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公开(公告)号:US09665678B2
公开(公告)日:2017-05-30
申请号:US14744178
申请日:2015-06-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sung-we Cho , Dal-hee Lee , Ha-young Kim , Jae-woo Seo , Jin-tae Kim
IPC: G06F17/50
CPC classification number: G06F17/5072 , G06F17/505
Abstract: A method of designing an integrated circuit includes a processor receiving input data initially-defining the integrated circuit using a plurality of first standard cells designed to optimize a performance or yield characteristic. The processor substitutes at least one second standard cell designed to optimize a different performance or yield characteristic from that for which the first standard cells were optimized for a corresponding one of the first standard cells. The processor generates output data defining the integrated circuit including the second standard cell. The substituted second standard cell has the same function as the corresponding first standard cell for which it was substituted.
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2.
公开(公告)号:US20170116366A1
公开(公告)日:2017-04-27
申请号:US15236654
申请日:2016-08-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jae-woo Seo , Dal-hee Lee
CPC classification number: H01L27/0207 , G06F17/5018 , G06F17/5068 , G06F17/5081 , H01L27/11582 , H01L27/118 , H01L28/00
Abstract: An engineering change order (ECO) base cell and an integrated circuit (IC) including the ECO base cell are provided. The IC includes a plurality of standard cells and at least one engineering change order (ECO) base cell. The ECO base cell has a layout that is generated based on a layout of a functional cell corresponding to a first circuit including a plurality of logic gates.
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公开(公告)号:US10651201B2
公开(公告)日:2020-05-12
申请号:US15913530
申请日:2018-03-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ha-young Kim , Chang-beom Kim , Hyun-jeong Roh , Tae-joong Song , Dal-hee Lee , Sung-we Cho
IPC: H01L27/118 , H01L27/02
Abstract: An integrated circuit includes a first conductive pattern in a first conductive layer, a second conductive pattern in a second conductive layer over the first conductive layer, and a via electrically connected with the first conductive pattern and the second conductive pattern to allow a first current flowing from the first conductive pattern to the second conductive pattern and a second current flowing from the second conductive pattern to the first conductive pattern to pass through at different times. The via is placed on the first conductive pattern so that a path of the first current does not overlap with a path of the second current in the first conductive pattern.
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公开(公告)号:US20160034627A1
公开(公告)日:2016-02-04
申请号:US14744178
申请日:2015-06-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sung-we Cho , Dal-hee Lee , Ha-young Kim , Jae-woo Seo , Jin-tae Kim
IPC: G06F17/50
CPC classification number: G06F17/5072 , G06F17/505
Abstract: A method of designing an integrated circuit includes a processor receiving input data initially-defining the integrated circuit using a plurality of first standard cells designed to optimize a performance or yield characteristic. The processor substitutes at least one second standard cell designed to optimize a different performance or yield characteristic from that for which the first standard cells were optimized for a corresponding one of the first standard cells. The processor generates output data defining the integrated circuit including the second standard cell. The substituted second standard cell has the same function as the corresponding first standard cell for which it was substituted.
Abstract translation: 一种设计集成电路的方法包括处理器,其使用设计成优化性能或产量特性的多个第一标准单元接收初始定义集成电路的输入数据。 处理器替代至少一个设计用于优化不同性能或产量特性的第二标准单元,其中针对第一标准单元对应的第一标准单元优化第一标准单元。 处理器产生定义包括第二标准单元的集成电路的输出数据。 取代的第二标准单元具有与其被替代的相应的第一标准单元相同的功能。
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公开(公告)号:US20200235126A1
公开(公告)日:2020-07-23
申请号:US16842867
申请日:2020-04-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ha-young KIM , Chang-beom Kim , Hyun-jeong Roh , Tae-joong Song , Dal-hee Lee , Sung-we Cho
IPC: H01L27/118 , H01L27/02
Abstract: An integrated circuit includes a first conductive pattern in a first conductive layer, a second conductive pattern in a second conductive layer over the first conductive layer, and a via electrically connected with the first conductive pattern and the second conductive pattern to allow a first current flowing from the first conductive pattern to the second conductive pattern and a second current flowing from the second conductive pattern to the first conductive pattern to pass through at different times. The via is placed on the first conductive pattern so that a path of the first current does not overlap with a path of the second current in the first conductive pattern.
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6.
公开(公告)号:US20200051977A1
公开(公告)日:2020-02-13
申请号:US16444252
申请日:2019-06-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jin-young Lim , Jae-ho Park , Sang-hoon Baek , Hyeon-gyu You , Dal-hee Lee
IPC: H01L27/088 , H01L29/06 , H01L23/535
Abstract: Provided is an integrated circuit including: at least one active region extending in a first row in a first direction; at least one active region extending in a second row in the first direction; and a multiple height cell including the at least one active region in the first row, the at least one active region in the second row, at least one gate line extending in a second direction crossing the first direction, wherein each of the at least one active region in the first row and the at least one active region in the second row is terminated by a diffusion break.
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7.
公开(公告)号:US10192860B2
公开(公告)日:2019-01-29
申请号:US15236654
申请日:2016-08-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jae-woo Seo , Dal-hee Lee
IPC: G06F17/50 , H01L27/00 , H01L27/02 , H01L27/118 , H01L27/11582
Abstract: An engineering change order (ECO) base cell and an integrated circuit (IC) including the ECO base cell are provided. The IC includes a plurality of standard cells and at least one engineering change order (ECO) base cell. The ECO base cell has a layout that is generated based on a layout of a functional cell corresponding to a first circuit including a plurality of logic gates.
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公开(公告)号:US11189639B2
公开(公告)日:2021-11-30
申请号:US16842867
申请日:2020-04-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ha-young Kim , Chang-beom Kim , Hyun-jeong Roh , Tae-joong Song , Dal-hee Lee , Sung-we Cho
IPC: H01L27/118 , H01L27/02
Abstract: An integrated circuit includes a first conductive pattern in a first conductive layer, a second conductive pattern in a second conductive layer over the first conductive layer, and a via electrically connected with the first conductive pattern and the second conductive pattern to allow a first current flowing from the first conductive pattern to the second conductive pattern and a second current flowing from the second conductive pattern to the first conductive pattern to pass through at different times. The via is placed on the first conductive pattern so that a path of the first current does not overlap with a path of the second current in the first conductive pattern.
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9.
公开(公告)号:US11101267B2
公开(公告)日:2021-08-24
申请号:US16444252
申请日:2019-06-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jin-young Lim , Jae-ho Park , Sang-hoon Baek , Hyeon-gyu You , Dal-hee Lee
IPC: H01L27/088 , H01L23/535 , H01L29/06 , H01L27/092 , H01L27/02 , H01L21/8234 , H02M7/00
Abstract: Provided is an integrated circuit including: at least one active region extending in a first row in a first direction; at least one active region extending in a second row in the first direction; and a multiple height cell including the at least one active region in the first row, the at least one active region in the second row, at least one gate line extending in a second direction crossing the first direction, wherein each of the at least one active region in the first row and the at least one active region in the second row is terminated by a diffusion break.
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公开(公告)号:US10108772B2
公开(公告)日:2018-10-23
申请号:US15271883
申请日:2016-09-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang-hoon Baek , Jae-woo Seo , Gi-young Yang , Dal-hee Lee , Sung-wee Cho
IPC: G06F17/50 , H01L29/66 , H01L23/528 , H01L27/02 , H01L27/088 , H01L21/8234 , H01L21/8238
Abstract: Methods of generating an integrated circuit layout include forming a standard cell by providing a first active area adjacent to a first cell boundary line. The first active area is spaced apart from the first cell boundary line by a first distance. A second active area is provided adjacent to a second cell boundary line. The second cell boundary line opposes the first cell boundary line. The second active area is spaced apart from the second cell boundary line by a second distance. Fins are formed on the first and second active areas. The fins extend in a first direction and parallel to one another in a second direction substantially perpendicular to the first direction. The first cell boundary line is parallel to the fins. The first distance and the second distance remain constant when a number of the fins on the first and second active areas is changed.
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