：2022-09-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Woncheol LEE ,  Wongi KIM ,  Jeongki RYOO ,  Won Wook SO ,  Gilha LEE ,  Sungyong AN

IPC: H01Q9/04 ,  H01Q1/50

Abstract: A dielectric resonator antenna includes a dielectric material block extending in a first direction, a second direction different from the first direction, and a third direction perpendicular to the first direction and the second direction; and a feeding part extending in the third direction from a bottom surface of the dielectric material block to a part of the dielectric material block, wherein the feeding part overlaps a diagonal, or an extension line of the diagonal, of the bottom surface of the dielectric material block intersecting a first position where a first edge of the bottom surface of the dielectric material block parallel to the first direction and a second edge of the bottom surface of the dielectric material block parallel to the second direction meet.

公开(公告)号：US20190229055A1

公开(公告)日：2019-07-25

申请号：US16107727

申请日：2018-08-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Won Wook SO ,  Jin Seon PARK ,  Young Sik HUR ,  Yong Ho BAEK

IPC: H01L23/522 ,  H01L23/00 ,  H01L21/56

Abstract: A fan-out sensor package includes: a first semiconductor chip module including a first connection member having a first through-hole and a first wiring layer, a first semiconductor chip disposed in the first through-hole and having an active surface on which a sensing region and first connection pads are disposed, and an encapsulant encapsulating at least portions of the first connection member and the first semiconductor chip and filling at least portions of the first through-hole; a redistribution module having a second through-hole exposing at least a portion of the sensing region and including a redistribution layer; and electrical connection structures electrically connecting the first wiring layer and the first connection pads to the redistribution layer.

公开(公告)号：US20230152425A1

公开(公告)日：2023-05-18

申请号：US17864137

申请日：2022-07-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Won Wook SO ,  Gilha LEE ,  Taegyu RYU

IPC: G01S7/41 ,  G01S13/931 ,  G01S13/42 ,  G01S13/52

CPC classification number: G01S7/415 ,  G01S13/931 ,  G01S7/411 ,  G01S13/42 ,  G01S13/52

Abstract: A method for detecting a moving target through a vehicle radar system includes acquiring radar data from a radar sensor disposed with respect to a vehicle, and using the radar data to detect a plane of a structure. The method also includes setting a reference classification line based on the detected plane, and determining whether the moving target is in a line of sight (LOS) area or a non-line of sight (NLOS) area based on the reference classification line.

公开(公告)号：US20190173195A1

公开(公告)日：2019-06-06

申请号：US15972905

申请日：2018-05-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Doo Il KIM ,  Jung Hyun CHO ,  Won Wook SO ,  Young Sik HUR ,  Yong Ho BAEK

IPC: H01Q21/00 ,  H01Q1/38 ,  H01Q1/02 ,  H01Q1/24

Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) package disposed on a first surface of the connection member; and an antenna package including a plurality of antenna members and a plurality of feed vias, and disposed on a second surface of the connection member, wherein the IC package includes: an IC having an active surface electrically connected to at least one wiring layer and an inactive surface opposing the active surface, and generating the RF signal; a heat sink member disposed on the inactive surface of the IC; and an encapsulant encapsulating at least portions of the IC and the heat sink member.