公开(公告)号：US20170141050A1

公开(公告)日：2017-05-18

申请号：US15293786

申请日：2016-10-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaegwon JANG ,  Youngjae KIM ,  Baikwoo LEE

IPC: H01L23/00 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3121 ,  H01L24/13 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A printed circuit board includes chip regions on which semiconductor chips are mounted, and a scribe region surrounding each of the chip regions. The scribe region includes first vent holes that are configured to receive a flow of molding resin and are arranged along a first direction corresponding to a flow direction of the molding resin.