公开(公告)号：US20150155259A1

公开(公告)日：2015-06-04

申请号：US14619155

申请日：2015-02-11

Applicant: Samsung Electronics Co., Ltd

Inventor： Gi-Jun PARK ,  Won-Keun KIM ,  Teak-Hoon LEE ,  Chang-Seong JEON ,  Young-Kun JEE

IPC: H01L23/00 ,  H01L21/56

CPC classification number: H01L24/81 ,  H01L21/50 ,  H01L21/56 ,  H01L21/563 ,  H01L21/673 ,  H01L21/67346 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L25/03 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00

Abstract: A substrate of a semiconductor package includes a first wiring substrate having a first surface and a second surface facing each other, the first surface having a semiconductor chip mounted thereon, a first support carrier, and an adhesive film connecting the second surface and the first support carrier.

Abstract translation: 半导体封装的基板包括具有第一表面和彼此面对的第二表面的第一布线基板，其上安装有半导体芯片的第一表面，第一支撑载体和将第二表面和第一支撑件连接的粘合膜 载体

公开(公告)号：US20140008794A1

公开(公告)日：2014-01-09

申请号：US13900612

申请日：2013-05-23

Applicant: Samsung Electronics Co., Ltd

Inventor： Gi-Jun PARK ,  Won-Keun KIM ,  Teak-Hoon LEE ,  Chang-Seong JEON ,  Young-Kun JEE

IPC: H01L23/498 ,  H01L23/48

CPC classification number: H01L24/81 ,  H01L21/50 ,  H01L21/56 ,  H01L21/563 ,  H01L21/673 ,  H01L21/67346 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L25/03 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00

Abstract: A substrate of a semiconductor package includes a first wiring substrate having a first surface and a second surface facing each other, the first surface having a semiconductor chip mounted thereon, a first support carrier, and an adhesive film connecting the second surface and the first support carrier.

Abstract translation: 半导体封装的基板包括具有第一表面和彼此面对的第二表面的第一布线基板，其上安装有半导体芯片的第一表面，第一支撑载体和将第二表面和第一支撑件连接的粘合膜 载体