公开(公告)号：US20170062374A1

公开(公告)日：2017-03-02

申请号：US15015758

申请日：2016-02-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kunmo CHU ,  Wonsuk CHANG ,  Chanmoon CHUNG

IPC: H01L23/00

CPC classification number: H01L24/33 ,  H01B1/22 ,  H01L23/53276 ,  H01L23/5328 ,  H01L24/09 ,  H01L24/29 ,  H01L2224/29028 ,  H01L2224/29105 ,  H01L2224/29198 ,  H01L2224/29393 ,  H01L2224/29394 ,  H01L2224/2949 ,  H01L2224/2957 ,  H01L2224/29691 ,  H01L2224/32227 ,  H01L2924/01006 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/1426 ,  H01R4/04 ,  H01R13/2414 ,  H05K3/323 ,  H05K3/3436 ,  H05K2201/0224 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10674 ,  H05K2203/0425

Abstract: Provided are anisotropic conductive materials, electronic devices including anisotropic conductive materials, and/or methods of manufacturing the electronic devices. An anisotropic conductive material may include a plurality of particles in a matrix material layer. At least some of the particles may include a core portion and a shell portion covering the core portion. The core portion may include a conductive material that is in a liquid state at a temperature greater than 15° C. and less than or equal to about 110° C. or less. For example, the core portion may include at least one of a liquid metal, a low melting point solder, and a nanofiller. The shell portion may include an insulating material. A bonding portion formed by using the anisotropic conductive material may include the core portion outflowed from the particle and may further include an intermetallic compound.

Abstract translation: 提供各向异性导电材料，包括各向异性导电材料的电子器件和/或制造电子器件的方法。 各向异性导电材料可以包括基质材料层中的多个颗粒。 至少一些颗粒可以包括芯部分和覆盖芯部分的壳部分。 核心部分可以包括在大于15℃且小于或等于约110℃或更低的温度下处于液态的导电材料。 例如，芯部可以包括液态金属，低熔点焊料和纳米填料中的至少一种。 外壳部分可以包括绝缘材料。 通过使用各向异性导电材料形成的接合部可以包括从颗粒流出的芯部，还可以包含金属间化合物。