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1.发明申请公开(公告)号：US20210227603A1
公开(公告)日：2021-07-22
申请号：US17151779
申请日：2021-01-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jeongho AHN , Sungnam KANG , Jungyouel BANG , Sunyoung SONG
Abstract: In accordance with certain embodiments of the disclosure, an electronic device comprises a communication circuitry configured to transmit or receive a first wireless communication signal to an external device in a first communication scheme; a memory; and a processor, wherein the processor is configured to: scan for a second wireless communication signal by a second communication scheme proximate to the electronic device; operate in a first mode of controlling a transmission power of the first wireless communication signal based on receive sensitivity for the first wireless communication signal of the external device, when the second wireless communication signal is determined to interfere less than an interference level with the first communication scheme; and operate in a second mode of transmitting the first wireless communication signal at a higher transmission power than the first mode, when the second wireless communication signal is determined to interfere in excess of the interference level with the first communication scheme.
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公开(公告)号：US20230384239A1
公开(公告)日：2023-11-30
申请号：US18446837
申请日：2023-08-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Doyoung YOON , Jeongho AHN , Dongryul LEE , Dongchul IHM , Chungsam JUN
IPC: G01N21/95 , H01L21/66 , G01N21/88 , G01N21/956
CPC classification number: G01N21/9501 , H01L22/12 , G01N21/8806 , G01N21/956
Abstract: A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.
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3.发明申请METHOD FOR CONTROLLING EXTERNAL ELECTRONIC DEVICE AND ELECTRONIC DEVICE FOR PROCESSING SAME 审中-公开用于控制外部电子器件的方法和用于处理其的电子器件公开(公告)号：US20170006149A1
公开(公告)日：2017-01-05
申请号：US15200332
申请日：2016-07-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Bo-Ram NAMGOONG , Jeongho AHN , Chulkwi KIM , Jin SAGONG
CPC classification number: H04W4/80 , G08C17/02 , H04M1/7253 , H04M1/72572 , H04M1/72577
Abstract: An electronic device and a method for controlling an external electronic device connected to the electronic device through wireless communication are provided herein. A first electronic device includes a communication module configured to communicate with a second electronic device; and a processor configured to, in response to an entry event of a communication restriction mode in which at least one communication function of the first electronic device is deactivated, provide entry information of the communication restriction mode and release information of the communication restriction mode to the second electronic device, and control performance of the communication restriction mode using the entry information and the release information.
Abstract translation: 本文提供了一种通过无线通信来控制连接到电子设备的外部电子设备的电子设备和方法。 第一电子设备包括被配置为与第二电子设备通信的通信模块; 以及处理器，被配置为响应于通信限制模式的入口事件，其中第一电子设备的至少一个通信功能被去激活，将通信限制模式的输入信息和通信限制模式的释放信息提供给 第二电子设备，以及使用条目信息和发布信息来控制通信限制模式的性能。
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公开(公告)号：US20240036118A1
公开(公告)日：2024-02-01
申请号：US18199571
申请日：2023-05-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyutae KIM , SungHyun YOON , Jonghoon KIM , Sanguk KWON , Jeongho AHN
IPC: G01R31/392 , G01R31/36 , G01R31/367 , G01R31/374
CPC classification number: G01R31/392 , G01R31/3648 , G01R31/367 , G01R31/374
Abstract: A battery risk assessment device for a battery module including a plurality of battery cells, including a data measurement unit configured to generate sensing data corresponding to the battery module, wherein the sensing data include cell voltage data comprising voltage information about the plurality of battery cells, cell temperature data comprising temperature information about the plurality of battery cells, module voltage data comprising information about a voltage output from the battery module, and module current data comprising information about a current output from the battery module; a deviation calculator configured to: calculate diffusion resistance data of the plurality of battery cells by using a Thevenin equivalent circuit of the battery module, and calculate deviation information based on the sensing data and the diffusion resistance data, wherein the deviation information indicates at least one from among a voltage deviation of the plurality of battery cells, a temperature deviation of the plurality of battery cells, and a diffusion resistance deviation of the plurality of battery cells; and a risk assessment unit configured to determine a battery risk state based on the deviation information.
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公开(公告)号：US20230332954A1
公开(公告)日：2023-10-19
申请号：US18102514
申请日：2023-01-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyeongcheol LEE , Minsu KIM , Jeongho AHN
CPC classification number: G01J3/2823 , H04N25/71 , G01N21/8806 , G01J3/0291 , G01N21/956
Abstract: An apparatus for inspecting and measuring a semiconductor device includes a stage on which an object to be measured is provided, a detector configured to detect a spectral image from light reflected from the object to be measured, and a processor configured to generate a spectral matrix based on the spectral image detected by the detector, wherein detector includes a time delayed integration (TDI) sensor configured to detect the spectral image based on a TDI process.
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Patent Agency Ranking
公开(公告)号：US20230236649A1
公开(公告)日：2023-07-27
申请号：US18159986
申请日：2023-01-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jeongho AHN
IPC: G06F1/3212
CPC classification number: G06F1/3212
Abstract: An electronic device is provided. The electronic device includes a memory, a battery, a speaker, a communication module, and at least one processor electrically connected to the memory, the battery, the speaker, and the communication module, wherein the at least one processor is configured to receive information indicating a wearing position from an external electronic device, and determine, based on the information indicating the wearing position of the external electronic device, whether to operate as a primary device among multiple electronic devices.
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公开(公告)号：US20170067833A1
公开(公告)日：2017-03-09
申请号：US15203317
申请日：2016-07-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seongsil LEE , Jeongho AHN
CPC classification number: G01N21/8806 , G01N21/956 , G01N2201/0636
Abstract: A substrate inspection apparatus may include a light source, which is configured to emit an incident light. The substrate inspection apparatus may further include a support, a detector, and a light adjuster. The supporting base configured to support a substrate, the detector configured to detect a defect on the substrate, and the light adjuster configured to allow the incident light to be reflected. The detector may be configured to collect a scattering signal. The scattering signal is generated from an optical interaction between an evanescent wave and the defect on the substrate, and to detect the defect. The evanescent wave may be generated when the incident light is totally and/or substantially reflected by the light adjuster.
Abstract translation: 基板检查装置可以包括被配置为发射入射光的光源。 基板检查装置还可以包括支撑件，检测器和光调节器。 所述支撑基座被配置为支撑基板，所述检测器被配置为检测所述基板上的缺陷，以及所述光调节器被配置为允许所述入射光被反射。 检测器可以被配置成收集散射信号。 散射信号是从湮灭波与基板上的缺陷之间的光学相互作用产生的，并且用于检测缺陷。 当入射光完全和/或基本上被光调节器反射时，可以产生ev逝波。
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公开(公告)号：US20250147560A1
公开(公告)日：2025-05-08
申请号：US19002262
申请日：2024-12-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Chungsoon PARK , Junghyun KANG , Hyohoon SHIN , Jeongho AHN , Heeyoung YUN , Jonggwang JANG , Dongheon JANG
Abstract: Provided is an electronic device including a motor housing. The electronic device including at least one heat generating element may include a printed board assembly on which the heat generating element is disposed; a battery; a battery support frame configured to support the battery therein; and a motor disposed between the printed board assembly and the battery support frame. The motor may include a motor housing including a first surface configured to directly or indirectly contact the printed board assembly and to receive a heat of the heat generating element from the printed board assembly, and a second surface configured to directly or indirectly contact the battery support frame and to transfer a heat of the heat generating element to the battery support frame.
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公开(公告)号：US20240284621A1
公开(公告)日：2024-08-22
申请号：US18443913
申请日：2024-02-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Chungsoon PARK , Jeongho AHN , Bareum PARK , Yangji JEON
CPC classification number: H05K5/0273 , H05K1/0219 , H05K1/111 , H05K5/003 , H05K2201/10037 , H05K2201/10098
Abstract: According to an embodiment of the disclosure, an electronic device may include: a housing, a printed circuit board disposed in the housing, the printed circuit board including a wireless communication module comprising communication circuitry, a radio frequency switch, a first electronic component comprising circuitry, and a second electronic component, comprising circuitry, electrically connected to the radio frequency switch, and a shield can disposed on the printed circuit board to cover at least a partial area of the printed circuit board and including multiple pads in contact with the printed circuit board, and an antenna module, comprising at least one antenna, configured to transmit and/or receive signals and/or power between external electronic devices using at least part of the housing and at least part of the shield can, wherein the multiple pads include a first pad electrically connected to the radio frequency switch and a second pad electrically connected to the first electronic component, the multiple pads are configured to be electrically isolated from the printed circuit board, and the radio frequency switch is configured to select one of a first path configured to cause the antenna module to have a first radiation efficiency based on a signal of a first frequency band provided from the wireless communication module being applied to the first path, and a second path configured to cause the antenna module to have a second radiation efficiency different from the first radiation efficiency based on a signal of the first frequency band being applied to the second path, and is connected to the second electrical component.
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公开(公告)号：US20230123710A1
公开(公告)日：2023-04-20
申请号：US17501318
申请日：2021-10-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Doyoung YOON , Jeongho AHN , Dongryul LEE , Dongchul IHM , Chungsam JUN
IPC: G01N21/95 , G01N21/956 , G01N21/88 , H01L21/66
Abstract: A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.
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