公开(公告)号：US20140146210A1

公开(公告)日：2014-05-29

申请号：US14067293

申请日：2013-10-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeokjong Lee ,  Byung-Jo Kim ,  Jaejung Park ,  Yunjung Kim ,  Jinho Seo ,  Seung Hyun Lim ,  Seogheon Ham

IPC: H04N5/361

CPC classification number: H04N5/361 ,  H04N5/378

Abstract: A solid state imaging device includes a pixel array comprising a plurality of photoelectric conversion devices and an analog to digital conversion (ADC) circuit configured to convert an image signal received from the pixel array to a digital signal responsive to a ramp signal and a gain setting. The solid state imaging device further includes a ramp signal generator circuit configured to generate the ramp signal with a slope that varies responsive to a control signal and a dark level offset compensation circuit configured to generate the control signal responsive to the gain setting and a dark level measurement.

Abstract translation: 固态成像装置包括像素阵列，其包括多个光电转换装置和模数转换（ADC）电路，模拟数字转换（ADC）电路被配置为响应于斜坡信号和增益设置将从像素阵列接收的图像信号转换为数字信号 。 固态成像装置还包括斜坡信号发生器电路，该斜坡信号发生器电路被配置为产生具有响应于控制信号变化的斜率的斜坡信号和配置成响应于增益设置产生控制信号的暗电平偏移补偿电路和暗电平 测量。

公开(公告)号：US09584742B2

公开(公告)日：2017-02-28

申请号：US14540450

申请日：2014-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byung-Chul Park ,  Won-Baek Lee ,  Byung-Jo Kim ,  Jin-Ho Seo ,  Seog-Heon Ham

IPC: H04N5/347

CPC classification number: H04N5/347

Abstract: A method of binning pixels in an image sensor including: dividing a pixel array into a plurality of binning areas, wherein each binning area includes (2n)*(2n) pixels, wherein n is an integer equal to or greater than two; and generating binning pixel data in each of the binning areas, wherein the locations of the binning pixel data of each binning area are evenly distributed within the binning area.

Abstract translation: 一种对图像传感器中的像素进行合并的方法，包括：将像素阵列划分成多个合并区域，其中每个合并区域包括（2n）*（2n）个像素，其中n是等于或大于2的整数; 以及在每个合并区域中生成合并像素数据，其中每个合并区域的合并像素数据的位置均匀分布在合并区域内。

公开(公告)号：US09537501B2

公开(公告)日：2017-01-03

申请号：US14546154

申请日：2014-11-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeokjong Lee ,  Byung-Jo Kim ,  Se-jun Kim

IPC: H01L27/146 ,  H03M1/12 ,  H03M1/56

CPC classification number: H03M1/1295 ,  H03M1/123 ,  H03M1/56

Abstract: An image sensor in accordance with exemplary embodiments of the inventive concept may include a pixel sensor array which includes an active pixel sensor and an optical black pixel sensor; a first analog to digital converter configured to convert a first sensing signal, which is provided from the active pixel sensor, to a first digital signal; a second analog to digital converter configured to convert a second sensing signal, which is provided from the optical black pixel sensor, to a second digital signal; and an output buffer configured to temporarily store and output the first digital signal and the second digital signal, wherein a plurality of noise characteristics of the second analog to digital converter is different from a plurality of noise characteristics of the first analog to digital converter.

Abstract translation: 根据本发明构思的示例性实施例的图像传感器可以包括像素传感器阵列，其包括有源像素传感器和光学黑色像素传感器; 第一模数转换器，被配置为将从有源像素传感器提供的第一感测信号转换为第一数字信号; 第二模数转换器，被配置为将从所述光学黑色像素传感器提供的第二感测信号转换为第二数字信号; 以及输出缓冲器，被配置为临时存储和输出第一数字信号和第二数字信号，其中第二模数转换器的多个噪声特性与第一模数转换器的多个噪声特性不同。

公开(公告)号：US09191555B2

公开(公告)日：2015-11-17

申请号：US13677965

申请日：2012-11-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yujin Park ,  Seogheon Ham ,  Byung-Jo Kim

IPC: H04N5/217 ,  H04N5/365

CPC classification number: H04N5/217 ,  H04N5/365

Abstract: The signal compensating method includes receiving sensing signals from an image sensor pixel array; converting the sensing signals into digital signals using a plurality of analog-to-digital converters, respectively; and compensating the digital signals using offset values corresponding to the plurality of analog-to-digital converters, respectively.

Abstract translation: 信号补偿方法包括从图像传感器像素阵列接收感测信号; 分别使用多个模数转换器将感测信号转换成数字信号; 以及分别使用与所述多个模数转换器对应的偏移值来补偿所述数字信号。

公开(公告)号：US09148598B2

公开(公告)日：2015-09-29

申请号：US14224668

申请日：2014-03-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung-Jo Kim ,  Tae-Chan Kim ,  Kyoung Min Koh ,  Kyung-Min Kim

IPC: H04N5/335 ,  H04N5/374 ,  H04N5/345 ,  H04N5/3745

CPC classification number: H04N5/374 ,  H04N5/3452 ,  H04N5/3745

Abstract: The image sensor includes a plurality of column lines, a plurality of active road circuits and a selection circuit. The plurality of column lines are each connected to a corresponding one of a plurality of pixels. The plurality of active road circuits are each connected to a corresponding one of the plurality of column lines. The selection circuit is configured to enable a portion of the plurality of active road circuits based on a plurality of column selection signals.

Abstract translation: 图像传感器包括多个列线，多个有源道路电路和选择电路。 多个列线分别连接到多个像素中的对应的一列。 多个主动道路电路各自连接到多条列线中的相应一条。 选择电路被配置为基于多个列选择信号使得多个主动道路电路的一部分能够启用。